JPH03276653A - Manufacture of tape carrier - Google Patents
Manufacture of tape carrierInfo
- Publication number
- JPH03276653A JPH03276653A JP7353590A JP7353590A JPH03276653A JP H03276653 A JPH03276653 A JP H03276653A JP 7353590 A JP7353590 A JP 7353590A JP 7353590 A JP7353590 A JP 7353590A JP H03276653 A JPH03276653 A JP H03276653A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- resist
- hole
- circuit
- flexible resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 238000005530 etching Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000011888 foil Substances 0.000 claims description 6
- 238000000016 photochemical curing Methods 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 2
- 239000000428 dust Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000012790 adhesive layer Substances 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 229920000728 polyester Polymers 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 2
- 229910000365 copper sulfate Inorganic materials 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000011295 pitch Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000969 carrier Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000013351 cheese Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、半導体装置に用いられるテープキャリアの製
造法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a tape carrier used in a semiconductor device.
［従来の技術］
半導体装置の大部分は、金属状のリードフレームを用い
、ダイポンドとワイヤホントによって、電気的結線を行
なった後、樹脂で封止し、外部リートにＳｎ又は半田メ
ツキした後、リードを所定の形状に曲げ加工して製造し
ている。[Prior Art] Most semiconductor devices use a metal lead frame, which is electrically connected using a die pound and a wire bond, sealed with resin, and plated with Sn or solder on an external lead. It is manufactured by bending the lead into a predetermined shape.
しかしながら、半導体チップでの高集積により入出力数
が著しく増加する一方で、半導体装置の小型化が志向さ
れているため、半導体パッケージの入出力用リードと半
導体チップの入出力用電極のピッチが狭小化している。However, while the number of inputs and outputs has increased significantly due to high integration in semiconductor chips, the trend has been toward miniaturization of semiconductor devices, so the pitch between the input/output leads of semiconductor packages and the input/output electrodes of semiconductor chips has become narrower. It has become
このために、２００〜３００ピン以上の半導体チップで
は、従来のワイヤボンドによる接続方式では限界に至り
、新しい半導体装置の製造法が探索されている。For this reason, for semiconductor chips with 200 to 300 pins or more, the conventional wire bond connection method has reached its limit, and new methods of manufacturing semiconductor devices are being searched for.
上述した状況で、テープキャリアが注目され、半導体装
置への通用が検討されている。In the above-mentioned situation, tape carriers are attracting attention and their application to semiconductor devices is being considered.
第２図は、従来の一般的なテープキャリアの構造を示す
部分断面図である。図において、ポリイミドフィルム、
ポリエステルフィルム等からなる電気絶縁性の可撓性テ
ープ１１には、半導体チップ１２が装入されるデバイス
孔１０が所定のピッチで穿設されており、可撓性テープ
１１の一方の面には、デバイス孔１０間孔部周縁に放射
状に配置されるインナーリード部１３を備えた金属配線
１５が形成されている。このインナーリード部１３は、
図に示される如く、デバイス孔１０開孔部に突き出した
状態となっており、デバイス孔１０内に半導体チップ１
２が装入された状態でインナーリード部１３と半導体チ
ップ＋２のバンブ１４がボンディングされる。FIG. 2 is a partial cross-sectional view showing the structure of a conventional general tape carrier. In the figure, polyimide film,
An electrically insulating flexible tape 11 made of polyester film or the like is provided with device holes 10 into which semiconductor chips 12 are inserted at a predetermined pitch. , metal wiring 15 having inner lead portions 13 arranged radially around the periphery of the device hole 10 is formed. This inner lead part 13 is
As shown in the figure, the device hole 10 is in a state of protruding into the opening, and the semiconductor chip 1 is inside the device hole 10.
In the state in which the semiconductor chip +2 is loaded, the inner lead portion 13 and the bump 14 of the semiconductor chip +2 are bonded.
