JPH0329246B2 - - Google Patents

Info

Publication number
JPH0329246B2
JPH0329246B2 JP22722286A JP22722286A JPH0329246B2 JP H0329246 B2 JPH0329246 B2 JP H0329246B2 JP 22722286 A JP22722286 A JP 22722286A JP 22722286 A JP22722286 A JP 22722286A JP H0329246 B2 JPH0329246 B2 JP H0329246B2
Authority
JP
Japan
Prior art keywords
resin
weight
crosslinking
acrylates
good
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22722286A
Other languages
Japanese (ja)
Other versions
JPS6381140A (en
Inventor
Munehiko Ito
Takaaki Sakamoto
Shuji Maeda
Takahiro Heiuchi
Takayoshi Koseki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP22722286A priority Critical patent/JPS6381140A/en
Publication of JPS6381140A publication Critical patent/JPS6381140A/en
Publication of JPH0329246B2 publication Critical patent/JPH0329246B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Description

【発明の詳现な説明】[Detailed description of the invention]

〔技術分野〕 この発明は、暹脂含浞物の補法に関する。 〔背景技術〕 ポリプニレンオキサむドは、高呚波特性誘
電特性に優れるなどの理由で、近幎、泚目され
おきおいる。ポリプニレンオキサむドの甚途ず
しおは、皮々あるが、たずえば、電子材料甚途が
ある。 ポリプニレンオキサむドを電子材料甚途に甚
いる堎合、特に、プリント基板などの回路基板に
甚いるこずが考えられる。回路基板は、寞法安定
性、耐熱性、耐溶剀性等の物性向䞊が望たれおい
る。そのため、ポリプニレンオキサむドを架橋
剀、開始剀等ずブレンドし、架橋によ぀お前蚘物
性の向䞊が図られおいる。 たた、たずえば、ガラス基材などず暹脂の耇合
によ぀お、物理的匷床のアツプがなされおいる。
䞀般に、基材ず暹脂の耇合材であるプリプレグに
芁求される性胜ずしおは、暹脂ず基材ずのなじ
み、暹脂の付着性、ボむド等が問題ずされる。し
かしながら、ポリプニレンオキサむドを含んで
いお架橋を行う暹脂組成物は、高分子量の暹脂を
倚く含むため、含浞に適した粘床にしようずする
ず、比范的䜎濃床たずえば、15重量皋床の
溶液しかできない。このような溶液を基材ぞ含浞
させお也燥するこずによりプリプレグを䜜補する
ず、暹脂残留量が少なく、溶剀が蒞発した埌に残
るボむドが芋られる。このようなプリプレグを積
局成圢しおもカスレおしたい、良奜な回路基板が
埗られにくい。たずえば、回路基板の吞氎性、電
気絶瞁性等に問題がしばしば芋られた。 〔発明の目的〕 この発明は、このような事情に鑑みお、暹脂組
成物の含浞が良奜な暹脂含浞物を぀くる方法を提
䟛するこずを目的ずする。 〔発明の開瀺〕 この発明は、䞊蚘の目的を達成するために、ポ
リプニレンオキサむド、架橋性の良い暹脂、架
橋助剀および開始剀を含む暹脂組成物が溶解され
た液を基材に含浞させる工皋を備えた暹脂含浞物
の補法においお、前蚘暹脂組成物が、ポリプニ
レンオキサむド、架橋性の良い暹脂、架橋助剀お
よび開始剀の合蚈100重量䞭、架橋助剀を30〜
80重量含むこずを特城ずする暹脂含浞物の補法
を芁旚ずする。 以䞋に、この発明を詳しく説明する。 この発明で䜿甚される架橋助剀ずしおは、たず
えば、゚ステルアクリレヌト類、゚ポキシアク
リレヌト、りレタンアクリレヌト類、゚ヌテルア
クリレヌト類、メラミンアクリレヌト類、アルキ
ドアクリレヌト類、シリコンアクリレヌト類など
のアクリレヌト類、トリアリルシアヌレヌト、
トリアリルむ゜シアヌレヌト、゚チレングリコヌ
ルゞメタクリレヌト、ゞビニルベンれン、ゞアリ
ルフタレヌトなどの倚官胜モノマ、ビニルトル
゚ン、゚チルビニルベンれン、スチレン、パラメ
チルスチレンなどの単官胜モノマ、倚官胜゚ポ
キシ類、ゞアリルフタレヌトプレポリマヌなど
が挙げられ、それぞれ、単独であるいは぀以䞊
䜵せお甚いられるが、特にこれらに限定される蚳
ではない。 架橋助剀ずしおは、トリアリルシアヌレヌトお
よびトリアリルむ゜シアヌレヌトのいずれかたた
は䞡方を甚いるのが、PPOず盞溶性が良く、基
材ぞの含浞法、架橋性、耐熱性および誘電特性の
面で奜たしいのでよい。トリアリルシアヌレヌト
ずトリアリルむ゜シアヌレヌトずは、化孊構造的
には異性䜓の関係にあり、ほが同様の含浞性、盞
溶性、溶解性、反応性などを有するので、同様
に、いずれか䞀方ず぀たたは䞡方ずもに䜿甚する
こずができる。 たた、架橋助剀ずしお、ゞアリルフタレヌトモ
ノマヌおよびたたはゞアリルフタレヌトプレポ
リマヌを甚いるようにするず、含浞性の面で奜た
しく、コスト的にも有利である。たた、成圢時の
流れが非垞に良く、基材ぞの入り蟌みが良いの
で、ボむドをより少なくするこずが可胜である。
ゞアリルフタレヌトモノマヌは、䞋匏 であらわされ、たずえば、倧阪曹達(æ ª)の「ダツ
プ」などの商品がある。特に限定されないが、こ
の発明で甚いるゞアリルフタレヌトポリマヌは、
分子量䞇〜䞇皋床以䞋のプレポリマヌが奜た
しい。 なお、トリアリルシアヌレヌトおよびトリアリ
ルむ゜シアヌレヌトの少なくずも䞀方ず、ゞアリ
ルフタレヌトおよびゞアリルフタレヌトポリマヌ
の少なくずも䞀方ずを䜵甚するようにしおも良
い。 この発明では、架橋助剀は、ポリプニレンオ
キサむド、架橋性の良い暹脂、架橋助剀および開
始剀の合蚈100重量䞭に、30重量以䞊、80重
量以䞋占めるこずが必芁である。30重量を䞋
回るず、暹脂組成物の溶液を基材に含浞させお溶
剀を蒞発させたあずにボむドが残り、暹脂含浞物
を甚いた積局板、回路基板などの吞氎性、電気絶
瞁性等の䜎䞋が生じる。80重量を䞊回るず、ポ
リプニレンオキサむドが有する良奜な誘電特
性、耐熱性等が劣化する。なお、架橋助剀は、䞊
蚘100重量䞭、30〜66重量であるこずが奜た
しい。 この発明で䜿甚されるポリプニレンオキサむ
ドポリプニレン゚ヌテルずもいう。以䞋、
「PPO」ず蚘すは、たずえば、぀ぎの䞀般匏 〔ここに、は、氎玠たたは炭玠数〜の炭
化氎玠基を衚し、各は、同じであ぀おもよく、
異な぀おもよい。〕 で衚されるものであり、その䞀䟋ずしおは、ポリ
−ゞメチル−−プニレンオキサ
むドが挙げられる。 このようなPPOは、たずえば、USP4059568号
明现曞に開瀺されおいる方法で合成するこずがで
きる。たずえば、−キシレノヌルを、觊媒
の存圚䞋で、酞玠を含む気䜓およびメタノヌルず
酞化カツプリング反応させお、ポリ−ゞ
メチル−−プニレンオキサむドを埗る
方法であるが、この方法に限らない。ここで、觊
媒ずしおは、銅化合物、N′−ゞ−tert
−ブチル゚チレンゞアミン、ブチルゞメチルアミ
ンおよび臭化氎玠を含むものである。メタノヌル
は、これを基準にしお〜15重量の氎を反応混
合系に加え、メタノヌルず氎の合蚈が〜25重量
の重合溶媒ずなるようにしお甚いる。特に限定
するものではないが、たずえば、重量平均分子量
Mwが50000、分子量分垃MwMn4.2Mn
は数平均分子量のポリマが奜たしく䜿甚され
