JPH03278587A - Metal base metal-foiled laminated board - Google Patents
Metal base metal-foiled laminated boardInfo
- Publication number
- JPH03278587A JPH03278587A JP7953290A JP7953290A JPH03278587A JP H03278587 A JPH03278587 A JP H03278587A JP 7953290 A JP7953290 A JP 7953290A JP 7953290 A JP7953290 A JP 7953290A JP H03278587 A JPH03278587 A JP H03278587A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal substrate
- metal foil
- clad laminate
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 34
- 239000002184 metal Substances 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000010953 base metal Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052725 zinc Inorganic materials 0.000 abstract description 5
- 239000011701 zinc Substances 0.000 abstract description 5
- 238000005507 spraying Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 239000007921 spray Substances 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- -1 zinc and tin Chemical class 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、印刷配線板として使用される金属基板をベー
スとする金属箔張り積層板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a metal foil-clad laminate based on a metal substrate used as a printed circuit board.
従来の技術
金属基板をベースとする金属箔張り積層板は、金属基板
と金属箔の接着一体化にプリプレグを用いている。シー
ト状基材に熱硬化性樹脂を含浸乾燥したプリプレグを、
金属基板と金属箔の間に介在させて加熱加圧するのであ
る。金属基板の接着面には、ブラスト処理を施してその
表面を粗化し、接着強度を高めている。Conventional technology A metal foil-clad laminate based on a metal substrate uses prepreg to bond and integrate the metal substrate and the metal foil. Prepreg is a sheet-like base material impregnated with thermosetting resin and dried.
It is placed between the metal substrate and the metal foil and heated and pressurized. The bonding surface of the metal substrate is subjected to a blasting process to roughen the surface and increase bond strength.
発明が解決しようとする課題
上記金属箔張り積層板では、金属基板の粗化面が吸湿し
やすく劣化する惧れがある。また、上記プリプレグの層
は、加熱加圧により絶縁層となるのであるが、高熱の処
理を受けると、この絶縁層と金属基板の間で剥離を生じ
る問題があった。Problems to be Solved by the Invention In the metal foil-clad laminate described above, there is a risk that the roughened surface of the metal substrate easily absorbs moisture and deteriorates. Further, the prepreg layer becomes an insulating layer by heating and pressurizing, but when subjected to high heat treatment, there is a problem that peeling occurs between the insulating layer and the metal substrate.
本発明の課題は、上記金属ベース金属箔張り積層板にお
いて、耐湿性の向上と耐熱性の向上を図ることである。An object of the present invention is to improve moisture resistance and heat resistance in the metal base metal foil clad laminate.
課題を解決するための手段
本発明に係る金属ベース金属箔張り積層板は、シート状
基材に熱硬化性樹脂を含浸乾燥したプリプレグを介して
、金属基板と金属箔を加熱加圧により接着一体化したも
のにおいて、金属基板の接着面に、プラズマ溶射被膜を
形成することを特徴とする特
第1図は、その断面図を示したものであるが、金属基板
lに形成されたプラズマ溶射被膜3に、プリプレグの加
熱加圧により形成された絶縁層2を介して、金[Ffi
lが接着一体化されている。Means for Solving the Problems The metal-based metal foil-clad laminate according to the present invention is a sheet-like base material impregnated with a thermosetting resin and dried, and then a metal substrate and a metal foil are bonded together by heat and pressure. Figure 1 shows a cross-sectional view of the plasma sprayed coating formed on the adhesive surface of the metal substrate. 3, gold [Ffi
l is integrated with adhesive.
