JPH01179432U - - Google Patents
Info
- Publication number
- JPH01179432U JPH01179432U JP7630288U JP7630288U JPH01179432U JP H01179432 U JPH01179432 U JP H01179432U JP 7630288 U JP7630288 U JP 7630288U JP 7630288 U JP7630288 U JP 7630288U JP H01179432 U JPH01179432 U JP H01179432U
- Authority
- JP
- Japan
- Prior art keywords
- holding device
- wafer
- support rod
- semiconductor wafer
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図ａ，ｂは本考案の基本構成図で、ａは要
部拡大断面図、ｂは全体断面図である。第２図及
び第３図は本考案の他の実施例に係るウエハ保持
装置を示す斜視図である。第４図ａ，ｂは従来技
術に係るウエハ保持装置で、ａは横断面図、ｂは
縦断面図である。第５図は他の従来技術に係るウ
エハ保持装置を示す断面図である。
Ａ：ウエハ、１ａ，１ｂ：支持棒、２：ウエハ
保持溝、３，３１，３２：小突起状部材。
FIGS. 1a and 1b are basic configuration diagrams of the present invention, where a is an enlarged sectional view of the main part and b is an overall sectional view. 2 and 3 are perspective views showing a wafer holding device according to another embodiment of the present invention. FIGS. 4a and 4b show a wafer holding device according to the prior art, in which a is a cross-sectional view and b is a vertical cross-sectional view. FIG. 5 is a sectional view showing another conventional wafer holding device. A: wafer, 1a, 1b: support rod, 2: wafer holding groove, 3, 31, 32: small protruding member.
Claims (1)
持棒を含み、該支持棒のうち一又は複数本の支持
棒のウエハと対面する周面上の少なくともウエハ
保持位置と対応する部位に、前記支持棒より小な
る断面形状の小突起状部材を溶着し、該小突起状
部材上にウエハ保持溝を刻設した事を特徴とする
半導体ウエハ保持装置。 ２ 前記小突起状部材が支持棒より小径の軸状部
材又は球状部材である請求項１）記載の半導体ウ
エハ保持装置。 ３ 前記小突起状部材が支持棒の軸方向に沿つて
断続的又は連続的に形成されている請求項１）記
載の半導体ウエハ保持装置。[Claims for Utility Model Registration] 1. Includes a plurality of support rods extending parallel to each other at a predetermined interval, at least the wafer on the circumferential surface of one or more of the support rods facing the wafer. A semiconductor wafer holding device characterized in that a small protrusion-like member having a smaller cross-section than the support rod is welded to a portion corresponding to the holding position, and a wafer-holding groove is carved on the small protrusion-like member. 2. The semiconductor wafer holding device according to claim 1, wherein the small projection-like member is a shaft-like member or a spherical member having a diameter smaller than that of the support rod. 3. The semiconductor wafer holding device according to claim 1, wherein the small projection-like members are formed intermittently or continuously along the axial direction of the support rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7630288U JPH01179432U (en) | 1988-06-10 | 1988-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7630288U JPH01179432U (en) | 1988-06-10 | 1988-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01179432U true JPH01179432U (en) | 1989-12-22 |
Family
ID=31301335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7630288U Pending JPH01179432U (en) | 1988-06-10 | 1988-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01179432U (en) |
-
1988
- 1988-06-10 JP JP7630288U patent/JPH01179432U/ja active Pending