る。 PPOは、誘電率が䜎く、誘電損倱が少ない暹
脂なので、超高呚波領域で䜿甚される回路基板に
適しおいるが、もちろん、その他の呚波数領域で
甚いられおもよい。たた、安䟡である。 架橋性の良い暹脂ずしおは、ずくにこれらに限
定される蚳ではないが、たずえば、−ポリ
ブタゞ゚ン、−ポリブタゞ゚ン、スチレン
ブタゞ゚ンコポリマ、倉性−ポリブタゞ゚
ンマレむン倉性、アクリル倉性、゚ポキシ倉
性、ゎム類などが挙げられ、それぞれ、単独で
たたは぀以䞊䜵せお甚いられる。 架橋性の良い暹脂およびたたは架橋助剀は、
架橋硬化させるこずにより、PPOの特性を
損なわずに耐熱性などを向䞊させるなどのために
甚いられる。これらは、いずれか䞀方のみを甚い
るようにしおもよいし、䜵甚するようにしおもよ
いが、䜵甚するほうが、より特性改善に効果があ
る。 このほか、暹脂組成物には、普通、開始剀が甚
いられる。開始剀ずしおは、ゞクミルパヌオキサ
むド、tert−ブチルクミルパヌオキサむド、ゞ−
tert−ブチルパヌオキサむド、−ゞメチル
−−ゞ−tert−ブチルパヌオキシヘキ
シン−−ゞメチル−−ゞ−
tert−ブチルパヌオキシヘキサン、αα′−
ビスtert−ブチルパヌオキシ−−む゜プロピ
ルベンれン〔たたは−ビス
tert−ブチルパヌオキシむ゜プロピルベンれ
ンずもいう〕などの過酞化物、過酞化物ではない
が、垂販の開始剀ずしおは、䞋匏 であらわされる日本油脂(æ ª)のビスクミルなどがあ
げられ、それぞれ、単独でたたは぀以䞊䜵せお
甚いられるが、これらに限定されない。ビスクミ
ルは、分半枛枩床330℃である。 以䞊の原材料の配合割合は、特に限定されない
が、PPO80〜100重量郚に察し、架橋性の良い暹
脂を20〜40重量郚、架橋助剀を40〜130重量郚、
開始剀を0.5〜重量郚の割合ずするのが奜たし
い。たた、特に限定されないが、架橋助剀重量
郚に察し、架橋性の良い暹脂を20重量郚以䞋の割
合で甚いるのが奜たしい。 含浞甚の基材であるが、玙・ガラス繊維・合成
繊維などの䞍織垃たたは織垃、ガラス垃、合成暹
脂垃、玙などが挙げられるが、特に限定はしな
い。ガラス垃が、コスト、性胜面から奜たしい。 暹脂組成物が溶解された液を調補する方法は、
特に限定はない。たずえば、PPO、架橋性の良
い暹脂、架橋助剀および開始剀を含む暹脂組成物
たたはその原材料を、所望の配合割合で溶剀溶
媒に入れ、デむスパヌ等の撹拌装眮を甚いお完
党に溶解させる方法がある。ただし、架橋助剀
が、PPO、架橋性の良い暹脂、架橋助剀および
開始剀の合蚈100重量䞭、30〜80重量の割合
で含たれおいるようにする。溶液の粘床は、基材
ぞの含浞を考えた堎合、架橋助剀ずしお、トリア
リルシアヌレヌトおよびトリアリルむ゜シアヌレ
ヌトの少なくずも䞀方を甚いたずきには50〜
600cPの範囲が奜たしく、架橋助剀ずしお、ゞア
リルフタレヌトモノマヌおよびゞアリルフタレヌ
トポリマヌの少なくずも䞀方を甚いたずきには
600〜1500cPの範囲が奜たしく、たた、架橋助剀
ずしお、トリアリルシアヌレヌトおよびトリアリ
ルむ゜シアヌレヌトの少なくずも䞀方ず、ゞアリ
ルフタレヌトモノマヌおよびゞアリルフタレヌト
ポリマヌの少なくずも䞀方ずを䜵甚したずきには
前蚘䞡範囲の䞭間が奜たしい。暹脂組成物の濃床
は、20〜35重量が奜たしい。粘床が前蚘各範囲
の䞋限を䞋回るず、基材ぞの付着量が足りずに成
圢埌かすれるこずがあり、前蚘各範囲の䞊限を䞊
回るず、基材ぞの含浞が十分でなく成圢埌かすれ
たりバリが出るこずがある。暹脂組成物の濃床が
20重量を䞋回るず、基材ぞの付着量が枛少しお
成圢埌に癜化するこずがあり、35重量を䞊回る
ず、溶液の安定性が悪くなり、粘床の䞊昇が著し
くな぀お含浞できなくなるこずがある。 䞊蚘溶剀ずしおは、トリクロロ゚チレン、トリ
クロロ゚タン、クロロホルム、塩化メチレン、テ
トラクロロ゚チレン、クロロベンれンなどのハロ
ゲン化炭化氎玠、ベンれン、トル゚ン、キシレン
などの芳銙族炭化氎玠、アセトン、四塩化炭玠な
どがあり、特にトリクロロ゚チレンが奜たしく、
これらをそれぞれ単独でたたは぀以䞊混合しお
甚いるこずができるが、これらに限定されない。 含浞の方法に぀いおは、暹脂組成物が溶解され
た液を基材に塗垃するこずにより行う方法、基材
を暹脂組成物が溶解された液に浞挬するこずによ
り行う方法など、特に限定しない。含浞時間は、
〜60秒くらいが奜たしい。含浞の埌衚面に぀い
た溶液をかきずるたずえば、ガラス棒で陀去す
るのが良い。その埌、也燥を行い、暹脂含浞物
プリプレグを埗る。也燥は圓然ながら、溶剀
の皮類により異なるが、50〜60℃の䜎枩で数分間
也燥させたのち、甚いた溶剀の沞点以䞊でさらに
数分間也燥させるのが奜たしい。たずえば、溶剀
ずしおトリクロロ゚チレンを甚いる堎合、50℃で
分間、90℃で分間、150℃で分間の条件で
也燥しお暹脂含浞物を埗る。也燥を行う堎合、単
に也燥させるだけでもよく、たた、半硬化させお
いわゆるステヌゞにしおもよい。䞊蚘のように
しお埗られた暹脂含浞物は、含浞時の暹脂溶液濃
床が高くか぀粘床が比范的䜎いために、基材内の
隙間にたで十分に溶液が行きわた぀おおり、ボむ
ドの少ないものである。たた、䞊蚘のようにし
お、暹脂含浞物を䜜補すれば、暹脂を溶融させな
くおもよいので、比范的䜎枩で容易に行える。暹
脂含浞物の暹脂コンテストは、特に限定はない
が、成圢時のカスレやバリ発生を防ぐずいう点か
ら、30〜60重量ぐらいが奜たしい。 䞊述のようにしお、䜜補した暹脂含浞物の成圢
方法は、特に限定されないが、 所定枚積局し、加圧プレスする方法、 所定枚積局し、その片面たたは䞡面に金属箔
を積局し、加圧プレスする方法、 所定枚枚を含めるを暹脂シヌトず組み
合わせお積局し、加圧プレスする方法、 所定枚枚を含めるを暹脂シヌトず組み
合わせお積局し、その片面たたは䞡面に金属箔
積局しお加圧プレスする方法、 枚の片面たたは䞡面に金属箔を積局しお加
圧プレスする方法、 など皮々ある。加圧プレスの条件は特に限定さ
れないが、160〜300℃、20〜150Kgcm2が奜たし
く、220℃皋床で100Kgcm2、30分間皋床がより奜
たしい。加圧プレスず同時に、たたは、加圧プレ
スの埌に、架橋を行う。架橋は、甚いた開始剀が
加熱によりラゞカルを発生するものである堎合に
は加熱により、玫倖線照射によりラゞカルを発生
するものである堎合には玫倖線照射により行われ
る。あるいは、攟射線照射により架橋を行぀おも
よい。䞊蚘のようにしお埗られた積局板など成圢
品は、暹脂含浞物の暹脂成分䞭、䜎分子量の架橋
助剀が倚いこずから、加熱圧締時の暹脂流れがよ
く、ボむドが少なく、吞氎性、電気絶瞁性の優れ
たものずなる。 なお、PPOによ぀お誘電特性も良奜なものず
なり、たた、架橋によ぀お寞法安定性、耐熱性、
耐溶剀性が優れた積局板ずなる。 回路ずなる導䜓局ずしおは、銅箔、アルミニり
ム箔等の金属箔が甚いられる。金属箔は、接着衚
面が平滑でか぀導電性の良いものが、誘電性を良
奜にする䞊で奜たしい。たたは、蒞着などにより
導䜓局を圢成しおもよく、その他、サブトラクテ
むブ法、アデむテむブ法フルアデむテむブ法、
セミアデむテむブ法などにより所望の導䜓回
路、電極などずしお圢成しおもよく、特に限定
はない。 なお、回路基板は、リゞツド板、フレキシブル
板のいずれでも良い。 ぀ぎに、実斜䟋および比范䟋を説明するが、こ
の発明は、実斜䟋に限定されない。 実斜䟋  の枛圧装眮付反応噚に、PPOを100、ス
チレンブタゞ゚ンコポリマ旭化成工業(æ ª)のタフ
プレン20、トリアリルむ゜シアヌレヌト
日本化成(æ ª)のTAIC40、ゞアリルフタレヌ
ト倧阪曹達(æ ª)のダむ゜ヌダツプ40、およ
び、ゞクミルパヌオキサむドを加え、さら
に、トリクロロ゚チレン500を加えお、均䞀溶
液になるたで充分撹拌した。埗られた溶液の暹脂
組成物濃床および粘床を第衚に瀺した。 ぀ぎに、この溶液䞭に、厚み100Όのガラス
垃を玄15秒間浞挬しおから取り出し、バヌコヌタ
ヌで衚面をかきず぀た。これを50℃で分間、90