作用
プラズマ溶射は、不活性ガスの超高温プラズマジェット
中に溶射材料を供給して溶融させ、金属基板に溶射被膜
を形成するものであり、不活性ガス中で行なうので金属
基板をほとんど酸化させない。溶射被膜の金属基板への
密着強度も非常に大きく、通常400〜800kg/c
4に高めることが可能であるので、この処理層の吸湿に
よる劣化を防止できる。Active plasma spraying involves supplying a spraying material into an ultra-high temperature plasma jet of inert gas and melting it to form a sprayed coating on a metal substrate.Since it is carried out in an inert gas, the metal substrate is hardly oxidized. The adhesion strength of the sprayed coating to the metal substrate is also very high, usually 400 to 800 kg/c.
4, it is possible to prevent the treated layer from deteriorating due to moisture absorption.
また、プラズマ溶射被膜の表面は、複雑な凹凸形状を呈
しており、プリプレグで形成された絶縁層のプラズマ溶
射被膜へのアンカー効果が大きい。これにより、加熱処
理を受けたときに、金属基板と絶縁層が剥離するのを防
止しており、耐熱性を高めている。Further, the surface of the plasma sprayed coating has a complicated uneven shape, and the anchoring effect of the insulating layer formed of prepreg to the plasma sprayed coating is large. This prevents the metal substrate and the insulating layer from peeling off when subjected to heat treatment, improving heat resistance.
実施例
本発明の実施に際して用いる溶射の材料は、亜鉛、錫等
の金属、セラミ、り、サーメット等の高融点材料である
。熱硬化性樹脂を含浸乾燥してプリプレグとするシート
状基材は、ガラス繊維の織布や不織布、アラミド繊維の
織布や不織布である。Examples The thermal spraying materials used in carrying out the present invention are metals such as zinc and tin, and high melting point materials such as ceramics, porcelain, and cermets. The sheet-like base material impregnated with a thermosetting resin and dried to form a prepreg is a woven or nonwoven fabric of glass fiber, or a woven fabric or nonwoven fabric of aramid fiber.
実施例1
1 、0 mm Kのアルミニウム板に、プラズマ溶射
により20μm厚の亜鉛の被膜を形成した。その後亜鉛
の溶射被膜表面を脱脂処理した。Example 1 A 20 μm thick zinc coating was formed on a 0 mm K aluminum plate by plasma spraying. Thereafter, the surface of the zinc spray coating was degreased.
別途プリプレグを次のようにして用意した。Separate prepreg was prepared as follows.
ビスフェノール型エポキシ樹脂45重量部、臭素化エポ
キシ樹脂40重量部、フェノールノボラック型エポキシ
樹脂15重量部、ジシアンジアミド3部からなるエポキ
シ樹脂ワニスを調製し、これを0.18mm厚の平織ガ
ラス布に含浸乾燥して樹脂量50重量%のプリプレグと
した。An epoxy resin varnish consisting of 45 parts by weight of bisphenol type epoxy resin, 40 parts by weight of brominated epoxy resin, 15 parts by weight of phenol novolac type epoxy resin, and 3 parts of dicyandiamide was prepared, and a 0.18 mm thick plain-woven glass cloth was impregnated with this and dried. A prepreg with a resin content of 50% by weight was prepared.
上記アルミニウム板のブラズネ溶射面に上記プリプレグ
を1枚介在させて35μm厚銅箔を載置し、これを鏡面
板に挟んで温度170″C1圧力80kg/cdの条件
で60分間成形して、1.2mm厚のアルミニウムベー
ス銅張り積層板とした。A 35 μm thick copper foil was placed on the Blazne sprayed surface of the aluminum plate with one sheet of the prepreg interposed therebetween, and this was sandwiched between mirror plates and molded for 60 minutes at a temperature of 170 cm and a pressure of 80 kg/cd. .2 mm thick aluminum-based copper-clad laminate.
従来例1
アルミニウム板に溶射被膜を形成する代りに、サンドブ
ラストマシンを用いて接着面の表面粗化処理をした。こ
れ以外は、実施例1と同様にして、1.2鴫厚のアルミ
ニウムベース銅張り積層板とした。Conventional Example 1 Instead of forming a thermal spray coating on an aluminum plate, a sandblasting machine was used to roughen the surface of the adhesive surface. Other than this, an aluminum-based copper-clad laminate having a thickness of 1.2 mm was prepared in the same manner as in Example 1.
