JPH03285411A - Manufacture of container for ultrasonic solid-state delay element - Google Patents
Manufacture of container for ultrasonic solid-state delay elementInfo
- Publication number
- JPH03285411A JPH03285411A JP8700190A JP8700190A JPH03285411A JP H03285411 A JPH03285411 A JP H03285411A JP 8700190 A JP8700190 A JP 8700190A JP 8700190 A JP8700190 A JP 8700190A JP H03285411 A JPH03285411 A JP H03285411A
- Authority
- JP
- Japan
- Prior art keywords
- container
- terminals
- plating
- terminal part
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000007747 plating Methods 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 abstract description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 abstract description 2
- 238000007772 electroless plating Methods 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
く本発明の目的〉
Ｌ産業上の利用分野］
本発明は、超音波固体遅延子用容器を低コストで製造出
来る製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION OBJECTS OF THE INVENTION Field of Industrial Application The present invention relates to a method of manufacturing a container for an ultrasonic solid retarder at low cost.
［従来の技術Ｊ
従来より超音波固体遅延子の容器は、プラスチックケー
スを成形して行なわれている。この際に金属端子を植設
するため射出成形していた。しかしこのような金属端子
をインサートするには、製造コストがかかる。すなわち
人手を用いた成形であるため手間がかかっていた。[Prior Art J] Conventionally, containers for ultrasonic solid retardators have been made by molding plastic cases. At this time, injection molding was performed to implant metal terminals. However, inserting such metal terminals requires manufacturing costs. In other words, the molding was done manually, which was time-consuming.
Ｆ発明が解決しようとする課題〕
従来の容器では、金ｇ端子が１本１本ばらばらになって
いるので、成形の際に金属端子を１本１本配列して確認
しながら金型にセットし射出成形しているため、工数が
かかり、製造コストが高くつく欠点がある。そこで端子
を組にして端子の配列に時間がかからない容器の製造方
法が求められている。[Problems to be solved by the invention F] In conventional containers, the metal terminals are separated one by one, so during molding, the metal terminals are arranged one by one and set in the mold while checking. Since it is injection molded, it requires a lot of man-hours and has the disadvantage of high manufacturing costs. Therefore, there is a need for a method of manufacturing a container that does not require time to assemble terminals and arrange the terminals.
Ｌ本発明の目的〕
本発明は、前述した欠点を除去し、コストの安い容器を
提供することを目的としている。LObject of the present invention] The present invention aims to eliminate the above-mentioned drawbacks and provide a container at low cost.
く本発明の構成〉
【課題を解決する手段〕
そこで本発明では、予め端子部分をプラスチックで成形
し、後で容器全体を成形し、端子部分はメッキが可能な
プラスチックを使用しておくことにより、容器全体にメ
ッキをかける上端子部分のみに導電パターンが形成出来
る。このようにすることにより容器と同様端子もプラス
チックで出来る。[Structure of the present invention] [Means for solving the problem] Therefore, in the present invention, the terminal portion is molded in advance from plastic, the entire container is molded afterwards, and the terminal portion is made of plastic that can be plated. , a conductive pattern can be formed only on the upper terminal portion where the entire container is plated. By doing this, the terminal as well as the container can be made of plastic.
［実施例］
第１図は、本発明の実施例を示す端子部分１の斜視図で
ある。３本の端子２と端子間を結ぶ端子接続部３とから
構成され、プラスチック（樹脂）から成り、ここでは後
でメッキが可能な材料を使用している。このような材料
は、液晶ポリマー等と呼ばれているが、メッキがかかる
プラスチック（樹脂）材料であればどのようなプラスチ
ック（樹脂）でもよい。[Embodiment] FIG. 1 is a perspective view of a terminal portion 1 showing an embodiment of the present invention. It is composed of three terminals 2 and a terminal connection part 3 that connects the terminals, and is made of plastic (resin), using a material that can be plated later. Such a material is called a liquid crystal polymer or the like, but any plastic (resin) material that can be plated may be used.
このように成形された端子部分ｌは、次に容器４を形成
するため、インサート成形するための金型に入れられ、
射出成形により端子部分１と一体化して容器４が形成さ
れる。第２図は、容器の断面図である。射出成形により
端子部分１を埋め込む形で形成されている。ここで端子
部分１以外の容器にはメッキを出来ないプラスチック（
樹脂）を用いられている。そして容器４を成形後、無電
解メッキをかけることにより容器内の端子部分の露出し
ている部分のみにメッキ５がかかり、また容器より突き
出した部分でもメッキ可能な樹脂であるためメッキがか
かる。The terminal portion l thus formed is then placed in a mold for insert molding in order to form the container 4.
The container 4 is formed integrally with the terminal portion 1 by injection molding. FIG. 2 is a cross-sectional view of the container. It is formed by injection molding so that the terminal portion 1 is embedded. Here, the container other than terminal part 1 is made of plastic that cannot be plated (
resin) is used. After molding the container 4, electroless plating is applied to apply the plating 5 only to the exposed terminal portions inside the container, and also to the portions protruding from the container because the resin is plateable.
