JPH0329313B2 - - Google Patents

Info

Publication number
JPH0329313B2
JPH0329313B2 JP60085771A JP8577185A JPH0329313B2 JP H0329313 B2 JPH0329313 B2 JP H0329313B2 JP 60085771 A JP60085771 A JP 60085771A JP 8577185 A JP8577185 A JP 8577185A JP H0329313 B2 JPH0329313 B2 JP H0329313B2
Authority
JP
Japan
Prior art keywords
plate
cooling
electronic component
thickness
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60085771A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61244050A (ja
Inventor
Kenji Nishiura
Haruhiko Yamamoto
Yoshiaki Udagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60085771A priority Critical patent/JPS61244050A/ja
Publication of JPS61244050A publication Critical patent/JPS61244050A/ja
Publication of JPH0329313B2 publication Critical patent/JPH0329313B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60085771A 1985-04-22 1985-04-22 電子部品の冷却構造 Granted JPS61244050A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60085771A JPS61244050A (ja) 1985-04-22 1985-04-22 電子部品の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60085771A JPS61244050A (ja) 1985-04-22 1985-04-22 電子部品の冷却構造

Publications (2)

Publication Number Publication Date
JPS61244050A JPS61244050A (ja) 1986-10-30
JPH0329313B2 true JPH0329313B2 (en, 2012) 1991-04-23

Family

ID=13868135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60085771A Granted JPS61244050A (ja) 1985-04-22 1985-04-22 電子部品の冷却構造

Country Status (1)

Country Link
JP (1) JPS61244050A (en, 2012)

Also Published As

Publication number Publication date
JPS61244050A (ja) 1986-10-30

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