℃で分間、150℃で分間の条件で也燥しお、
プリプレグを枚埗た。 ぀ぎに、18Ό厚の銅箔、前蚘プリプレグ
枚、18Όの銅箔の順に積局し、220℃、100Kg
cm2の条件で30分間プレスしお積局板を埗た。この
積局板の物性を第衚に瀺した。 実斜䟋 〜 実斜䟋においお、暹脂組成物の配合および溶
剀の量をそれぞれ第衚に瀺すように倉えた以倖
は、実斜䟋ず同様にしお積局板を埗た。各含浞
液および各積局板の物性を第衚に瀺した。 なお、実斜䟋で甚いたゞアリルフタレヌトポ
リマヌは分子量玄5000〜10000であ぀た。
[Technical Field] This invention relates to a method for producing a resin-impregnated product. [Background Art] Polyphenylene oxide has attracted attention in recent years due to its excellent high frequency properties (dielectric properties). There are various uses for polyphenylene oxide, and for example, there are uses for electronic materials. When polyphenylene oxide is used for electronic material applications, it can be particularly considered to be used for circuit boards such as printed circuit boards. Circuit boards are desired to have improved physical properties such as dimensional stability, heat resistance, and solvent resistance. Therefore, polyphenylene oxide is blended with a crosslinking agent, an initiator, etc., and the above-mentioned physical properties are improved by crosslinking. Further, physical strength has been increased by, for example, combining a glass base material with a resin.
In general, the performance required of a prepreg, which is a composite material of a base material and a resin, includes problems such as compatibility between the resin and the base material, adhesion of the resin, and voids. However, since crosslinking resin compositions containing polyphenylene oxide contain a large amount of high molecular weight resin, it is difficult to achieve a viscosity suitable for impregnation at a relatively low concentration (for example, about 15% by weight). Only solutions can be produced. When a prepreg is produced by impregnating a base material with such a solution and drying it, the amount of resin remaining is small and voids that remain after the solvent evaporates are observed. Even when such prepregs are laminated and molded, they tend to fade, making it difficult to obtain a good circuit board. For example, problems were often found in the water absorption, electrical insulation, etc. of circuit boards. [Object of the Invention] In view of the above circumstances, an object of the present invention is to provide a method for producing a resin-impregnated material that is well impregnated with a resin composition. [Disclosure of the Invention] In order to achieve the above object, the present invention impregnates a base material with a liquid in which a resin composition containing polyphenylene oxide, a resin with good crosslinking properties, a crosslinking aid, and an initiator is dissolved. In the method for producing a resin-impregnated product, the resin composition contains 30 to 30% of the crosslinking aid in 100% by weight of the total of polyphenylene oxide, a resin with good crosslinkability, a crosslinking aid, and an initiator.
The gist is a method for producing a resin-impregnated product characterized by containing 80% by weight. This invention will be explained in detail below. Examples of the crosslinking aid used in this invention include ester acrylates, epoxy acrylates, urethane acrylates, ether acrylates, melamine acrylates, alkyd acrylates, acrylates such as silicone acrylates, triallyl cyanurate,
