JPH032655U - - Google Patents

Info

Publication number
JPH032655U
JPH032655U JP6231289U JP6231289U JPH032655U JP H032655 U JPH032655 U JP H032655U JP 6231289 U JP6231289 U JP 6231289U JP 6231289 U JP6231289 U JP 6231289U JP H032655 U JPH032655 U JP H032655U
Authority
JP
Japan
Prior art keywords
lead frame
synthetic resin
temperature
solder
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6231289U
Other languages
English (en)
Other versions
JP2501668Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989062312U priority Critical patent/JP2501668Y2/ja
Publication of JPH032655U publication Critical patent/JPH032655U/ja
Application granted granted Critical
Publication of JP2501668Y2 publication Critical patent/JP2501668Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の表面実装用電気部品の外観を
示す斜視図、第２図は第１図の実施例に使用され
るリードフレームの平面図並びに正面図及び側面
図、第３図は第１図の実施例の内部構造を示す断
面図、第４図は本考案の他の実施例の表面実装用
電気部品に使用されるリードフレームの平面図並
びに正面図及び側面図、第５図は第４図のリード
フレームが使用された表面実装用電気部品の内部
構造を示す断面図、第６図は第５図の表面実装用
電気部品の外観を示す斜視図である。 １，２０……リードフレーム、１２……ボンデ
イング部、１３，２３……半田、１４……ダイバ
部、１５，２４……リード部、１６，２５……枠
部、１７……ＩＣチツプ、２１……タンタルコン
デンサ素子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 電気素子が電気接続されたリードフレームを、
    該リードフレームの一部を露出させて合成樹脂で
    モールドして封止してなる表面実装用電気部品に
    おいて、前記合成樹脂のモールド部から露出する
    リードフレームの少なくとも一部に、前記合成樹
    脂のモールド温度よりも高い溶融点を有する薄板
    状の半田を、該半田の溶融点以下の温度でかつ前
    記モールド温度よりも高い温度で接着性能が喪失
    する接着剤により接着してあることを特徴とする
    表面実装用電気部品。
JP1989062312U 1989-05-29 1989-05-29 表面実装用電気部品 Expired - Lifetime JP2501668Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989062312U JP2501668Y2 (ja) 1989-05-29 1989-05-29 表面実装用電気部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989062312U JP2501668Y2 (ja) 1989-05-29 1989-05-29 表面実装用電気部品

Publications (2)

Publication Number Publication Date
JPH032655U true JPH032655U (ja) 1991-01-11
JP2501668Y2 JP2501668Y2 (ja) 1996-06-19

Family

ID=31591345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989062312U Expired - Lifetime JP2501668Y2 (ja) 1989-05-29 1989-05-29 表面実装用電気部品

Country Status (1)

Country Link
JP (1) JP2501668Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784575U (ja) * 1980-11-10 1982-05-25
WO2008041397A1 (fr) * 2006-10-04 2008-04-10 Sanyo Electric Co., Ltd. Condensateur électrolytique solide et son procédé de fabrication

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6367261U (ja) * 1986-10-23 1988-05-06
JPS6452249U (ja) * 1987-09-28 1989-03-31

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6367261U (ja) * 1986-10-23 1988-05-06
JPS6452249U (ja) * 1987-09-28 1989-03-31

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784575U (ja) * 1980-11-10 1982-05-25
WO2008041397A1 (fr) * 2006-10-04 2008-04-10 Sanyo Electric Co., Ltd. Condensateur électrolytique solide et son procédé de fabrication
US8072735B2 (en) 2006-10-04 2011-12-06 Sanyo Electric Co., Ltd. Solid electrolytic capacitor, and method for manufacturing the same

Also Published As

Publication number Publication date
JP2501668Y2 (ja) 1996-06-19

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