JPS6426843U - - Google Patents
Info
- Publication number
- JPS6426843U JPS6426843U JP12212387U JP12212387U JPS6426843U JP S6426843 U JPS6426843 U JP S6426843U JP 12212387 U JP12212387 U JP 12212387U JP 12212387 U JP12212387 U JP 12212387U JP S6426843 U JPS6426843 U JP S6426843U
- Authority
- JP
- Japan
- Prior art keywords
- support rods
- wafer
- wafer carrier
- resin material
- presser plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Description
第1図は本考案実施例の図で、そのaは斜視図
、bはウエハ保持状態を示す図、cは平面図、第
2図aとbは従来例斜視図、第3図は従来例の問
題点を示す図である。
第1図において、11はウエハキヤリア、12
は押え板、13aは上部支持棒、13bは下部支
持棒、14は樹脂材部、15は芯棒、16aと1
6bはウエハ保持溝、30はウエハ、を示す。
Fig. 1 is a diagram of an embodiment of the present invention, in which a is a perspective view, b is a view showing a wafer holding state, c is a plan view, Fig. 2 a and b are perspective views of a conventional example, and Fig. 3 is a conventional example. FIG. In FIG. 1, 11 is a wafer carrier; 12 is a wafer carrier;
1 is a presser plate, 13a is an upper support rod, 13b is a lower support rod, 14 is a resin material part, 15 is a core rod, 16a and 1
6b indicates a wafer holding groove, and 30 indicates a wafer.
Claims (1)
で2本は上部に1本は下部に配置された3本の支
持棒13a,13bから成るウエハキヤリア11
において、 樹脂材料製の支持棒13a,13bは断面が先
細の涙滴形のもので樹脂材部14の内部に耐熱製
芯棒15が封入されてなり、 該支持棒13a,13bとそれに形成されたウ
エハ保持溝16a,16bには水平部が設けられ
ることなく、ウエハ30と支持棒13a,13b
とはほぼ点接触をなす構造としたことを特徴とす
るウエハキヤリア。[Claims for Utility Model Registration] A wafer carrier 11 consisting of a pair of opposing presser plates 12 and three support rods 13a and 13b, two of which are disposed on the upper side and one on the lower side between the presser plates 12.
In this, the support rods 13a, 13b made of a resin material have tapered teardrop-shaped cross sections, and a heat-resistant core rod 15 is enclosed inside the resin material part 14, and the support rods 13a, 13b and the support rods 13b formed therein are The wafer holding grooves 16a and 16b are not provided with horizontal parts, and the wafer 30 and the support rods 13a and 13b are
A wafer carrier characterized by a structure that makes almost point contact with the wafer carrier.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12212387U JPS6426843U (en) | 1987-08-11 | 1987-08-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12212387U JPS6426843U (en) | 1987-08-11 | 1987-08-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6426843U true JPS6426843U (en) | 1989-02-15 |
Family
ID=31369754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12212387U Pending JPS6426843U (en) | 1987-08-11 | 1987-08-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6426843U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091413A (en) * | 1998-09-16 | 2000-03-31 | Nec Kagoshima Ltd | Cassette and substrate drying method |
KR20020008949A (en) * | 2000-07-21 | 2002-02-01 | 김광교 | A wafer boat for a semiconductor device fabrication |
-
1987
- 1987-08-11 JP JP12212387U patent/JPS6426843U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091413A (en) * | 1998-09-16 | 2000-03-31 | Nec Kagoshima Ltd | Cassette and substrate drying method |
KR20020008949A (en) * | 2000-07-21 | 2002-02-01 | 김광교 | A wafer boat for a semiconductor device fabrication |
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