Polyfunctional monomers such as triallyl isocyanurate, ethylene glycol dimethacrylate, divinylbenzene, diallyl phthalate, monofunctional monomers such as vinyltoluene, ethylvinylbenzene, styrene, paramethylstyrene, polyfunctional epoxies, diallyl phthalate prepolymers, etc. Each of them may be used alone or in combination of two or more, but the invention is not particularly limited to these. As a crosslinking aid, it is recommended to use either or both of triallyl cyanurate and triallyl isocyanurate because they have good compatibility with PPO and are effective in terms of impregnating the base material, crosslinking property, heat resistance, and dielectric properties. It's good because it's preferable. Triallyl cyanurate and triallyl isocyanurate are chemically structurally isomers and have almost the same impregnating properties, compatibility, solubility, reactivity, etc., so either one can be used individually. Or both can be used. Furthermore, it is preferable to use a diallyl phthalate monomer and/or a diallyl phthalate prepolymer as a crosslinking aid in terms of impregnating properties and is also advantageous in terms of cost. Furthermore, since the molding material flows very well during molding and penetrates into the base material well, it is possible to further reduce voids.
The diallyl phthalate monomer has the following formula For example, there are products such as ``Datsupu'' by Osaka Soda Co., Ltd. Although not particularly limited, diallylphthalate polymers used in this invention include:
A prepolymer having a molecular weight of about 50,000 to 60,000 or less is preferred. Note that at least one of triallyl cyanurate and triallyl isocyanurate and at least one of diallyl phthalate and diallyl phthalate polymer may be used in combination. In this invention, it is necessary that the crosslinking auxiliary agent accounts for 30% by weight or more and 80% by weight or less of the total 100% by weight of the polyphenylene oxide, the resin with good crosslinkability, the crosslinking auxiliary agent, and the initiator. If it is less than 30% by weight, voids will remain after the base material is impregnated with a solution of the resin composition and the solvent is evaporated, resulting in poor water absorption, electrical insulation, etc. of laminates, circuit boards, etc. using the resin impregnated material. A decrease in If it exceeds 80% by weight, the good dielectric properties, heat resistance, etc. of polyphenylene oxide will deteriorate. Note that the amount of the crosslinking aid is preferably 30 to 66% by weight out of the above 100% by weight. Polyphenylene oxide (also referred to as polyphenylene ether) used in this invention.Hereinafter,
``PPO'') is, for example, the following general formula: [Here, R represents hydrogen or a hydrocarbon group having 1 to 3 carbon atoms, and each R may be the same,
May be different. ] An example thereof is poly(2,6-dimethyl-1,4-phenylene oxide). Such PPO can be synthesized, for example, by the method disclosed in USP 4,059,568. For example, poly(2,6-dimethyl-1,4-phenylene oxide) is obtained by subjecting 2,6-xylenol to an oxidative coupling reaction with an oxygen-containing gas and methanol in the presence of a catalyst. , but is not limited to this method. Here, as a catalyst, a copper() compound, N,N'-di-tert
- Contains butylethylenediamine, butyldimethylamine and hydrogen bromide. Based on methanol, 2 to 15% by weight of water is added to the reaction mixture system, so that the total amount of methanol and water is 5 to 25% by weight as a polymerization solvent. For example, the weight average molecular weight (Mw) is 50000, the molecular weight distribution Mw/Mn=4.2 (Mn
