JPH03277514A - Cleaning apparatus for mold for resin package of element - Google Patents

Abstract

PURPOSE:To enhance the molding efficiency by cleaning a mold without stopping a molding machine by detecting the amount of the sealing solid resin bonded to the inner surface of a cavity on the basis of the signal from an image sensor and supplying a dummy lead frame and a cleaning resin to the mold when the amount of the resin becomes a reference amount or more. CONSTITUTION:A control apparatus 12 confirms the distribution of the sealing resin on the inner surface of a cavity 5b on the basis of the signal from an image sensor 11 and gives instructions to a main rack 2, a sub-rack 2a, an insert device 3, a main rack for a resin, a sub-rack 7a for a resin and a resin supply apparatus when the distribution of the sealing resin becomes an extent equal to or more than a predetermined standard to supply a dummy lead frame 1a and a cleaning resin tablet 6a to a mold 5 in place of a lead frame 1 and a sealing resin tablet 6. When the range of the sealing resin becomes the standard or less, the lead frame 1 and the sealing resin tablet 6 are again supplied to perform regular molding. The cavity can be cleaned without stopping a molding machine and molding efficiency can be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cleaning device for a mold for resin packaging of an element for packaging an element on a lead frame with resin.

[Prior Art] The transfer molding method, which has been widely used in the past when packaging (sealing) elements with resin, will be described as an example.

In the case of this type of transfer molding, a part of the mold into which a lead frame is inserted is formed on the opposing surfaces of an upper cheese (upper mold) and a lower cheese (lower mold), and an element on the lead frame is formed. Cavities in which a resin package is to be formed are formed, and a boat is connected to each of these cavities through a gate to melt solid resin supplied from the outside and supply it to the cavities. The formed one is used.

[Problems to be Solved by the Invention] However, in the above-mentioned conventional mold for resin packages, as molding is repeated, the sealing resin gradually remains on the inner surface of the cavity, and the resin after coloring deteriorates. Small irregularities will appear on the surface.

For this reason, the inner surface of the cavity is cleaned by periodically supplying a cleaning resin to the mold and supplying a dummy lead frame, which is actually molded with the cleaning resin.

However, in order to replace the cleaning resin with a dummy lead frame, the molding machine must be temporarily stopped and cleaning work must be performed separately, resulting in a problem of poor molding efficiency.

The present invention has been made in view of the above circumstances, and is a method for cleaning molds for resin packages of elements, which can improve molding efficiency by continuously cleaning the molds without stopping the molding machine, etc. The purpose is to provide equipment.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a lead frame having an element such as an IC inserted therein, and a cavity for filling resin around the element is formed. Also, a mold in which a pot is formed that communicates with the cavity and heats and melts a solid resin for sealing applied from the outside and supplies it to the cavity, a main rack that stores the lead frame, and a dummy having a dummy element. a subrack for storing lead frames; an insert device for taking out a dummy lead frame or a lead frame from the subrack or the main rack and inserting it into the mold; a resin main rack for storing the solid resin for sealing; The resin za rack stores cleaning resin for mold cleaning that has the same shape as the solid resin for sealing but has a different color, and the solid resin for sealing or cleaning resin is taken out from the main rack for resin or the sub-rack for resin. a resin supply device that supplies the pot of the mold; an image sensor provided facing the inner surface of the cavity on a line facing the cavity when the mold is opened; and a signal obtained by the image sensor. The fingers of the solid sealing resin attached to the inner surface of the cavity are detected, and the amount of the solid sealing resin is determined as the base IP! a control device that controls the insert device and the resin supply device so as to supply the dummy lead frame and cleaning resin to the mold instead of the lead frame raising and sealing solid resin when the temperature exceeds m; It is equipped with the following.

[Function] In the present invention, when a standard amount or more of the sealing resin adheres to the inner surface of the cavity, a dummy lead frame and a cleaning resin are supplied to the mold, and the inner surface of the cavity is thoroughly cleaned. Then, when the adhesion amount of the sealing resin becomes less than the standard amount, the regular lead frame and the solid sealing resin are supplied to the mold again, and the devices are continuously packaged.

[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 to 4.

In FIG. 1, 1 is a lead frame to which elements such as ICs are bonded, and 2 is a main rack that houses the lead frame.

The main rack 2 supports the lead frame in the vertical direction (direction perpendicular to the plane of the paper in Fig. 1) and in the width direction (arrow Y in Fig. 1).
It is possible to store multiple items in one direction), and at one end,
A subrack 2a is provided to accommodate the dummy lead frame 1a. The black 2a and the main rack 2 are connected to the arrow Y! It is configured to be movable in the force direction and to allow the lead frame l and dummy lead frame la stored therein to be freely carried out by the insert device 3.