テープキャリアは、ポリイミド等の可撓性樹脂テープ上
に金属箔て回路形成したものであり、半導体チップとの
接続は、デバイス孔に突出したＳｎやＡｕ被覆したり−
）・と、半導体チップ上の大出力用電極上に形成したＡ
ｕのバンブとを熱圧着して行なわれる。The tape carrier is a circuit formed with metal foil on a flexible resin tape such as polyimide, and the connection with the semiconductor chip is made by coating Sn or Au protruding into the device hole.
) and A formed on the high output electrode on the semiconductor chip.
This is done by thermocompression bonding the bumps of u.
以上のテープキャリアでは薄い金属箔をリートに利用す
るものであり、エツチング加工により狭ピッチ化できる
とともに、ボンディングワイヤに比べてインピーダンス
が小さく、半導体の高速化に好都合とされている。The above-mentioned tape carrier uses thin metal foil for the REET, which can be etched to make the pitch narrower, and has lower impedance than bonding wire, which is said to be advantageous for increasing the speed of semiconductors.
［発明が解決しようとする課題］
また、テープキャリアでのリードにおいて、ピッチを狭
小化するためにはエツチングされる金属膜を薄くする必
要がある。このために、一般的に用いられている接着剤
を用いて可撓性樹脂テープに金属箔を接着する所謂３層
型では強度的に厚さの限度がある。このために接着剤を
用いない所謂２層型のうち金属箔を用いずに可撓性樹脂
テープ上に直接金属を析出させて薄膜したテープキャリ
アかγ１目されている。[Problems to be Solved by the Invention] Furthermore, in order to narrow the pitch in leads in tape carriers, it is necessary to make the metal film to be etched thinner. For this reason, the so-called three-layer type, in which metal foil is bonded to a flexible resin tape using a commonly used adhesive, has a thickness limit in terms of strength. For this reason, among the so-called two-layer type tape carriers that do not use an adhesive, a tape carrier in which a thin film is formed by directly depositing metal on a flexible resin tape without using a metal foil has been developed.
しかしながら、上記テープキャリアでは、金属を析出さ
せて薄膜化するために、金属薄膜の回路形成と共に、可
撓性樹脂テープにもデバイス孔やパイロット孔をエツチ
ングで形成する必要があり、可撓性樹脂テープの通用に
物性のみならず、エツチング処理の可否も選定基準とな
り、使用できる可撓性樹脂テープの種類が限られていた
。However, in the above-mentioned tape carrier, in order to deposit the metal and make it a thin film, it is necessary to form a circuit in the metal thin film and also to form device holes and pilot holes in the flexible resin tape by etching. The types of flexible resin tapes that can be used are limited because the selection criteria is not only the physical properties but also whether or not it can be etched.
本発明は、可撓性樹脂テープのエツチング処理を必要と
せずに、狭小ピッチのテープキャリアを得るテープキャ
リアの製造法を得ることを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a tape carrier that provides a tape carrier with a narrow pitch without requiring etching of a flexible resin tape.
