JPH03262315A - Surface acoustic wave device - Google Patents
Surface acoustic wave deviceInfo
- Publication number
- JPH03262315A JPH03262315A JP6294890A JP6294890A JPH03262315A JP H03262315 A JPH03262315 A JP H03262315A JP 6294890 A JP6294890 A JP 6294890A JP 6294890 A JP6294890 A JP 6294890A JP H03262315 A JPH03262315 A JP H03262315A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- package
- area
- bonding
- acoustic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 230000001902 propagating effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は弾性表面波素子に関し、特にパッケージに収容
した構造をもつ弾性表面波素子に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface acoustic wave device, and particularly to a surface acoustic wave device having a structure housed in a package.
従来のこの種の弾性表面波素子は、第２図に示すごとく
、圧電基板チップ１２の裏面全面をパッケージ１１に接
着材１３で固着させた構造をもつ。A conventional surface acoustic wave element of this type has a structure in which the entire back surface of a piezoelectric substrate chip 12 is fixed to a package 11 with an adhesive 13, as shown in FIG.
上述した従来の弾性表面波素子は、チップ裏面全面をパ
ッケージに接着させているので、接着剤の硬化時のスト
レスやパッケージ封止後に生じる歪などが圧電基板チッ
プに加わり、チップ素子の共振周波数あるいは中心周波
数のずれを生じさせるという欠点がある。In the conventional surface acoustic wave device described above, the entire back surface of the chip is bonded to the package, so stress when the adhesive hardens and strain generated after package sealing are applied to the piezoelectric substrate chip, causing the chip element's resonant frequency or This has the disadvantage of causing a shift in the center frequency.
本発明の弾性表面波素子は、弾性表面波伝送用のパター
ンを形成してある圧電基板チップとこれを固定し封止す
るためのパッケージとを有する弾性表面波素子において
、前記圧電基板チップの面積の３分の１以下の領域で前
記パッケージ内に接着し、かつこの接着領域の表面に前
記パターンと前記パッケージのリードとの間をワイヤ接
続するためのワイヤボンディング用パターンを配設して
ある。The surface acoustic wave device of the present invention includes a piezoelectric substrate chip on which a pattern for surface acoustic wave transmission is formed and a package for fixing and sealing the piezoelectric substrate chip. A wire bonding pattern is provided on the surface of the bonding area for wire connection between the pattern and the leads of the package.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
表面に弾性表面波伝送用のパターンを形成してある圧電
基板チップ１２は、裏面をパッケージ１１に接着材１６
で固着されているが、この接着部分はチップ裏面の面積
の３分の１以下の面積になるようにしてある。さらに、
表面のボンディング用パターン１４がチップ接着領域の
上方になるよう配置して、リード１５とボンディング用
のワイヤ１７で接着する際に圧電基板チップ１２が下方
に振れてボンディングが不完全になるのを防止している
。The piezoelectric substrate chip 12, which has a surface acoustic wave transmission pattern formed on its surface, is attached to the package 11 with an adhesive 16 on its back surface.
However, the area of this adhesive portion is one-third or less of the area of the back surface of the chip. moreover,
The bonding pattern 14 on the surface is arranged above the chip bonding area to prevent the piezoelectric substrate chip 12 from swinging downward and incomplete bonding when bonding with the leads 15 and the bonding wire 17. are doing.
以上説明したように本発明は、チップのパッケージへの
接着部分がチップ面積の３分の１以下になるようにする
ことにより、従来の問題点であった接着材の硬化時のス
トレスやパッケージの歪の影響を減少できる効果がある
。As explained above, the present invention reduces the stress that occurs when the adhesive hardens, which was a problem in the past, by reducing the adhesive area of the chip to the package to be one-third or less of the chip area. It has the effect of reducing the influence of distortion.
第１図は本発明の一実施例を示す斜視図、第２図は従来
の弾性表面波素子を示す斜視図である。
１１・・・パッケージ、１２・・・圧電基板チップ、１
３．１６・・・接着材、１４・・・ボンディング用パタ
ーン、１５・・・リード、１７・・・ワイヤ。FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional surface acoustic wave element. 11...Package, 12...Piezoelectric substrate chip, 1
3.16... Adhesive material, 14... Bonding pattern, 15... Lead, 17... Wire.
Claims (1)
チップとこれを固定し封止するためのパッケージとを有
する弾性表面波素子において、前記圧電基板チップの面
積の３分の１以下の領域で前記パッケージ内に接着し、
かつこの接着領域の表面に前記パターンと前記パッケー
ジのリードとの間をワイヤ接続するためのワイヤボンデ
ィング用パターンを配設してあることを特徴とする弾性
表面波素子。In a surface acoustic wave element having a piezoelectric substrate chip on which a pattern for surface acoustic wave transmission is formed and a package for fixing and sealing the piezoelectric substrate chip, an area of one-third or less of the area of the piezoelectric substrate chip is glued into the package;
A surface acoustic wave element, further comprising a wire bonding pattern disposed on the surface of the bonding region for wire-bonding the pattern and the lead of the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6294890A JPH03262315A (en) | 1990-03-13 | 1990-03-13 | Surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6294890A JPH03262315A (en) | 1990-03-13 | 1990-03-13 | Surface acoustic wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03262315A true JPH03262315A (en) | 1991-11-22 |
Family
ID=13215044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6294890A Pending JPH03262315A (en) | 1990-03-13 | 1990-03-13 | Surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03262315A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007189430A (en) * | 2006-01-12 | 2007-07-26 | Epson Toyocom Corp | Saw device and manufacturing method of saw device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS644110A (en) * | 1987-06-25 | 1989-01-09 | Toyo Communication Equip | Bonding structure of piezoelectric substrate in saw device |
-
1990
- 1990-03-13 JP JP6294890A patent/JPH03262315A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS644110A (en) * | 1987-06-25 | 1989-01-09 | Toyo Communication Equip | Bonding structure of piezoelectric substrate in saw device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007189430A (en) * | 2006-01-12 | 2007-07-26 | Epson Toyocom Corp | Saw device and manufacturing method of saw device |
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