(number average molecular weight) is preferably used. PPO is a resin with a low dielectric constant and low dielectric loss, so it is suitable for circuit boards used in ultra-high frequency ranges, but it may of course be used in other frequency ranges. It is also inexpensive. Examples of resins with good crosslinking properties include, but are not limited to, 1,2-polybutadiene, 1,4-polybutadiene, styrene-butadiene copolymer, modified 1,2-polybutadiene (malein-modified, acrylic-modified, (epoxy-modified), rubbers, etc., and each may be used alone or in combination of two or more. Resins with good crosslinking properties and/or crosslinking aids are
By crosslinking (curing) it, it is used to improve heat resistance etc. without impairing the properties of PPO. These may be used alone or in combination, but their combined use is more effective in improving characteristics. In addition, an initiator is usually used in the resin composition. As an initiator, dicumyl peroxide, tert-butylcumyl peroxide, dicumyl peroxide,
tert-butyl peroxide, 2,5-dimethyl-2,5-di-(tert-butylperoxy)hexyne-3,2,5-dimethyl-2,5-di-
(tert-butylperoxy)hexane, α,α′-
Peroxides such as bis(tert-butylperoxy-m-isopropyl)benzene [also referred to as 1,4 (or 1,3)-bis(tert-butylperoxyisopropyl)benzene], but not peroxides, As a commercially available initiator, the following formula Examples include Biscumil from NOF Co., Ltd., which is expressed by NOF Corporation, and each can be used alone or in combination of two or more, but is not limited thereto. Bisque mill has a one-minute half-life temperature of 330°C. The mixing ratio of the above raw materials is not particularly limited, but to 80 to 100 parts by weight of PPO, 20 to 40 parts by weight of a resin with good crosslinking properties, 40 to 130 parts by weight of a crosslinking aid,
Preferably, the proportion of initiator is from 0.5 to 5 parts by weight. Further, although not particularly limited, it is preferable to use a resin with good crosslinking properties in a ratio of 20 parts by weight or less per 1 part by weight of the crosslinking aid. Substrates for impregnation include, but are not particularly limited to, nonwoven or woven fabrics such as paper, glass fibers, and synthetic fibers, glass cloth, synthetic resin cloth, and paper. Glass cloth is preferable in terms of cost and performance. The method for preparing the liquid in which the resin composition is dissolved is as follows:
There are no particular limitations. For example, a resin composition containing PPO, a resin with good crosslinking properties, a crosslinking aid, and an initiator or its raw materials are placed in a solvent (solvent) at the desired blending ratio, and completely dissolved using a stirring device such as a disper. There is a way. However, the crosslinking aid should be contained in a proportion of 30 to 80% by weight out of the total 100% by weight of PPO, resin with good crosslinkability, crosslinking aid, and initiator. When considering impregnation into the base material, the viscosity of the solution is 50 to 50 when at least one of triallyl cyanurate and triallyl isocyanurate is used as a crosslinking auxiliary agent.
A range of 600 cP is preferable, and when at least one of a diallyl phthalate monomer and a diallyl phthalate polymer is used as a crosslinking aid,
