JPH0326171Y2 - - Google Patents

Info

Publication number

JPH0326171Y2

JPH0326171Y2 JP454683U JP454683U JPH0326171Y2 JP H0326171 Y2 JPH0326171 Y2 JP H0326171Y2 JP 454683 U JP454683 U JP 454683U JP 454683 U JP454683 U JP 454683U JP H0326171 Y2 JPH0326171 Y2 JP H0326171Y2

Authority

JP

Japan

Prior art keywords

attached

panel

piping

hole

steel partition

Prior art date

1983-01-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005192 partition Methods 0.000 claims description 18
• 229910000831 Steel Inorganic materials 0.000 claims description 12
• 239000010959 steel Substances 0.000 claims description 12
• 230000002093 peripheral effect Effects 0.000 claims description 4
• 229920001084 poly(chloroprene) Polymers 0.000 claims description 3
• 239000000463 material Substances 0.000 claims 1
• 238000012856 packing Methods 0.000 claims 1
• 238000012423 maintenance Methods 0.000 description 7
• 238000010276 construction Methods 0.000 description 6
• 238000000034 method Methods 0.000 description 6
• BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
• 238000005553 drilling Methods 0.000 description 4
• 238000010586 diagram Methods 0.000 description 3
• 239000000428 dust Substances 0.000 description 3
• 241000252233 Cyprinus carpio Species 0.000 description 1
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
• POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 description 1
• 230000003749 cleanliness Effects 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
• 238000009792 diffusion process Methods 0.000 description 1
• 239000011521 glass Substances 0.000 description 1
• 230000001771 impaired effect Effects 0.000 description 1
• 238000009434 installation Methods 0.000 description 1
• 239000007788 liquid Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000000843 powder Substances 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1
• 239000004065 semiconductor Substances 0.000 description 1
• 239000004590 silicone sealant Substances 0.000 description 1