［課題を解決するための手段］
本発明に係るテープキャリアの製造方法では、可撓性樹
脂テープに穿設された半導体装置の装入や半導体装置の
位置決め等の孔を備え、該テープ上に前記半導体装置と
結線する金属箔で形成した回路を備えたテープキャリア
の製造方法において、
可撓性樹脂テープに予め前記半導体装置の装入や半導体
装置の位置決め等の孔を１設し、該穿設された孔を前記
テープの一方の面側から閉塞部材て蒸ぎ、
次いて該蟇がれた孔に前記テープの他方の面側から埋設
材を埋め込み、
その後、前記孔の閉塞部材を除去した後に、該孔に埋設
材を埋め込んた可撓性樹脂テープ状に所望の手法により
金属ｉＭを所定厚さに形成し、次いで該金属薄膜に光硬
化レジストにより回路パターンを描き、次いでエツチン
グにより所定形状の回路を形成した後に、
前記孔の埋設材を除去することを特徴とするものである
。[Means for Solving the Problems] In the method for manufacturing a tape carrier according to the present invention, a flexible resin tape is provided with holes for inserting a semiconductor device, positioning the semiconductor device, etc. In the method for manufacturing a tape carrier having a circuit formed of metal foil connected to the semiconductor device, a hole for inserting the semiconductor device and positioning the semiconductor device is formed in advance in the flexible resin tape, and the hole is inserted into the flexible resin tape. Steaming the provided hole with a closing member from one side of the tape, then embedding material into the cut hole from the other side of the tape, and then removing the hole closing member. After that, a metal iM is formed to a predetermined thickness by a desired method on a flexible resin tape with a embedding material embedded in the hole, and then a circuit pattern is drawn on the metal thin film using a photocurable resist, and then a predetermined pattern is formed by etching. The present invention is characterized in that after forming the shaped circuit, the filling material in the hole is removed.
［作 用コ
本発明では、可撓性樹脂テープに予め半導体装置の装入
や半導体装置の位置決め等の孔を穿設し、該穿設された
孔を前記テープの一方の面側から閉塞部材で塞ぎ、次い
て該塞がれた孔に前記テープの他方の面側から埋設材を
埋め込み、その後、前記孔の閉塞部材を除去した後に、
該孔に埋設材を埋め込んだ可撓性樹脂テープ状に所望の
手法により金属薄膜を所定厚さに形成し、次いで該金属
薄膜に光硬化レジストにより回路パターンを描き、次い
でエツチングにより所定形状の回路を形成した後に、前
記孔の埋設材を除去するものであるため、可撓性樹脂テ
ープのエツチング処理を必要とせずに、狭小ピッチのテ
ープキャリアを得るに際して従来のテープキャリアと同
様に製造することができる。更に、本発明においては、
可撓性樹脂テープのエツチング処理が不要であるたＵめ
、可撓性樹脂テープをエツチング性から選定することな
く、製造に必要な特性から選定すれば良く、使用できる
可撓性樹脂テープの種類が広がる。[Function] In the present invention, a flexible resin tape is pre-drilled with holes for loading a semiconductor device, positioning of a semiconductor device, etc., and a closing member is inserted into the drilled hole from one side of the tape. Then, after embedding a embedding material into the plugged hole from the other side of the tape, and then removing the hole plugging member,
A thin metal film is formed to a predetermined thickness by a desired method on the flexible resin tape with the embedding material embedded in the hole, then a circuit pattern is drawn on the thin metal film using a photocurable resist, and then a circuit of the predetermined shape is formed by etching. After forming the holes, the filling material for the holes is removed, so that a tape carrier with a narrow pitch can be manufactured in the same way as a conventional tape carrier without requiring etching of the flexible resin tape. I can do it. Furthermore, in the present invention,
Since etching treatment of flexible resin tapes is not required, flexible resin tapes can be selected based on the characteristics required for manufacturing, rather than based on etching properties, and the types of flexible resin tapes that can be used are spreads.
また、本発明に使用する予め穿設した孔に埋め込む埋設
材は、金属薄膜の形成とエツチングに耐えるものであれ
ば良い。一般に金属薄膜のエツチングにはアルカリ溶液
可能型レジストが用いられる。また、金属薄膜の形成に
はスパッタ等の物理的方法のほか、アルカリ浴又は酸浴
でのメツキが使用されるので耐酸、耐アルカリ型の溶剤
可溶型レジストが望ましい。Further, the embedding material used in the present invention to be buried in the pre-drilled hole may be any material as long as it can withstand the formation and etching of a metal thin film. Generally, an alkaline solution compatible resist is used for etching metal thin films. In addition, in addition to physical methods such as sputtering, plating in an alkali bath or acid bath is used to form the metal thin film, so a solvent-soluble resist that is acid-resistant and alkali-resistant is desirable.
