JPH0329246B2 - - Google Patents

Info

Publication number
JPH0329246B2
JPH0329246B2 JP22722286A JP22722286A JPH0329246B2 JP H0329246 B2 JPH0329246 B2 JP H0329246B2 JP 22722286 A JP22722286 A JP 22722286A JP 22722286 A JP22722286 A JP 22722286A JP H0329246 B2 JPH0329246 B2 JP H0329246B2
Authority
JP
Japan
Prior art keywords
resin
weight
crosslinking
acrylates
good
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22722286A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6381140A (ja
Inventor
Munehiko Ito
Takaaki Sakamoto
Shuji Maeda
Takahiro Heiuchi
Takayoshi Koseki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP22722286A priority Critical patent/JPS6381140A/ja
Publication of JPS6381140A publication Critical patent/JPS6381140A/ja
Publication of JPH0329246B2 publication Critical patent/JPH0329246B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP22722286A 1986-09-25 1986-09-25 樹脂含浸物の製法 Granted JPS6381140A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22722286A JPS6381140A (ja) 1986-09-25 1986-09-25 樹脂含浸物の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22722286A JPS6381140A (ja) 1986-09-25 1986-09-25 樹脂含浸物の製法

Publications (2)

Publication Number Publication Date
JPS6381140A JPS6381140A (ja) 1988-04-12
JPH0329246B2 true JPH0329246B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-04-23

Family

ID=16857411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22722286A Granted JPS6381140A (ja) 1986-09-25 1986-09-25 樹脂含浸物の製法

Country Status (1)

Country Link
JP (1) JPS6381140A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS6381140A (ja) 1988-04-12

Similar Documents

Publication Publication Date Title
TWI746758B (zh) 樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線板
JP4234346B2 (ja) 熱硬化性樹脂及び積層体
CN111630076B (zh) 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板
CN111886267B (zh) 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板
EP1377638B1 (en) Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board
EP1508594B1 (en) Resin composition and prepreg for laminate and metal-clad laminate
CN111491968B (zh) 聚苯醚树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板
JP2009167268A (ja) 低熱膨張性低誘電損失プリプレグ及びその応用品
JP7281650B2 (ja) 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
CN113518789B (zh) 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板
JPS63159443A (ja) 積層板
JPH03275760A (ja) ポリフェニレンオキサイド系樹脂組成物
JPH0310650B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0329246B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3077550B2 (ja) 積層板の製造方法
JPS62121759A (ja) ポリフエニレンオキサイド系樹脂組成物およびこの樹脂組成物からなるシ−ト
JPS63156835A (ja) 積層板
JPS62148564A (ja) ポリフエニレンオキサイド樹脂組成物
JPS62148565A (ja) ポリフエニレンオキサイド樹脂組成物
JPS62277434A (ja) 積層板の製法
JPS63224941A (ja) プリント配線板材料
JPS63224906A (ja) プリプレグの製法
JPH0641418A (ja) ポリフェニレンオキサイド系樹脂組成物とこれを用いた金属箔張積層板
JPH0562589B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH03166255A (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees