JPH0328U - - Google Patents
Info
- Publication number
- JPH0328U JPH0328U JP5764489U JP5764489U JPH0328U JP H0328 U JPH0328 U JP H0328U JP 5764489 U JP5764489 U JP 5764489U JP 5764489 U JP5764489 U JP 5764489U JP H0328 U JPH0328 U JP H0328U
- Authority
- JP
- Japan
- Prior art keywords
- support
- support rods
- semiconductor
- semiconductor wafers
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第１図はこの考案に係る第１実施例の半導体装
置製造用治具の側面図、第２図乃至第４図は第１
図の支持棒１の正面図、側面図および一部断面正
面図である。第５図はこの考案第２実施例の治具
の側面図である。第６図および第７図は従来の半
導体装置製造用治具の平面図および側面図である
。
１…支持棒、１ａ…凹部、１ｂ…溝、２…側板
、２ａ…大径半導体ウエーハ用の空孔部、２ｂ…
小径半導体ウエーハ用の空孔部、３…大径半導体
ウエーハ、４…小径半導体ウエーハ。
FIG. 1 is a side view of a semiconductor device manufacturing jig according to the first embodiment of this invention, and FIGS.
FIG. 2 is a front view, a side view, and a partially sectional front view of the support rod 1 shown in FIG. FIG. 5 is a side view of the jig of the second embodiment of this invention. 6 and 7 are a plan view and a side view of a conventional semiconductor device manufacturing jig. DESCRIPTION OF SYMBOLS 1... Support rod, 1a... Recessed part, 1b... Groove, 2... Side plate, 2a... Hole part for large diameter semiconductor wafer, 2b...
Hole portion for small diameter semiconductor wafer, 3... large diameter semiconductor wafer, 4... small diameter semiconductor wafer.
Claims (1)
ーハの熱処理の際、半導体ウエーハを所定間隔で
整列保持する半導体装置製造用治具において、 半導体ウエーハを支持する溝を有し、両端に凹
部を設けた複数個の支持棒と、その支持棒の凹部
と半導体ウエーハ径に応じて組み合わされる複数
個の空孔部を設け、支持棒を並行状にささえる２
個の側板とから構成されることを特徴とする半導
体装置製造用治具。[Claim for Utility Model Registration] A jig for semiconductor device manufacturing that holds semiconductor wafers aligned at predetermined intervals during heat treatment of semiconductor wafers in a furnace core tube heated by a heater, which has grooves to support semiconductor wafers. A plurality of support rods having recesses at both ends and a plurality of holes combined with the recesses of the support rods according to the diameter of the semiconductor wafer are provided to support the support rods in parallel.
1. A jig for manufacturing a semiconductor device, comprising: a side plate;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5764489U JPH0328U (en) | 1989-05-18 | 1989-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5764489U JPH0328U (en) | 1989-05-18 | 1989-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328U true JPH0328U (en) | 1991-01-07 |
Family
ID=31582540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5764489U Pending JPH0328U (en) | 1989-05-18 | 1989-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS485913U (en) * | 1971-05-31 | 1973-01-23 | ||
| JPS5631514U (en) * | 1979-08-20 | 1981-03-27 |
-
1989
- 1989-05-18 JP JP5764489U patent/JPH0328U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS485913U (en) * | 1971-05-31 | 1973-01-23 | ||
| JPS5631514U (en) * | 1979-08-20 | 1981-03-27 | ||
| JPS6145122Y2 (en) * | 1979-08-20 | 1986-12-19 |