JPH03266514A - Thick film delay line - Google Patents

Abstract

PURPOSE:To obtain a long delay time by forming an inductor and a capacitor to both sides of an insulation base and connecting the components through a throughhole of the base. CONSTITUTION:GND 6a, 6b, a dielectric 7 and an inductor 8 are subject to multi-layer print and baked onto a front side and a rear side of an insulating base 5 by using a thick film material, and a throughhole 9 to the inner side face of which a conductive material is coated or packed is formed from the front side to the rear side of the base. Thus, it is possible to connect the inductor pattern of one side of the base 5 to a pattern provided to the other side through the throughhole 9a made to the base 5, and the circuit comprising the inductor (L) and the capacitor (C) is increased and expanded, Thus, the entire delay time is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to thick film delay lines. In particular, the present invention relates to delay lines used for timing adjustment of signals in computer equipment and the like that process digital signals of electronic equipment at high speed.

(Prior art) Attached No. 3 regarding the conventionally used thick film delay line
This will be explained with reference to the figures.

A GND 17 is printed and fired on one side of the insulating substrate 18, a dielectric 16 and an inductor 15 are printed and fired on the upper surface, and lead terminals 19 and 20 are connected to the GND 17 and the inductor 15, respectively, and these are insulated. A configuration coated with resin 14 was common.

(Problems to be Solved by the Invention) In the conventional delay line, the L and C related elements are formed only on one side, so the overall delay time is limited to the maximum delay time due to its physical characteristics. However, there were problems such as difficulty in obtaining a long delay time.

The present invention aims to solve the above-mentioned problems, and for this purpose, it has a structure in which L and C related elements are formed on both sides of an insulating substrate, and these elements are connected through a through hole through the substrate. It provides:

(Means for Solving the Problems) Means for solving the problems will be described with reference to drawings illustrating embodiments of the present invention.

That is, GNDs 6a, 6b, lla, l are connected using thick film materials on the front and back surfaces of the substrate 5, which provide insulation properties.
lb, dielectrics 7, 12, and inductors 8, 13 are multi-layer printed and fired, and a conductive material is applied to the inner surface or filled inside to form a through hole 9 from the front surface to the back surface. This is a thick film type delay line formed by printing and baking patterns having the same or different delay times on the front and back surfaces of the substrate 5.

(Function) Since it is possible to connect the inductor pattern on one side of the board in series with the pattern on the other side using the through hole provided on the board, the overall circuit consisting of L and C can be increased and expanded. , it is possible to improve the performance of the delay line as it increases the overall delay time.

(Example) Examples of the delay line according to the present invention will be described below with reference to the accompanying drawings. 1-2 illustrate one embodiment of the invention. To explain in detail, Figure 1 (A) is a front view of the thick film delay line, Figure 2 (B) is a side view, Figure 2 (A) is a front view showing the internal structure before coating, and Figure 2 (CB) is a back view. Figure, same (C)
is a side view.

The insulating substrate 5 is mainly made of a ceramic substrate, etc.
As shown in FIG. 1, GND layers 6a and 6b are printed and fired on the surface. This GND layer is made of a thick film material made of, for example, Ag or Cu, and has a zero-order dielectric constant ε5.
A dielectric material 7 made of sintered glass having a diameter of =10 is printed and fired, and an inductor layer 8 made of an Ag or Cu-based conductor is printed and fired on its upper surface, and then input terminals 1. The GND terminals 2a, 2b and the output terminal 3 are connected to their respective patterns by solder or the like as shown in FIG.

FIG. 2(B) is a rear view (a back view of FIG. 2(A),
A GND layer 11a is provided on the back surface of the substrate 5.

11b, dielectric 12, and inductor 13 are printed and fired using the same method as in FIG. 2CA).

Next, the structure of the through hole, which is a feature of the present invention, will be described.

First, a through hole 9a is bored at the end of the inductor 8 on the front side of the insulating substrate 5 (FIG. 52(A)), and is passed through to the through hole 9b of the inductor 13 on the back side (FIG. 2B). The inner surfaces of the through holes 9a, 9b are coated or filled with a conductive material. Thereby, the inductor lid 8 and the inductor 13 are connected via the through holes 9a and 9b. Furthermore, the terminal end of the inductor 13 is connected to the output terminal 3. In this way, L and C related elements are arranged on both sides of the substrate 5, and these are connected to the through holes 9a.

Since the configuration is connected via 9b, L,! The purpose is to increase the number of delay circuits consisting of C and C, thereby improving the performance of the delay line.

It goes without saying that the delay line according to the present invention can be protected from external forces by applying a coating 4 upon completion of the arrangement of related members.

It goes without saying that patterns having the same or different delay times can be printed and fired on the front and back surfaces of the substrate 5.

(Effects of the Invention) According to the present invention, patterns formed of L and C related elements are formed on both sides of an insulating substrate, and the patterns formed on both sides are connected by through holes. Although the size is different, even though the external dimensions remain almost the same,
Its delay time characteristics can be improved several times compared to conventional one-sided pattern forming systems arranged in parallel, and by using both sides, It has the advantage of being more compact than those used in parallel.

[Brief explanation of drawings]

FIG. 1(A) is a front view of a delay line according to the present invention. FIG. 1(B) is a side view. Figure 2 (A) is a front view of Figure 1 (A) before coating, Figure 2 CB) is a back view of Figure 1 (A), Figure 2 (C)
is a side view of FIG. 2(A). FIG. 3 is a perspective view of a conventional thick-film delay line. l...Input terminal, 2a, 2b...GND terminal, 3.
...Output terminal, 4...Coating, 5...Insulating substrate, 6a, 6b, lla, llb...GND layer, 7
．． 12... Dielectric, 8.13... Inductor, 9a
, 9b...Through hole

Claims (2)

[Claims] 1. Multilayer printing of GND, dielectric, and inductor using thick film materials on the front and back sides of the insulating substrate.
A thick film delay line formed by firing and coating the inner surface with a conductive material or filling the inner surface with through holes formed from the front surface to the back surface. 2. 2. The thick film delay line according to claim 1, wherein patterns having the same or different delay times are printed and fired on the front and back surfaces.