The insert device 3 takes out the lead frame I or the dummy lead frame 1a from the main rack 2 or the sub-rack 2a that has come to the take-out position by moving in the direction of arrow Y1 (in this embodiment, the two are taken out in parallel),
First, it is sent to a preheating device 4, where it is preheated and then inserted into four frame parts 5a in a mold 5, which will be described later.

The in-in-note line A, through which the lead frame 1 taken out from the main rack 2 is inserted into the mold 5 via the preheating device 4, is arranged in a substantially straight line.

The mold 5 shown in Fig. 1 is a plan view of the parting surface of the lower die (lower mold), and as shown in this figure, the parting surface has a precision frame. Two frame four parts 5a shaped to fit are formed in parallel, and each frame recess 5a has a parting surface aligned with U=
A cavity 5b is formed by an upper die (not shown) which is clamped with a mold so that the element surrounds the misaligned portion. Further, on the center line between each of the four frame parts 5a, a circular hole-shaped bot 5c is formed into which a resin tablet, which will be described later, is inserted, and a gate 5d leading to each cavity 5b is formed from each bot 5c.

The bot 5c heats and melts the resin tablet and supplies the molten resin into each hole 5b by raising a transfer (not shown) inserted into the bot 5. There is.

Further, in FIG. 1, 6 is a black sealing resin tablet (hard cedar resin for sealing) formed into a disk shape or columnar shape, and 6a is a sealing resin tablet 6 having a shape. It is the same white cleaning resin tablet. These sealing resin tablets 6 and cleaning resin tablets 6a are each stored in a resin main rack 7.
and stored in the resin subrack 7a.

The resin main rack 7 and the resin subrack 7a are
As shown in FIGS. 1 and 2, it is integrally formed, and the whole is movable in the direction of arrow Y2 (see FIG. 1), and the sealing resin tablet 6 and the cleaning resin The tablets 6a are held in a stacked state in a plurality of rows, and the sealing resin tablets 6 and the like are sequentially delivered to the opening at one end by a lot 1 that is pushed out from below.

The sealing resin tablet 6 and the cleaning resin tablet t-6a are moved in the direction of the arrow Y2 to reach the take-out position, and are taken out from the upper end by a resin supply device (not shown). The resin is transported to a resin preheating device 8.

] - The resin supply device moves a plurality of (or a single) sealing resin tablet 6 and cleaning resin tablet 6a by suctioning them simultaneously (three in this embodiment) with a suction disk or the like, The stopping resin tablet 6 and the like are inserted from the resin main rack 7 and the like into the resin preheating device 8, and from the resin preheating device 8 into the bot 5c of the mold 5.

The resin supply line B from the resin main rack 7 and the resin subrack 7a to the mold 5 via the resin preheating device 8 is approximately connected to the insert line A where the lead frame l is inserted into the mold 5. A resin insertion line C, which is arranged perpendicularly to each other and which inserts the sealing resin tablet 6 into the mold 5, faces the insert line 8.

Further, the lead frame 1 having a resin package molded in the mold 5 is taken out from a carry-out line D which is unidirectional with respect to the insert line A.

After the cull described later is removed by the cull cutting device 9, it is carried out from the molding device.

Further, the mold 5 is sealed from other parts, and a door 10 is provided at a position corresponding to the insert line A and the resin insertion line C of the mold 5.

Furthermore, when the mold 5 is opened, the image sensor 2 is provided on a line facing the cavity 5b at a predetermined position, facing toward the inner surface of the cavity 5b.

Image sensor! is designed to recognize the distribution of the sealing resin (black) attached to the inner surface of the cavity 5b.

After molding, the lead frame ■ is covered with a resin package S, as shown in Figures 3 and 4, and is placed in a pot 5.
The shape is such that Cu remains in the 0 part and the gate part G remains in the gate 5d part.

The cull cutting device 9 cuts the gate portion G,
The lead frame 1 is separated into two lead frames 1 again by removing Cu.

In addition, the main rack 2 and the sub rack 2a.

Insert device 3, mold 5, resin main rack 7 and resin subrack 7a, resin supply device (not shown),
Cal cutting device 9, door 10 of mold 5, image sensor 11
etc. are connected to the control device 12, and are each controlled by the control device 12.

The control device I2 recognizes the distribution of the sealing resin (black) on the inner surface of the cavity 5b based on the signal from the image sensor 11, and when the spread exceeds a predetermined standard, the control device I2 detects the distribution of the sealing resin (black) on the inner surface of the cavity 5b. 2a, the insert device 3, the resin main rack 7, the resin subrack 7a, and the resin supply device, the dummy lead frame 1a and the cleaning resin tablet 6a are replaced with the lead frame 1 and the sealing resin tablet 6. is controlled so that it is supplied to the mold 5.