実施例、従来例の積層板の特性を第1表に示す。Table 1 shows the characteristics of the laminates of the example and the conventional example.
第1表
PC−2:プレッシャークン力−2時間処理発明の効果
第1表は、アルミニウム基板と絶縁層の間の剥離状態を
みたものであるが、本発明に係るものでは、高熱処理で
の剥離が起こりにくい。また、高温の処理(プレッシャ
ークツカー)をした後でも剥離が起こりにくく、耐湿性
に優れていることがわかる。Table 1 PC-2: Pressure force - 2 hour treatment Effect of the invention Table 1 shows the state of peeling between the aluminum substrate and the insulating layer. Peeling is less likely to occur. Furthermore, even after high-temperature treatment (pressure cooker), peeling does not easily occur, and it is found that the film has excellent moisture resistance.
第1図は本発明に係る金属ベース金属箔張り積層板の断
面図である。
1は金属箔、2は絶縁層、3はプラズマ溶射被膜、4は
金属基板FIG. 1 is a sectional view of a metal base metal foil clad laminate according to the present invention. 1 is a metal foil, 2 is an insulating layer, 3 is a plasma sprayed coating, 4 is a metal substrate
Claims (1)
を介して、金属基板と金属箔を加熱加圧により接着一体
化した金属ベース金属箔張り積層板において、 金属基板の接着面にプラズマ溶射被膜が形成されている
ことを特徴とする金属ベース金属箔張り積層板。[Scope of Claim] A metal base metal foil clad laminate in which a metal substrate and metal foil are bonded and integrated by heat and pressure through a prepreg prepared by impregnating a thermosetting resin into a sheet-like base material and drying the metal substrate. A metal-based metal foil-clad laminate characterized by having a plasma sprayed coating formed on the adhesive surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7953290A JPH03278587A (en) | 1990-03-28 | 1990-03-28 | Metal base metal-foiled laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7953290A JPH03278587A (en) | 1990-03-28 | 1990-03-28 | Metal base metal-foiled laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03278587A true JPH03278587A (en) | 1991-12-10 |
Family
ID=13692604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7953290A Pending JPH03278587A (en) | 1990-03-28 | 1990-03-28 | Metal base metal-foiled laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03278587A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100890306B1 (en) * | 2007-01-31 | 2009-03-26 | 삼성전기주식회사 | Process for manufacturing printed circuit board |
WO2011045895A1 (en) * | 2009-10-16 | 2011-04-21 | アイシン精機株式会社 | Composite molded article |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58140191A (en) * | 1982-02-16 | 1983-08-19 | 松下電器産業株式会社 | Board for circuit |
JPS6432654A (en) * | 1987-07-29 | 1989-02-02 | Hitachi Chemical Co Ltd | Substrate for loading semiconductor element |
-
1990
- 1990-03-28 JP JP7953290A patent/JPH03278587A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58140191A (en) * | 1982-02-16 | 1983-08-19 | 松下電器産業株式会社 | Board for circuit |
JPS6432654A (en) * | 1987-07-29 | 1989-02-02 | Hitachi Chemical Co Ltd | Substrate for loading semiconductor element |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100890306B1 (en) * | 2007-01-31 | 2009-03-26 | 삼성전기주식회사 | Process for manufacturing printed circuit board |
WO2011045895A1 (en) * | 2009-10-16 | 2011-04-21 | アイシン精機株式会社 | Composite molded article |
JP4993039B2 (en) * | 2009-10-16 | 2012-08-08 | アイシン精機株式会社 | Composite molded product |
US8518521B2 (en) | 2009-10-16 | 2013-08-27 | Aisin Seiki Kabushiki Kaisha | Composite molded article |
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