JPH03257985A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH03257985A JPH03257985A JP2057618A JP5761890A JPH03257985A JP H03257985 A JPH03257985 A JP H03257985A JP 2057618 A JP2057618 A JP 2057618A JP 5761890 A JP5761890 A JP 5761890A JP H03257985 A JPH03257985 A JP H03257985A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- bending
- hole
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 abstract description 4
- 229920001721 polyimide Polymers 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、可撓性を有するプリント配線板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a flexible printed wiring board.
従来、可撓性を有する絶縁基材と、導体回路と、可撓性
を有する絶縁被覆を有するプリント配線板の折り曲げ部
分の構造としては、第3図に示すように、折り曲げ位置
に印刷にてインクでマーキングし、この部分を折り曲げ
る構造、あるいは第4図に示すように、折り曲げ部分を
表示するために、少なくとも一本の回路と一体に凸状等
のマーキング部を設け、この部分を折り曲げる構造が特
開昭61−206288号公報に開示されている。Conventionally, the structure of the bent portion of a printed wiring board having a flexible insulating base material, a conductor circuit, and a flexible insulating coating is as shown in Figure 3, by printing at the bending position. A structure in which a marking is made with ink and this part is folded, or a structure in which a convex marking part is provided integrally with at least one circuit and this part is folded in order to indicate the folded part, as shown in Figure 4. is disclosed in Japanese Patent Application Laid-Open No. 61-206288.
しかし、第3図に示す構造は、折り曲げ位置を印刷する
ため、工程が増えてしまうという問題点があった。また
、第3図や第4図に示す構造は、折り曲げマーキング部
でも、その他の部分でも折り曲げに必要な荷重が同しで
あるため、精度良く折り曲げマーキング部分で折り曲げ
るのは困難であるという問題点があった。However, the structure shown in FIG. 3 has the problem that the number of steps is increased because the bending position is printed. In addition, the structure shown in Figures 3 and 4 has the problem that it is difficult to accurately bend at the bending marking part because the load required for bending is the same at the bending marking part and at other parts. was there.
本発明は、折り曲げ作業を簡略化するとともに、折り曲
げ位置精度を向上させたプリント配線板の折り曲げ構造
を提供するものである。The present invention provides a printed wiring board folding structure that simplifies the folding operation and improves the folding position accuracy.
本発明の配線板は、可撓性を有する絶縁基材と、導体回
路と、可撓性を有する絶縁被覆を有するプリント配線板
において、折り曲げ加工を必要とする箇所であって導体
回路のない箇所に、透孔を設けることを特徴とする特
すなわち、第1図に示すように、プリント配線板の折り
曲げ部分の回路を形成していない部分に透孔を設け、こ
の透孔に沿って折り曲げを行う。The wiring board of the present invention is a printed wiring board that has a flexible insulating base material, a conductor circuit, and a flexible insulating coating, and has a part that requires bending and does not have a conductor circuit. As shown in FIG. 1, a special feature in which a through hole is provided in the printed wiring board is provided in the folded portion of the printed wiring board where no circuit is formed, and the printed wiring board is bent along the through hole. conduct.
本発明における透孔の形状は円、楕円、三角、四角等形
状は、問わない。但し、作業上、複雑な形状は避ける方
が好ましい。The shape of the through hole in the present invention may be circular, elliptical, triangular, square, or any other shape. However, for work reasons, it is preferable to avoid complex shapes.
プリント配線板の折り曲げ部分に透孔を設けたため、プ
リント配線板を折り曲げた際に、透孔のあいた部分は透
孔の無い部分に比べて小さい荷重で折り曲がるため、折
り曲げ作業は容易に出来、又、折り曲げ位置も透孔に沿
って精度良く折り曲げることが出来る。Since through-holes are provided in the bent portion of the printed wiring board, when the printed wiring board is bent, the portion with the through-hole bends with a smaller load than the portion without the through-hole, making the bending work easier. Also, the bending position can be accurately bent along the through hole.
[実施例] 本考案の実施例を図1に示す。[Example] An embodiment of the present invention is shown in FIG.
ポリイミドフィルムに接着剤で銅箔を張り合わせた銅張
り積層板に導体の幅0.5閣、長さ100■の形状で1
.5誠ピンチで8本の回路を銅箔の不要部分をエツチン
グ除去して形成する。A conductor with a width of 0.5cm and a length of 100cm is placed on a copper-clad laminate made of polyimide film and copper foil pasted with adhesive.