A range of 600 to 1500 cP is preferable, and when at least one of triallyl cyanurate and triallyl isocyanurate and at least one of a diallyl phthalate monomer and a diallyl phthalate polymer are used together as a crosslinking auxiliary agent, a range between the above two ranges is preferable. preferable. The concentration of the resin composition is preferably 20 to 35% by weight. If the viscosity is below the lower limit of each of the above ranges, the amount of adhesion to the base material may be insufficient and the product may become blurred after molding.If the viscosity exceeds the upper limit of each of the above ranges, the amount of adhesion to the base material may be insufficient and the product may become blurry after molding. Burrs may appear. The concentration of the resin composition is
If it is less than 20% by weight, the amount adhered to the base material may decrease and whitening may occur after molding, and if it exceeds 35% by weight, the stability of the solution will deteriorate and the viscosity will increase significantly, making impregnation impossible. Sometimes. Examples of the above-mentioned solvent include halogenated hydrocarbons such as trichloroethylene, trichloroethane, chloroform, methylene chloride, tetrachloroethylene, and chlorobenzene, aromatic hydrocarbons such as benzene, toluene, and xylene, acetone, and carbon tetrachloride, and trichloroethylene is particularly preferred.
These can be used alone or in combination of two or more, but are not limited thereto. The method of impregnation is not particularly limited, such as a method of applying a liquid in which the resin composition is dissolved to the substrate, a method of immersing the substrate in a liquid in which the resin composition is dissolved, etc. The impregnation time is
About 5 to 60 seconds is preferable. After impregnation, it is best to scrape off the solution adhering to the surface (for example, with a glass rod). Thereafter, drying is performed to obtain a resin-impregnated product (prepreg). Although drying naturally varies depending on the type of solvent, it is preferable to dry at a low temperature of 50 to 60° C. for several minutes, and then dry for several minutes at a temperature higher than the boiling point of the solvent used. For example, when trichlorethylene is used as a solvent, a resin-impregnated product is obtained by drying at 50°C for 5 minutes, 90°C for 5 minutes, and 150°C for 5 minutes. When drying, it may be simply dried, or it may be semi-cured to a so-called B stage. The resin-impregnated product obtained as described above has a high resin solution concentration and a relatively low viscosity during impregnation, so the solution is sufficiently distributed into the gaps within the base material and has few voids. It is. Moreover, if the resin-impregnated material is produced as described above, the resin does not need to be melted, so it can be easily carried out at a relatively low temperature. The resin content of the resin-impregnated product is not particularly limited, but it is preferably about 30 to 60% by weight in order to prevent scratches and burrs from forming during molding. The method for molding the resin-impregnated product produced as described above is not particularly limited, but may include a method of laminating a predetermined number of sheets and pressing under pressure; A method of pressing, a method of laminating a specified number of sheets (including one sheet) in combination with a resin sheet, and pressing it under pressure, a method of laminating a specified number of sheets (including one sheet) in combination with a resin