JPH03259703A - Inspecting method for wiring pattern of printed wiring board - Google Patents

Inspecting method for wiring pattern of printed wiring board

Info

Publication number
JPH03259703A
JPH03259703A JP5886190A JP5886190A JPH03259703A JP H03259703 A JPH03259703 A JP H03259703A JP 5886190 A JP5886190 A JP 5886190A JP 5886190 A JP5886190 A JP 5886190A JP H03259703 A JPH03259703 A JP H03259703A
Authority
JP
Japan
Prior art keywords
wiring board
reflected light
light
pattern
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5886190A
Other languages
Japanese (ja)
Inventor
Hiroyasu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP5886190A priority Critical patent/JPH03259703A/en
Publication of JPH03259703A publication Critical patent/JPH03259703A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To inspect the printed wiring board at a fast processing speed with high reliability by irradiating the printed wiring board with fluorescent light which has long wavelength enough to attenuate reflected light from a writing pattern on the reverse surface of the wiring board almost completely in the insulating base material of the wiring board so that the reflected light does not reach a photodetection part.
CONSTITUTION: An internal layer plate 9 which has wiring patterns 8 formed on both surfaces of the translucent insulating base material 7 is placed on an XY table 10 which is movable in an X and a Y direction. Then the white fluorescent light from a fluorescent light generation part 11 which is arranged above is passed through a filter 12 to obtain light 13 close to red light, which moves and irradiates the entire top surface of the internal layer plate 9 continuously. Its reflected light 14 is detected by the photodetection part 16, whose output electric signal is processed by an image processing unit 17 to recognize and evaluate an image. Consequently only the reflected light from the wiring pattern on the top surface can be extracted purely, so the need for the reflected light removing process for the reverse surface pattern is eliminated. Further, virtual information is reduced.
COPYRIGHT: (C)1991,JPO&Japio
JP5886190A 1990-03-09 1990-03-09 Inspecting method for wiring pattern of printed wiring board Pending JPH03259703A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5886190A JPH03259703A (en) 1990-03-09 1990-03-09 Inspecting method for wiring pattern of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5886190A JPH03259703A (en) 1990-03-09 1990-03-09 Inspecting method for wiring pattern of printed wiring board

Publications (1)

Publication Number Publication Date
JPH03259703A true JPH03259703A (en) 1991-11-19

Family

ID=13096496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5886190A Pending JPH03259703A (en) 1990-03-09 1990-03-09 Inspecting method for wiring pattern of printed wiring board

Country Status (1)

Country Link
JP (1) JPH03259703A (en)

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