.. Eight circuits are formed by etching away unnecessary parts of the copper foil using a five-pin pinch.
次に、回路を保護するため、回路を接着剤付ポリイミド
フィルムで被覆した後、製品の外形を金型で打ち抜いて
フレシキブルプリント配線板とする。次に、このフレシ
キブルプリント配線板の折り曲げ部分の導体の無い部分
にφ0.6の透孔を9箇所ドリルで開ける。この透孔は
製品の外形を金型で打ち抜く際開けても良い。このよう
にして得られた折り曲げ部分の構造に於いて、フレシキ
ブルプリント配線板を折り曲げた際、従来よりも作業が
容易に出来、位置も透孔に沿って精度良く折り曲げるこ
とが確認出来た。Next, in order to protect the circuit, the circuit is covered with an adhesive-backed polyimide film, and then the outer shape of the product is punched out using a mold to form a flexible printed wiring board. Next, nine through holes of φ0.6 are drilled in the bent portion of this flexible printed wiring board where there is no conductor. This hole may be opened when punching out the outer shape of the product using a die. With the structure of the bent portion obtained in this way, it was confirmed that when the flexible printed wiring board was bent, the work was easier than before, and the bending position was also accurate along the through hole.
以上の説明より明らかなとおり、折り曲げ可能なプリン
ト配線板において折り曲げ加工を必要とする部分に透孔
を設けた構造は、折り曲げ可能なプリント配線板の折り
曲げ作業の簡略化と折り曲げ位置精度の向上を図ること
が出来る。As is clear from the above explanation, the structure in which through holes are provided in the parts of a bendable printed wiring board that require bending processing simplifies the bending work of the bendable printed wiring board and improves the accuracy of the bending position. It is possible to plan.
第1図は本発明の一実施例を示す上面図、第2図は本発
明の配線板を折り曲げたところを示す上面図、第3図及
び第4図は従来例を示す上面図、第5図〜第7図は本発
明の他の実施例を示す上面図である。
符号の説明
l プリント配線板
3 透孔
5凸状マーキング
2 導体
4 印刷マーキングFIG. 1 is a top view showing one embodiment of the present invention, FIG. 2 is a top view showing a folded wiring board of the present invention, FIGS. 3 and 4 are top views showing a conventional example, and FIG. 7 to 7 are top views showing other embodiments of the present invention. Explanation of symbols 1 Printed wiring board 3 Through hole 5 Convex marking 2 Conductor 4 Printed marking
Claims (1)
有する絶縁被覆を有するプリント配線板において、折り
曲げ加工を必要とする箇所であって導体回路のない箇所
に、透孔を設けたことを特徴とするプリント配線板。1. In a printed wiring board that has a flexible insulating base material, a conductive circuit, and a flexible insulating coating, a through hole is provided in a place that requires bending and does not have a conductive circuit. A printed wiring board characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2057618A JPH03257985A (en) | 1990-03-08 | 1990-03-08 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2057618A JPH03257985A (en) | 1990-03-08 | 1990-03-08 | Printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03257985A true JPH03257985A (en) | 1991-11-18 |
Family
ID=13060867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2057618A Pending JPH03257985A (en) | 1990-03-08 | 1990-03-08 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03257985A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996010326A1 (en) * | 1994-09-27 | 1996-04-04 | Seiko Epson Corporation | Printed wiring board, method of producing the same and electronic devices |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS622225U (en) * | 1985-06-19 | 1987-01-08 | ||
JPS63100816U (en) * | 1986-12-19 | 1988-06-30 |
-
1990
- 1990-03-08 JP JP2057618A patent/JPH03257985A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS622225U (en) * | 1985-06-19 | 1987-01-08 | ||
JPS63100816U (en) * | 1986-12-19 | 1988-06-30 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996010326A1 (en) * | 1994-09-27 | 1996-04-04 | Seiko Epson Corporation | Printed wiring board, method of producing the same and electronic devices |
US6121988A (en) * | 1994-09-27 | 2000-09-19 | Seiko Epson Corporation | Printed wiring board and its manufacturing method, and electronic apparatus |
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