JPH03266458A - Integrated circuit case - Google Patents

Integrated circuit case

Info

Publication number
JPH03266458A
JPH03266458A JP2066464A JP6646490A JPH03266458A JP H03266458 A JPH03266458 A JP H03266458A JP 2066464 A JP2066464 A JP 2066464A JP 6646490 A JP6646490 A JP 6646490A JP H03266458 A JPH03266458 A JP H03266458A
Authority
JP
Japan
Prior art keywords
cooling
circuit case
integrated circuit
chip
cooling part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2066464A
Other languages
Japanese (ja)
Inventor
Omihiro Mano
眞野　臣弘
Shinzo Naramoto
楢本　真三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
NEC Engineering Ltd
Original Assignee
NEC Corp
NEC Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, NEC Engineering Ltd filed Critical NEC Corp
Priority to JP2066464A priority Critical patent/JPH03266458A/en
Publication of JPH03266458A publication Critical patent/JPH03266458A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

PURPOSE:To enable a cooling part to be easily fitted to an integrated circuit case in a replaceable manner by a method wherein a thermally conductive part provided with a tapped hole and joined to the insulating board of the circuit case and a cooling part provided with a cooling groove conforming to the threads of the tapped hole are provided. CONSTITUTION:When a current is applied to an IC chip 1 composed of integrated circuits such as logic circuits or the like, heat released from the IC chip 1 is conducted to a cooling part 2 through the intermediary of a thermally conductive part 3. Then, cooling liquid is made to flow through a cooling groove 5 provided to the cooling part 2 to cool it down, whereby the IC chip 1 is kept at a prescribed temperature. The cooling part 2 is provided with screw threads so as to conform to a tapped hole 4 provided to the thermally conductive part 3 which is joined to the center of an insulating board 7, and as the cooling part 2 is fastened by the screw threads provided to it, it can be easily fitted and replaced. By this setup, an integrated circuit case of this design can be possessed of an excellent cooling capacity by making cooling liquid flow through the cooling groove 5 of the cooling part 2, and the cooling part 2 can be easily fitted to the integrated circuit case and replaced.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は累積回路ケース、特に、論理回路ＩＣ等を搭載
する為の冷却部を設けた集積回路ケースに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cumulative circuit case, and particularly to an integrated circuit case provided with a cooling section for mounting a logic circuit IC or the like.

〔従来の技術〕[Conventional technology]

第２図は従来の一例を示す断面図である。 FIG. 2 is a sectional view showing a conventional example.

従来の集積回路ケースは、プリント基板に複数実装して
使用されており、この集積回路ケースに搭載されている
ＩＣチップ１は通電により発熱するが、集積回路ケース
の放熱のみではジャンクション温度を抑えられない時、
集積回路ケースに液冷で冷す冷却部を有し、この取付け
は接着剤等により接着固定していた。Conventional integrated circuit cases are used by mounting multiple IC chips on a printed circuit board, and the IC chips 1 mounted on this integrated circuit case generate heat when energized, but the junction temperature cannot be suppressed by heat dissipation from the integrated circuit case alone. When there is no
The integrated circuit case has a cooling section that is cooled by liquid cooling, and this was fixed with adhesive or the like.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の集積回路ケースは、固化する間振動を加
えることなく固定保持する必要があるとともに、接着し
た集積回路ケースと液冷冷却部のいづれか一方を交換又
は再使用しようとすることは集積回路ケースと液冷冷却
部が固着接着されているため不可能という欠点がある。The above-mentioned conventional integrated circuit case needs to be held fixed without vibration during solidification, and it is difficult to replace or reuse either the glued integrated circuit case or the liquid cooling section. The disadvantage is that this is not possible because the case and the liquid cooling part are firmly glued together.

そこで本発明の目的は、集積回路ケースに冷却部を容易
に取付け、交換等が可能になる集積回路ケースを提供す
ることにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an integrated circuit case in which a cooling section can be easily attached and replaced.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の集積回路ケースは、回路ケースの絶縁基板に合
着されネジ穴を有する熱伝導部と、このネジに合致し冷
却溝を有する冷却部とを有している。The integrated circuit case of the present invention has a heat conduction part that is attached to an insulating substrate of the circuit case and has a screw hole, and a cooling part that fits the screw and has a cooling groove.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.

第１図に示す集積回路ケースは、論理回路等の集積回路
より成るＩＣチップ１に通電した時、発熱する熱は、熱
伝導部３を介して冷却部２へ伝導される。In the integrated circuit case shown in FIG. 1, when an IC chip 1 consisting of an integrated circuit such as a logic circuit is energized, the heat generated is conducted to a cooling section 2 via a heat conduction section 3.

そこで、この冷却部２に備えた冷却部２に備えた冷却溝
５に冷却液を流すことにより冷却部２が冷却され、所定
温度に抑制することができる。Therefore, the cooling part 2 is cooled by flowing the cooling liquid into the cooling grooves 5 provided in the cooling part 2, and the temperature can be suppressed to a predetermined temperature.

冷却部２は絶縁基板７の中央部分に合着された熱伝導部
３のネジ穴４に合致するように冷却部２にネジを有し、
このネジにより冷却部２は止着されている為容易に取付
け、交換等が可能となる。The cooling unit 2 has screws that match the screw holes 4 of the heat conduction unit 3 attached to the center portion of the insulating substrate 7,
Since the cooling unit 2 is fixed with these screws, it can be easily installed and replaced.

外部との信号の送受を行うためのチップ８は絶縁基板４
の周囲に必要数備え付けてあり、このチップ接続端子８
に接続されている導体パターン６の一端はＩＣチップ１
に備え付けであるチップ接続端子８に接続線９により接
続される。A chip 8 for transmitting and receiving signals with the outside is an insulating substrate 4
The necessary number of chip connection terminals are provided around the
One end of the conductor pattern 6 connected to the IC chip 1
It is connected by a connecting wire 9 to a chip connecting terminal 8 which is provided in the chip.

ＩＣチップの保護のため保護キャップ１０が取付けであ
る。A protective cap 10 is attached to protect the IC chip.

〔発明の効果〕 以上説明したように本発明は、ＩＣチップで生しる熱を
伝える熱伝導部にネジ穴を設け、また液冷却冷却部にも
これと合致するネジを設けており、ネジ化めすることで
集積回路ケースに冷却部を容易に取付けることが可能と
なるため、冷却部の冷却溝に冷却液を流すことで十分な
冷却効果が得られるとともに、さらに集積回路ケースと
冷却体の取付け、交換等の作業が容易なことから工数削
減できる効果がある。[Effects of the Invention] As explained above, the present invention provides screw holes in the heat conduction part that transmits heat generated by the IC chip, and also provides screw holes in the liquid cooling part that match the screw holes. This makes it possible to easily attach the cooling unit to the integrated circuit case, and by flowing the cooling liquid through the cooling grooves of the cooling unit, a sufficient cooling effect can be obtained, and the integrated circuit case and cooling unit can be easily installed. Since installation and replacement work is easy, it has the effect of reducing man-hours.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示す断面図、第２図は従来
の一例を示す断面図である。 １・・・ＩＣチップ、２・・・冷却部、３・・・熱伝導
部、４・・・ネジ穴、５・・・冷却溝、６・・・導体パ
ターン、７・・・絶縁基板、８・・・チップ接続端子、
９・・・接続線、１０・・・保護キャップ。FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing an example of the conventional technology. DESCRIPTION OF SYMBOLS 1... IC chip, 2... Cooling part, 3... Heat conduction part, 4... Screw hole, 5... Cooling groove, 6... Conductor pattern, 7... Insulating substrate, 8...Chip connection terminal,
9... Connection wire, 10... Protective cap.

Claims (1)

【特許請求の範囲】[Claims] 　回路ケースの絶縁基板に合着されネジ穴を有する熱伝
導部と、このネジに合致し冷却溝を有する冷却部とを備
えることを特徴とする集積回路ケース。What is claimed is: 1. An integrated circuit case comprising: a heat conduction part that is attached to an insulating substrate of the circuit case and has a screw hole; and a cooling part that fits the screw and has a cooling groove.
JP2066464A 1990-03-15 1990-03-15 Integrated circuit case Pending JPH03266458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2066464A JPH03266458A (en) 1990-03-15 1990-03-15 Integrated circuit case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2066464A JPH03266458A (en) 1990-03-15 1990-03-15 Integrated circuit case

Publications (1)

Publication Number Publication Date
JPH03266458A true JPH03266458A (en) 1991-11-27

Family

ID=13316529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2066464A Pending JPH03266458A (en) 1990-03-15 1990-03-15 Integrated circuit case

Country Status (1)

Country Link
JP (1) JPH03266458A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010114121A (en) * 2008-11-04 2010-05-20 Daikin Ind Ltd Heat radiator of electrical component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010114121A (en) * 2008-11-04 2010-05-20 Daikin Ind Ltd Heat radiator of electrical component

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