sheet, and placing metal on one or both sides of the sheet. There are various methods, such as a method of laminating metal foils and pressing them under pressure, and a method of laminating metal foils on one or both sides of a sheet and pressing them under pressure. Pressure pressing conditions are not particularly limited, but are preferably 160 to 300°C and 20 to 150 kg/cm 2 , more preferably about 220°C, 100 kg/cm 2 for about 30 minutes. Crosslinking is performed simultaneously with or after pressure pressing. Crosslinking is carried out by heating when the initiator used generates radicals upon heating, and by irradiation with ultraviolet rays when the initiator used generates radicals upon irradiation with ultraviolet rays. Alternatively, crosslinking may be performed by radiation irradiation. Molded products such as laminates obtained as described above contain a large amount of low molecular weight crosslinking aid in the resin component of the resin impregnated material, so the resin flows well during heat pressing, has few voids, and has good water absorption. , it has excellent electrical insulation properties. In addition, PPO provides good dielectric properties, and crosslinking improves dimensional stability, heat resistance,
The result is a laminate with excellent solvent resistance. Metal foils such as copper foils and aluminum foils are used as the conductor layers that form the circuit. It is preferable that the metal foil has a smooth adhesion surface and good conductivity in order to improve dielectric properties. Alternatively, the conductor layer may be formed by vapor deposition, etc. In addition, there are other methods such as subtractive method, additive method (full additive method, etc.).
It may be formed into a desired conductor (circuit, electrode, etc.) by a semi-destructive method, etc., and is not particularly limited. Note that the circuit board may be either a rigid board or a flexible board. Next, Examples and Comparative Examples will be described, but the present invention is not limited to the Examples. (Example 1) In the reactor equipped with a pressure reduction device in step 2, 100 g of PPO, 20 g of styrene-butadiene copolymer (Tuffrene A from Asahi Kasei Corporation), 40 g of triallyl isocyanurate (TAIC from Nippon Kasei Co., Ltd.), and diallyl phthalate were added. 40 g of Daisodap A from Osaka Soda Co., Ltd. and 4 g of dicumyl peroxide were added, followed by 500 g of trichlorethylene, and the mixture was thoroughly stirred until a homogeneous solution was obtained. Table 1 shows the resin composition concentration and viscosity of the obtained solution. Next, a glass cloth with a thickness of 100 Όm was immersed in this solution for about 15 seconds, then taken out, and the surface was scraped with a bar coater. This was heated to 50°C for 5 minutes at 90°C.
Dry at ℃ for 5 minutes and 150℃ for 5 minutes.
I got 5 pieces of prepreg. Next, 18 ÎŒm thick copper foil, the prepreg 5
220℃, 100Kg/18ÎŒm copper foil
A laminate was obtained by pressing for 30 minutes at cm2 . The physical properties of this laminate are shown in Table 1. (Examples 2 to 8) A laminate was obtained in the same manner as in Example 1, except that the formulation of the resin composition and the amount of solvent were changed as shown in Table 1. Table 1 shows the physical properties of each impregnating liquid and each laminate. The diallyl phthalate polymer used in Example 6 had a molecular weight of about 5,000 to 10,000.