Then, the control device 12 controls the sealing resin until the range of the sealing resin recognized by the image sensor 11 falls below a predetermined standard.
Repeat the molding using the dummy lead frame la and the cleaning resin tablet 6a, and when it becomes below the above standard, replace the dummy lead frame la and the cleaning resin tablet 6a with the lead frame again!
Then, the sealing resin tablet 6 is supplied and controlled to perform regular molding.

In the device package molding apparatus configured as described above, the sealing resin gradually adheres to the inner surface of the cavity 5b, and the range of the sealing resin exceeds a predetermined reference amount set in the control device 12. Then, it's a lead frame! A dummy lead frame la and a cleaning resin tablet 6a are supplied in place of the sealing resin tablet 6, and the inside of the cavity 5b is continuously cleaned. Then, the inside of the cavity 5b is cleaned with the cleaning resin,
The range of sealing resin is 4! When the amount of I becomes below, the lead frame 1 and the sealing resin tablet 6 are again supplied to the mold 5, and normal device velocaging is performed.

Therefore, according to the above-mentioned apparatus, the inside of the cavity 5 and the like can be cleaned while continuously molding without stopping the molding machine, and the molding efficiency of element sealing can be improved.

In addition, in the above embodiment, the sealing resin tablet 6
It goes without saying that the number of molds 5 is not limited to three, and may be more, such as five, or may be one.

[Effects of the Invention] As explained above, according to the present invention, when a lead frame having elements such as 10 is inserted, a cavity for filling resin is formed around the element. , a mold in which a bot is formed that communicates with the cavity and heats and melts a solid resin for sealing applied from the outside and supplies it to the cavity; a main rack that stores the lead frame; and a dummy lead having a dummy element. a subrack for storing frames; an inserting device for taking out a dummy lead frame or a lead frame from the subrack or the main rack and inserting it into the mold; a resin main rack for storing the solid resin for sealing; and a resin main rack for storing the solid resin for sealing; A resin sub-rack stores cleaning resin for mold cleaning that has the same shape as the solid resin for mold cleaning but has a different color, and a solid resin for sealing or cleaning resin is taken out from the main rack for resin or the black for resin and then A resin supply device that supplies a resin to a pot of a mold; an image sensor provided facing the inner surface of the cavity on a line facing the cavity when the mold is opened; and a signal obtained from the image sensor. When the set of the solid sealing resin adhered to the inner surface of the cavity is detected, and the amount of the solid resin for sealing exceeds the reference amount, the dummy lead is removed in place of the lead frame and the solid resin for sealing. Since the molding machine is equipped with a control device that controls the inserter i device and the resin supply device so as to supply the frame and cleaning resin to the mold, the molding machine can be continuously operated without temporarily stopping the molding machine. The inside of the cavity can be cleaned while molding.

Therefore, a remarkable effect is achieved in that the molding efficiency of element sealing can be improved.

[Brief explanation of the drawing]

1 to 4 are diagrams showing one embodiment of the present invention, in which FIG. 1 is a plan view showing the configuration of an element package molding apparatus, FIG. 2 is a view taken in the direction of the ■ arrow in FIG. FIG. 3 is a plan view showing the lead frame after package molding, and FIG. 4 is a side view of the lead frame. l... Lead frame, 1a... Dummy lead frame, 2 Main rack, 2a... The rack, 3... Insert device, 5... Mold, 5b...・Cavity, 5c...Bot]... 6... Resin tablet for sealing (solid resin for sealing), 6a... Cleaning resin tablet)...
7... Main rack for resin, 7a... Sub rack for resin, 11... Image sensor, 12... Control device.

Claims (1)

[Claims] In a state where a lead frame having an element such as an IC is inserted, a cavity is formed around the element to be filled with resin, and a cavity for sealing is provided from the outside through the cavity. A mold in which a pot is formed to heat and melt solid resin and supply it to the cavity; a main rack for storing the lead frames; a sub-rack for storing dummy lead frames having dummy elements; and the sub-rack or the main rack. an insert device that takes out a dummy lead frame or a lead frame from a rack and inserts it into the mold; a resin main rack that stores the solid resin for sealing; a resin subrack that stores cleaning resin for mold cleaning; a resin supply device that takes out the solid resin for sealing or the cleaning resin from the resin main rack or the resin subrack and supplies it to the pot of the mold; An image sensor is provided facing the inner surface of the cavity on a line facing the cavity when the mold is opened, and a signal obtained by this image sensor is used to determine whether the solid resin for sealing has adhered to the inner surface of the cavity. detecting the amount and supplying the dummy lead frame and cleaning resin to the mold instead of the lead frame and the solid resin for sealing when the amount of the solid resin for sealing exceeds a reference amount. A cleaning device for a mold for a resin package of an element, comprising: a control device for controlling the insert device and the resin supply device.