なお、デバイス孔等の孔への埋設材の埋め込みは、孔以
外への流れを防ぐために、孔を形成後、孔の一方を閉塞
部材で蟇ぐのであるが、この閉塞部材は、補助テープを
接着剤で張り付けておくことが望ましい。用いる接着剤
は特に限定しないが、埋設材の埋め込み後に補助テープ
と共に容易に除去できるものであれば良い。これは除去
性が良くないと、金属薄膜の可撓性樹脂テープとの密着
性が不充分となるためである。In addition, when filling a hole such as a device hole, in order to prevent the material from flowing outside the hole, after forming the hole, one side of the hole is blocked with a closing member. It is recommended to attach it with adhesive. The adhesive used is not particularly limited, but any adhesive may be used as long as it can be easily removed together with the auxiliary tape after embedding the embedding material. This is because if the removability is not good, the adhesion of the metal thin film to the flexible resin tape will be insufficient.
［実施例］ 以下、実施例によって詳細に説明する。[Example] Hereinafter, it will be explained in detail using examples.
第１ａ−ｊ図は本発明の一実施例の工程を示す説明図で
ある。Figures 1a-j are explanatory diagrams showing the steps of an embodiment of the present invention.
第１ａ図において、下地基材に厚さ５０μｍ、幅３５ｍ
ｍのポリイミドテープ１ （商品名、コービレックステ
ーブ、宇部興産製）を用いた。In Figure 1a, the base material has a thickness of 50 μm and a width of 35 m.
Polyimide tape 1 (trade name, Corbilex tape, manufactured by Ube Industries) was used.
第１ｂ図に示す通り、このテープ１にプレスにより一定
間隔のデバイス孔Ａ（または、パイロット孔）を穿孔し
た。As shown in FIG. 1b, device holes A (or pilot holes) were punched at regular intervals in this tape 1 using a press.
次いて、９．１ｃ図の通り２０μ鳳厚のデバイス孔Ａが
塞ぐ幅の接着層２付きのポリエステルチーブ３（テラオ
カ製作所製６３２Ｓ）を接着した。Next, as shown in Figure 9.1c, a polyester tube 3 (632S manufactured by Teraoka Manufacturing Co., Ltd.) with an adhesive layer 2 having a width that covers the device hole A with a thickness of 20 μm was adhered.
更に、第１ｄ図のようにデバイス孔Ａより犬ぎ目の幅で
ロールコータ−により３０μｍ厚のネガ型溶則熔解型レ
ジスト４（太陽インク製ＰＥＲ＋ｏｓ−１）を塗布した
。Furthermore, as shown in FIG. 1d, a 30 μm thick negative melting resist 4 (PER+os-1 manufactured by Taiyo Ink Co., Ltd.) was coated with a roll coater at a dog-edge width from the device hole A.
ｉ１ｅ図のようにレジスト４が乾燥した後、ポリエステ
ルチーブ３を接着層２と共に創動した。After the resist 4 was dried as shown in Figure i1e, the polyester cheese 3 was wound together with the adhesive layer 2.
次いで、％ｌｔ図の通り、アルカリ前処理により残留接
着剤を除去し、真空チャンバー内で、０２プラズマで表
面洗浄した後、スパッタ及び硫酸−硫酸銅洛中で電気メ
ツキによって、１μｌの銅薄［５を形成した。Next, as shown in the %lt figure, residual adhesive was removed by alkaline pretreatment, the surface was cleaned with 02 plasma in a vacuum chamber, and 1 μl of copper thin film [5 was formed.