第３図は、本発明による容器の斜視図である。FIG. 3 is a perspective view of a container according to the invention.
第３図に示すように外部端子として導出することが出来
る。内蔵する超音波固体遅延素子６は、周知の通りガラ
ス媒体の１辺または２辺を切り欠き、その切り欠き部に
両面に電極を形成した圧電セラミック等のトランスジュ
ーサ７を貼り付はトランスジューサの電極にリード線を
ハンダ付けして容器の端子部分に接続する。第３図では
リード線は省略している。なお本実施例では、メッキと
して銅メッキ上にニッケルメッキを施し、さらにハンダ
メッキを施している。もちろん無電解メ・νキであれば
他の金属や複数の金属を多層構造として行なってもよい
。As shown in FIG. 3, it can be led out as an external terminal. As is well known, the built-in ultrasonic solid state delay element 6 is constructed by cutting out one or two sides of a glass medium, and pasting a transducer 7 made of piezoelectric ceramic or the like with electrodes formed on both sides in the cutout. Solder the lead wire and connect it to the terminal part of the container. Lead wires are omitted in FIG. In this embodiment, nickel plating is applied on copper plating, and further solder plating is applied. Of course, as long as it is an electroless method, other metals or a multilayer structure of a plurality of metals may be used.
なお容器に超音波固体遅延素子を載置し、端子にリード
付けした後、容器上面にフタを載せ加熱して熱融着封止
するか、超音波ウェルドを行なってもよく、またフィル
ムを熱融着等で封止してもよい。あるいは、容器に溝や
孔を設けておき、蒼に突起を設けておき、はめ合わせて
封止する方法でもよい。After placing the ultrasonic solid delay element in a container and attaching leads to the terminals, a lid may be placed on the top of the container and heated to seal it by heat fusion, or ultrasonic welding may be performed. It may be sealed by fusion or the like. Alternatively, a method may be used in which a groove or a hole is provided in the container, a protrusion is provided in the blue part, and the containers are fitted and sealed.
本発明は、従来の１本１本の金属端子をインサート成形
することに比べ端子部分をリードフレームのように一体
的に取扱うことが出来るため、容器を成形する際に手間
が減り、製造コストを安価にすることが出来る。Compared to the conventional insert molding of individual metal terminals, the present invention allows the terminal portion to be handled as an integral part like a lead frame, which reduces labor when molding the container and reduces manufacturing costs. It can be made cheap.
く本発明の効果〉
本発明によって、端子部分を複数本の端子をまとめて一
体化し、端子部分を容器に埋め込み、しかる後にメッキ
加工により導電性を持たせており、成形時の製造コスト
を逓減することが出来た。Effects of the Invention> According to the present invention, the terminal part is integrated into a plurality of terminals, embedded in the container, and then made conductive by plating, which reduces the manufacturing cost during molding. I was able to do it.
第１図は本発明で用いられる端子部分の斜視図、第２図
は本発明による容器の断面図、第３図は本発明による容
器の斜視図である。
１・・・・・・・・・端子部分、
２・・・・・・・・・端子、
３・・・・・・・・・端子Ｊｉ１続部、４・・・・・・
・・・容器、
５・・・・・・・・・メッキ層FIG. 1 is a perspective view of a terminal portion used in the present invention, FIG. 2 is a sectional view of a container according to the invention, and FIG. 3 is a perspective view of a container according to the invention. 1...Terminal part, 2...Terminal, 3...Terminal Ji1 connection part, 4...
・・・Container, 5・・・・・・・・・Plating layer
Claims (1)
り、各端子相互間を結合して成形する工程と、該複数本
の端子を包囲し、超音波固体固体遅延素子を収容する第
２の樹脂により形成する工程と、該複数本の端子にメッ
キを施す工程によりなる超音波固体遅延子用容器の製造
方法。a process of bonding and molding the terminals using a platingable first resin forming a plurality of terminals; and a second process surrounding the plurality of terminals and accommodating the ultrasonic solid-state delay element. A method of manufacturing a container for an ultrasonic solid retarder, which comprises a step of forming the container from a resin and a step of plating the plurality of terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8700190A JPH03285411A (en) | 1990-03-31 | 1990-03-31 | Manufacture of container for ultrasonic solid-state delay element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8700190A JPH03285411A (en) | 1990-03-31 | 1990-03-31 | Manufacture of container for ultrasonic solid-state delay element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03285411A true JPH03285411A (en) | 1991-12-16 |
Family
ID=13902646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8700190A Pending JPH03285411A (en) | 1990-03-31 | 1990-03-31 | Manufacture of container for ultrasonic solid-state delay element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03285411A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006236206A (en) * | 2005-02-28 | 2006-09-07 | Power Digital Card Co Ltd | Method for manufacturing memory card |
-
1990
- 1990-03-31 JP JP8700190A patent/JPH03285411A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006236206A (en) * | 2005-02-28 | 2006-09-07 | Power Digital Card Co Ltd | Method for manufacturing memory card |
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