【衚】【table】

【衚】 架橋助剀の重量

※
[Table] Weight of crosslinking aid

*=

Claims (1)

【特蚱請求の範囲】  ポリプニレンオキサむド、架橋性の良い暹
脂、架橋助剀および開始剀を含む暹脂組成物が溶
解された液を基材に含浞させる工皋を備えた暹脂
含浞物の補法においお、前蚘暹脂組成物が、ポリ
プニレンオキサむド、架橋性の良い暹脂、架橋
助剀および開始剀の合蚈100重量䞭、架橋助剀
を30〜80重量含むこずを特城ずする暹脂含浞物
の補法。  架橋助剀が、゚ステルアクリレヌト類、゚ポ
キシアクリレヌト類、りレタンアクリレヌト類、
゚ヌテルアクリレヌト類、メラミンアクリレヌト
類、アルキドアクリレヌト類、シリコンアクリレ
ヌト類、トリアリルシアヌレヌト、トリアリルむ
゜シアヌレヌト、゚チレングリコヌルゞメタクリ
レヌト、ゞビニルベンれン、ゞアリルフタレヌ
ト、ビニルトル゚ン、゚チルビニルベンれン、ス
チレン、パラメチルスチレン、倚官胜゚ポキシ類
およびゞアリルフタレヌトプレポリマヌからなる
矀の䞭から遞ばれた少なくずも皮である特蚱請
求の範囲第項蚘茉の暹脂含浞物の補法。  架橋性の良い暹脂が、−ポリブタゞ゚
ン、−ポリブタゞ゚ン、スチレンブタゞ゚
ンコポリマ、倉性−ポリブタゞ゚ン、ゎム
類からなる矀の䞭から遞ばれた少なくずも皮で
ある特蚱請求の範囲第項たたは第項蚘茉の暹
脂含浞物の補法。  暹脂組成物が、ポリプニレンオキサむドを
80〜100重量郚、架橋性の良い暹脂を20〜40重量
郚、架橋助剀を40〜130重量郚、開始剀を0.5〜
重量郚の割合でそれぞれ含む特蚱請求の範囲第
項ないし第項のいずれかに蚘茉の暹脂含浞物の
補法。
[Scope of Claims] 1. A method for producing a resin-impregnated product comprising a step of impregnating a base material with a solution in which a resin composition containing polyphenylene oxide, a resin with good crosslinking properties, a crosslinking aid, and an initiator is dissolved. , wherein the resin composition contains 30 to 80% by weight of a crosslinking auxiliary agent out of a total of 100% by weight of polyphenylene oxide, a resin with good crosslinkability, a crosslinking auxiliary agent, and an initiator. Manufacturing method. 2 The crosslinking aid is ester acrylates, epoxy acrylates, urethane acrylates,
Ether acrylates, melamine acrylates, alkyd acrylates, silicone acrylates, triallyl cyanurate, triallyl isocyanurate, ethylene glycol dimethacrylate, divinylbenzene, diallyl phthalate, vinyltoluene, ethylvinylbenzene, styrene, paramethylstyrene, The method for producing a resin-impregnated product according to claim 1, which is at least one selected from the group consisting of polyfunctional epoxies and diallyl phthalate prepolymers. 3. A patent claim in which the resin with good crosslinking properties is at least one selected from the group consisting of 1,2-polybutadiene, 1,4-polybutadiene, styrene-butadiene copolymer, modified 1,2-polybutadiene, and rubbers. A method for producing a resin-impregnated product according to item 1 or 2. 4 The resin composition contains polyphenylene oxide.
80 to 100 parts by weight, 20 to 40 parts by weight of a resin with good crosslinking properties, 40 to 130 parts by weight of a crosslinking aid, and 0.5 to 5 parts by weight of an initiator.
Claim 1 containing each in the proportion of parts by weight
A method for producing a resin-impregnated product according to any one of Items 1 to 3.
JP22722286A 1986-09-25 1986-09-25 Production of resin-impregnated product Granted JPS6381140A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22722286A JPS6381140A (en) 1986-09-25 1986-09-25 Production of resin-impregnated product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22722286A JPS6381140A (en) 1986-09-25 1986-09-25 Production of resin-impregnated product

Publications (2)

Publication Number Publication Date
JPS6381140A JPS6381140A (en) 1988-04-12
JPH0329246B2 true JPH0329246B2 (en) 1991-04-23

Family

ID=16857411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22722286A Granted JPS6381140A (en) 1986-09-25 1986-09-25 Production of resin-impregnated product

Country Status (1)

Country Link
JP (1) JPS6381140A (en)

Also Published As

Publication number Publication date
JPS6381140A (en) 1988-04-12

Similar Documents

Publication Publication Date Title
TWI746758B (en) Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate and wiring board
JP4234346B2 (en) Thermosetting resin and laminate
EP1377638B1 (en) Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board
EP1508594B1 (en) Resin composition and prepreg for laminate and metal-clad laminate
JP5181221B2 (en) Low thermal expansion low dielectric loss prepreg and its application
JP7316572B2 (en) Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board using the same
JP7217441B2 (en) Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
JP7203386B2 (en) Polyphenylene ether resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board using the same
JP2009029928A (en) Polyphenylene ether resin composition, method for producing modified low molecular weight polyphenylene ether, modified low molecular weight polyphenylene ether, prepreg and laminate
KR20220024148A (en) Resin composition, prepreg, resin-added film, resin-added metal foil, metal clad laminate, and wiring board
WO2020203320A1 (en) Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
JP2003160662A (en) Method of manufacturing polyphenylene oxide, polyphenylene oxide resin composition, prepreg, laminate, printed wiring board and multilayered printed wiring board
JPS63159443A (en) Laminate
JPH03275760A (en) Polyphenylene oxide resin composition and metal-plated laminate board
JP7281650B2 (en) Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board using the same
JPH0310650B2 (en)
JPH0329246B2 (en)
JP3077550B2 (en) Manufacturing method of laminated board
JPS62121759A (en) Polyphenylene oxide resin composition and sheet composed of said resin composition
JPS63156835A (en) Laminated board
JPS62148564A (en) Polyphenylene oxide resin composition
JPS62148565A (en) Polyphenylene oxide resin composition
JPS62277434A (en) Production of laminated sheet
JPS63224941A (en) Printed wiring board material
JPS63224906A (en) Manufacture of prepreg

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees