JPH03277515A - Cleaning apparatus for mold for resin package of element - Google Patents

Abstract

PURPOSE:To enhance the molding efficiency by cleaning a mold without stopping a molding machine by inputting the number of times of molding bringing the sealing resin bonded to the inner surface of a cavity to reference quantity or more to a control apparatus and supplying a dummy lead frame and a cleaning resin when molding is started to reach the set number of times. CONSTITUTION:The number of times of molding bringing the sealing resin bonded to the inner surface of a cavity 5b to a permitting amount or more is inputted to a control apparatus 12. When molding is started and the number of times of molding reaches the set number of times, a dummy lead frame 1a and a cleaning resin tablet 6a are supplied to a mold 5 in place of a lead frame 1 and a sealing resin tablet 6 to start the molding due to a cleaning resin. Since the black sealing resin on the inner surface of the cavity 5b is allowed to fall by the cleaning resin, the color of the package of the white cleaning resin becomes a gray turbid state. The color of the package is detected by a color sensor 11 and, when the color reaches the signal of a set color, the molding of a regular package is again performed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cleaning device for a mold for resin packaging of an element for packaging an element on a lead frame with resin.

[Prior Art] The transfer molding method, which has been widely used in the past when packaging (sealing) elements with resin, will be described as an example.

In the case of this type of transfer molding, a part of the mold into which a lead frame is inserted is formed on the opposing surfaces of an upper cheese (upper mold) and a lower cheese (lower mold), and an element on the lead frame is formed. A cavity is formed in which a resin package is to be formed, and a pot is formed that communicates with each of these cavities via a gate to melt solid resin supplied from the outside and supply it to the cavity. The one given is used.

[Problems to be Solved by the Invention] However, in the conventional resin package mold described above, as molding is repeated, the sealing resin gradually remains on the inner surface of the cavity, and the surface of the resin after molding becomes Small irregularities will appear on the surface.

For this reason, the inner surface of the cavity is cleaned by periodically supplying a cleaning resin to the mold and supplying a dummy lead frame, which is actually molded with the cleaning resin.

However, in order to replace the cleaning resin with a dummy lead frame, the molding machine must be temporarily stopped and cleaning work must be performed separately, resulting in a problem of poor molding efficiency.

The present invention has been made in view of the above-mentioned circumstances, and provides a mold for resin packaging of elements, which enables continuous cleaning of the mold without stopping the molding machine, etc., thereby improving molding efficiency. The purpose is to provide a mold cleaning device.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a lead frame having an element such as tC in which a cavity is formed around the element to be filled with a resin. Also, a mold in which a pot is formed that communicates with the cavity and heats and melts a solid resin for sealing applied from the outside and supplies it to the cavity, a main rack that stores the lead frame, and a dummy having a dummy element. a rack for storing lead frames; an insert device for taking out a dummy lead frame or lead frame from the sub-rack or the main rack and inserting it into the mold; a resin main rack for storing the solid resin for sealing; A resin sub-rack stores cleaning resins for mold cleaning that have the same shape but different colors as the solid resin for sealing, and a main rack for resin or a sub-rack for resin to take out the solid resin for sealing or cleaning resin. a resin supply device that supplies the resin to the pot of the mold; a color sensor that detects the color of the resin package molded around the element; and a color sensor that detects the color of the resin package molded around the element; Instead, the dummy lead frame and the cleaning resin are supplied to a mold, and a package is molded using the cleaning resin. When the signal detected by the color sensor for this package reaches a predetermined value, the The apparatus further includes a control device that controls the insert device, the resin supply device, etc. so as to supply the lead frame and solid resin for sealing to the mold again instead of the dummy lead frame and cleaning resin.

[Function] In the present invention, the number of times of molding in which the sealing resin adheres to the inner surface of the cavity to exceed a reference amount is determined in advance, and this number of times of molding is input into the control device.

Therefore, when molding starts and the set number of times is reached, the dummy lead frame and cleaning resin are supplied to the mold instead of the lead frame and solid resin for sealing.
Molding using the cleaning resin begins. At this time, the sealing resin on the inner surface of the mold cavity is removed by the cleaning resin, so that the color of the cleaning resin package becomes cloudy due to the sealing resin. The color of this package is detected by a color sensor, and the molding with the cleaning resin is repeated until the detection signal from the color sensor becomes a preset color signal. When the detection signal reaches a preset color signal, the lead frame and solid sealing resin are supplied to the mold again instead of the dummy lead frame and cleaning resin, and a regular package is molded. It becomes like this. Furthermore, when the molding progresses and reaches the preset number of moldings again, a dummy lead frame and cleaning resin will be supplied to the mold instead of the lead frame and solid resin for sealing, and the mold shown above will be formed. Internal cleaning is carried out regularly.

[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 to 4.

In FIG. 1, 1 is a lead frame on which an element such as an IC is boded, and 2 is a main rack that stores the lead frame.

The main rack 2 supports the lead frame in the vertical direction (direction perpendicular to the plane of the paper in Fig. 1) and in the width direction (arrow Y in Fig. 1).
It is possible to store multiple items in one direction), and at one end,
A subrack 2a is provided to accommodate the dummy lead frame Ia. The rack 2a and the main rack 2 are movable together in the direction of arrow Y1, and the lead frame 1 and dummy lead frame la stored inside can be freely carried out by the insert device 3. configured so that it is possible.

The insert device 3 takes out the lead frame 1 or the gummy lead frame Ia from the main rack 2 or the black rack 2a that has come to the take-out position by moving in the direction of the arrow Y] (in this embodiment, the two are taken out in parallel),
First, it is sent to a preheating device 4, where the preheated lead frame l is inserted into a frame recess 5a, which will be described later, in a mold 5.

The insert line A, through which the lead frame 1 and the like taken out from the main rack 2 are inserted into the mold 5 via the preheating device 4, is arranged in a nearly straight line.

The mold 5 shown in FIG. 1 is a plan view of the parting surface of the lower die (lower mold), and as shown in this figure, the lead frame l is precisely fitted to the parting surface. A round-shaped frame! ! Two 7i91E5a are formed in parallel, and a cavity is formed in each frame recess 5a so as to surround the part where the element is located by an upper mold (not shown) whose parting surfaces are aligned and the mold is clamped. 5b is formed. In addition, each frame recess 5a
A circular hole-shaped bot 5c into which a resin tablet (to be described later) is inserted is formed on the center line between the bots, and a gate 5d is formed from each bot 5c to each cavity 5b.

The bot 5c heats and melts the resin tablet and transfers the molten resin to each cavity 5 by raising a transfer (not shown) inserted into the bot 5.
It is designed to be supplied within b.

In addition, in FIG. 1, 6 is a black sealing resin tablet (solid resin for sealing) which is formed into a disk shape or a cylinder shape, and 6a is a sealing resin tablet 6 with a surface. They are white cleaning resin tablets with the same shape. These sealing resin tablets 6 and cleaning resin tablets 6a are stored in a resin main rack 7 and a resin full rack 7a, respectively.

The resin main rack 7 and the resin subrack 7a are
As shown in FIGS. 1 and 2, it is integrally formed, and the whole is movable in the direction of arrow Y2 (see FIG. 1), and the sealing resin tablet 6 and the cleaning resin The tablets 6a are held in a stacked state in a plurality of rows, and each sealing resin tablet 6, etc. is sequentially supplied from the upper end opening by a resin supply device (not shown) by a load R that pushes out from below.
It can be taken out.

The above resin supply device simultaneously receives a plurality (or a single) of the sealing resin tablets 6 and cleaning resin tablets 6a from the resin main rack 7 and the subrack 7a, which have come to the take-out position by moving in the arrow Y2 direction (in this embodiment). (3) The resin is sucked out using a suction disk or the like and moved to the resin preheating device 8, or inserted into the mold 5's bowl 5c from the resin preheating device 8.

A resin supply line B extending from the resin main rack 7 and the resin subrack 7a to the mold 5 via the resin preheating device 8 is substantially orthogonal to the insert line A along which the lead frame 1 is inserted into the mold 5. It is located in
A resin insertion line C for inserting the sealing resin tablet 6 and the like into the mold 5 faces the insert line A.

Further, the lead frame 1 on which the resin pub cage has been molded in the mold 5 is taken out from the carry-out line D which is unidirectional with respect to the insert line A, and after the cull Cu described later is removed by the cull cutting device 9. , is carried out from this molding device.

Further, the mold 5 is sealed from other parts, and a door IO is provided at a position corresponding to the insert line A and the resin insertion line C of the mold 5.

Also, a mold 5 from which the lead frame 1 etc. are carried out after molding.
A color sensor II is provided on the exit side of the lead frame 1 at a position where the color of the resin package molded on the lead frame 1 or the like can be detected. However, this color sensor! In this embodiment, l is provided for the purpose of detecting the color of the cleaning resin package molded on the dummy lead frame la.

As shown in FIGS. 3 and 4, the molded lead frame 1 has an element covered with a resin package S, and a bot 5.
The shape is such that Cu remains in the c part and the gate part G remains in the gate 5d part.

The cull cutting device 9 cuts the gate portion G,
The lead frame 1 is separated into two lead frames 1 again by removing Cu.

In addition, the main rack 2 and the sub rack 2a.

Insert device 3, mold 5, resin main rack 7 and resin subrack 7a, resin supply device (not shown),
The cull cutting device 9, the door 10 of the mold 5, the color sensor 11, etc. are connected to a control device 12, and are each controlled by the control device 12.

When a preset number of moldings is reached, the control device R12 supplies a dummy lead frame la and a cleaning resin tablet 6a to the mold 5 instead of the lead frame I and the sealing resin tablet 6, and supplies the cleaning resin tablet to the mold 5. 6a, and when the signal obtained from the color sensor 11 for this package reaches a predetermined value, the dummy lead frame! The insert device 3, the resin supply device (not shown), etc. are controlled so that the lead frame 1 and the sealing resin tablet 6 are again supplied to the mold 5 instead of the cleaning resin tablet 6a and the cleaning resin tablet 6a. There is.

In the device package molding apparatus configured as described in Section 2, first, the number of moldings is determined in advance until the sealing resin adheres to the inner surface of the cavity 5b and the amount exceeds the allowable amount, and the number of moldings is determined in advance. is manually input to the control device 12.

Then, when molding is started and the number of moldings reaches a preset number, a dummy lead frame Ia and a cleaning resin tablet 6a are supplied to the mold 5 instead of the lead frame 1 and the sealing resin tablet 6, and the cleaning resin is Molding begins. At this time, the cleaning resin removes the black sealing resin on the inner surface of the cavity 5b, so that the white cleaning resin package becomes cloudy gray due to the sealing resin. The color of this package is detected by the color sensor 11, and the supply of the dummy lead frame la and the cleaning resin tablet 6a is continued until the detection signal from the color sensor 11 becomes a preset color signal. When the detection signal reaches a preset color signal, the lead frame 1 and the sealing resin tablet 6 are again supplied to the mold 5 instead of the dummy lead frame 1a and the cleaning resin tablet 6a, and the regular Package molding begins.

Furthermore, when the molding progresses and reaches the preset number of moldings again, the lead frame is removed! Then, instead of the sealing resin tablet 6, a dummy lead frame Ia and a cleaning resin tablet 6a are supplied to the mold 5. As described above, the inside of the mold 5 is cleaned regularly and continuously.

Therefore, according to the above-mentioned apparatus, the inside of the cavity 5b etc. can be cleaned while continuously molding without stopping the molding machine, and the molding efficiency of element sealing can be improved.