そこに第１ｇ図に示す通り、３μｌ厚のアルカリ溶解型
レジスト６（東京応化製ＰＭＥＲ−Ｐ）をロールコータ
−で塗布した。レジスト６が乾燥した後、銅薄１１ｉ５
側に回路原板を１いて、両面から紫外線露光、更に弱ア
ルカリ現像後、塩化第二鉄でエツチングして回路形成し
た。As shown in FIG. 1g, a 3 μl thick alkali-dissolved resist 6 (PMER-P manufactured by Tokyo Ohka Co., Ltd.) was applied thereto using a roll coater. After resist 6 dries, copper thin layer 11i5
A circuit board was placed on one side, exposed to ultraviolet light from both sides, developed with a weak alkali, and then etched with ferric chloride to form a circuit.
第１ｈ図に示す通り、回路が形成されたレジスト６をア
ルカリ液で剥離した後、第１１図のように溶剤（塩化メ
チレン）で溶剤型レジスト４を除去した。As shown in FIG. 1h, the resist 6 on which the circuit was formed was removed with an alkaline solution, and then the solvent-type resist 4 was removed with a solvent (methylene chloride) as shown in FIG.
第１Ｊ図に示す通り、最後にリートを無電解Ｓｎメツキ
７（メルテックス製ＴｌＮ４２１スペシャル）処理して
テープキャリアを作成した。As shown in FIG. 1J, the leat was finally treated with electroless Sn plating 7 (TIN421 Special manufactured by Meltex) to produce a tape carrier.
本実施例に示したように本発明によれば、可撓性樹脂テ
ープの如何を問わず容易に狭小リートピッチ化したテー
プキャリアを製造できる。As shown in this embodiment, according to the present invention, a tape carrier with a narrow reed pitch can be easily manufactured regardless of the type of flexible resin tape.
更に本発明に依れば、可撓性樹脂テープのエツチング処
理を行なうことなく、従来のテープキャリアと同様に製
造することがで暫、また、可撓性樹脂テープのエツチン
グ処理が不要であるため、可撓性樹脂テープをエツチン
グ性から選定することなく、製造に必要な特性から選定
すれば良く、使用できる可撓性樹脂テープの種類が広が
る。Further, according to the present invention, the flexible resin tape can be manufactured in the same manner as conventional tape carriers without etching the flexible resin tape, and the etching process of the flexible resin tape is not required. Instead of selecting a flexible resin tape based on its etching properties, it is sufficient to select it based on the characteristics required for manufacturing, and the types of flexible resin tapes that can be used are expanded.
［発明の効果］
以上説明した通り、本発明では可撓性樹脂テープに予め
半導体装置の装入や半導体装置の位置決め等の孔を穿設
し、該穿設された孔を前記テープの一方の面側から閉塞
部材で塞ぎ、次いで該塁がれた孔に前記テープの他方の
面側から埋設材を埋め込み、その後、前記孔の閉塞部材
を除去した後に、該孔に埋設材を埋め込んだ可撓性樹脂
テープ状に所望の手法により金属薄膜を所定厚さに形成
し、次いで該金属薄膜に光硬化レジストにより回路パタ
ーンを描き、次いでエツチングにより所定形状の回路を
形成した後に、前記孔の埋設材を除去するものであるた
め、可撓性樹脂テープのエツチング処理を必要とせずに
、狭小ピッチのテープキャリアを得るに際して従来のテ
ープキャリアと同様に製造することができる。更に、本
発明においては、可撓性樹脂テープのエツチング処理が
不要であるため、可撓性樹脂テープをエツチング性から
選定することなく、製造に必要な特性から選定すれば良
く、使用できる可撓性樹脂テープの種類が広がる等の効
果がある。[Effects of the Invention] As explained above, in the present invention, holes for loading semiconductor devices and positioning of semiconductor devices are made in advance in a flexible resin tape, and the holes are inserted into one side of the tape. It is possible to close the hole with a closing member from the surface side, then embed a embedding material into the hole from the other side of the tape, and then, after removing the hole closing member, bury the embedding material into the hole. A thin metal film is formed on a flexible resin tape to a predetermined thickness by a desired method, a circuit pattern is drawn on the thin metal film using a photocuring resist, and a circuit of a predetermined shape is formed by etching, after which the holes are filled. Since the material is removed, a narrow pitch tape carrier can be manufactured in the same manner as conventional tape carriers without requiring etching of the flexible resin tape. Furthermore, in the present invention, since etching treatment of the flexible resin tape is not necessary, it is sufficient to select the flexible resin tape based on the characteristics required for manufacturing, without selecting the flexible resin tape based on etching properties. This has the effect of expanding the variety of plastic tapes available.
％ １ ａ −ｊ図は本発明の一実施例の工程を示す説
明図、第２図は従来の一般的なテープキャリアの構造を
示す部分断面図である。% 1 a-j are explanatory diagrams showing the steps of an embodiment of the present invention, and FIG. 2 is a partial sectional view showing the structure of a conventional general tape carrier.
Claims (1)
体装置の位置決め等の孔を備え、該テープ上に前記半導
体装置と結線する金属箔で形成した回路を備えたテープ
キャリアの製造方法において、 可撓性樹脂テープに予め前記半導体装置の装入や半導体
装置の位置決め等の孔を穿設し、 該穿設された孔を前記テープの一方の面側から閉塵部材
で塞ぎ、 次いで該塞がれた孔に前記テープの他方の面側から埋設
材を埋め込み、 その後、前記孔の閉塞部材を除去した後に、該孔に埋設
材を埋め込んだ可撓性樹脂テープ状に所望の手法により
金属薄膜を所定厚さに形成し、次いで該金属薄膜に光硬
化レジストにより回路パターンを描き、次いでエッチン
グにより所定形状の回路を形成した後に、 前記孔の埋設材を除去することを特徴とするテープキャ
リアの製造方法。[Scope of Claims] A flexible resin tape is provided with holes for inserting a semiconductor device, positioning the semiconductor device, etc., and is provided with a circuit made of metal foil connected to the semiconductor device on the tape. In the method for manufacturing a tape carrier, a flexible resin tape is pre-drilled with holes for loading the semiconductor device, positioning the semiconductor device, etc., and the drilled holes are closed from one side of the tape. Blocking with a dust member, then embedding material into the blocked hole from the other side of the tape, then removing the hole blocking member, and then embedding the embedding material into the hole using flexible resin. A thin metal film is formed in the form of a tape to a predetermined thickness using a desired method, a circuit pattern is drawn on the thin metal film using a photocuring resist, and a circuit of a predetermined shape is formed by etching, after which the filling material for the hole is removed. A method for manufacturing a tape carrier, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7353590A JPH03276653A (en) | 1990-03-26 | 1990-03-26 | Manufacture of tape carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7353590A JPH03276653A (en) | 1990-03-26 | 1990-03-26 | Manufacture of tape carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03276653A true JPH03276653A (en) | 1991-12-06 |
Family
ID=13521022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7353590A Pending JPH03276653A (en) | 1990-03-26 | 1990-03-26 | Manufacture of tape carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03276653A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996034744A1 (en) * | 1995-05-04 | 1996-11-07 | Tessera, Inc. | Fabrication of leads on semiconductor connection components |
| US9072207B2 (en) | 2008-08-06 | 2015-06-30 | Nitto Denko Corporation | Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit |
-
1990
- 1990-03-26 JP JP7353590A patent/JPH03276653A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996034744A1 (en) * | 1995-05-04 | 1996-11-07 | Tessera, Inc. | Fabrication of leads on semiconductor connection components |
| US5807453A (en) * | 1995-05-04 | 1998-09-15 | Tessera, Inc. | Fabrication of leads on semiconductor connection components |
| US9072207B2 (en) | 2008-08-06 | 2015-06-30 | Nitto Denko Corporation | Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit |
| US10028370B2 (en) | 2008-08-06 | 2018-07-17 | Nitto Denko Corporation | Suspension board and load beam combination including a positioning reference hole and a reinforcing layer |
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