In addition, in the above embodiment, the sealing resin tablet 6
Although the mold 5 is provided in which three such objects can be inserted at the same time, the number is not limited to three, and it goes without saying that there may be more such as five, or even one.

Further, although the color sensor II is provided on the unloading side of the lead frame 1 etc. of the mold 5, it is not necessary to limit it to this position. Sometimes, it may be provided so as to be located on a line facing the surface of the cleaning resin package.

[Effects of the Invention] As explained above, according to the present invention, when a lead frame having an element such as an IC is inserted, i.
A cavity is formed around the element q for filling with resin, and a pot is formed that communicates with the cavity and supplies a solid resin for sealing applied from the outside to the cavity by heating and melting it. a mold, a main rack for storing the lead frames listed in iq, a sub-rack for storing the dummy lead frames having dummy elements, and a dummy lead frame or a lead frame taken out from the sub-rack or the main rack and inserted into the mold. an insert device; a resin main rack for storing the solid resin for sealing; ii? 1. A resin subrack that stores cleaning resin for mold cleaning that has the same shape but a different color as the solid resin for sealing, and a solid resin for sealing or cleaning resin from the main rack for resin or the subrack for resin. a resin supply device that takes out the resin and supplies it to the pot of the mold; a color sensor that detects the color of the resin package molded around the element; and a resin supply device that detects the color of the resin package molded around the element; The dummy lead frame and the cleaning resin are supplied to a mold instead of the solid resin, a package is molded using the cleaning resin, and when the signal obtained by the color sensor for this package reaches a predetermined value, the A control device is provided for controlling the insert device, the resin supply device, etc. so as to supply the lead frame and solid resin for sealing to the mold again in place of the dummy lead frame and cleaning resin. Therefore, the inside of the cavity can be cleaned while continuously molding without temporarily stopping the molding machine.

Therefore, there is a remarkable effect that the molding efficiency of element sealing can be improved.

[Brief explanation of drawings]

1 to 4 are diagrams showing one embodiment of the present invention, in which FIG. 1 is a plan view showing the configuration of a resin package molding apparatus for an element, and FIG. 2 is a view taken in the direction of the ■ arrow in FIG. 1. , FIG. 3 is a plan view showing the lead frame after molding the rose cane, and FIG. 4 is a side view of the lead frame. 1...Lead frame, 1a...Dummy lead frame, 2...
Main rack, 2a... Sub rack, 5b... Cavity, 5c... Pot, 6... Resin tablet for sealing (solid resin for sealing) , 6a...Cleaning resin tablet, 7
...Main rack for resin, 7a... Sub-rack for resin, 2... Color sensor 12... Control device.

Claims (1)

[Claims] In a state where a lead frame having an element such as an IC is inserted, a cavity is formed around the element to be filled with resin, and a cavity for sealing is provided from the outside through the cavity. A mold in which a pot is formed to heat and melt solid resin and supply it to the cavity; a main rack for storing the lead frames; a sub-rack for storing dummy lead frames having dummy elements; and the sub-rack or the main rack. an insert device that takes out a dummy lead frame or a lead frame from a rack and inserts it into the mold; a resin main rack that stores the solid resin for sealing; a resin subrack that stores cleaning resin for mold cleaning; a resin supply device that takes out the solid resin for sealing or the cleaning resin from the resin main rack or the resin subrack and supplies it to the pot of the mold; A color sensor detects the color of the resin package molded around the element, and when a preset number of moldings is reached, the dummy lead frame and the cleaning resin are placed in the mold instead of the lead frame and solid resin for sealing. When the signal obtained by the color sensor for this package reaches a predetermined value, a lead frame and a sealing resin are used again in place of the dummy lead frame and cleaning resin. 1. A cleaning device for a mold for a resin package of an element, comprising a control device for controlling the insert device, the resin supply device, etc. so as to supply solid resin to the mold.