JPH0325237U - - Google Patents

Info

Publication number
JPH0325237U
JPH0325237U JP1989085647U JP8564789U JPH0325237U JP H0325237 U JPH0325237 U JP H0325237U JP 1989085647 U JP1989085647 U JP 1989085647U JP 8564789 U JP8564789 U JP 8564789U JP H0325237 U JPH0325237 U JP H0325237U
Authority
JP
Japan
Prior art keywords
camera
bonding
image processing
processing means
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989085647U
Other languages
English (en)
Other versions
JP2513151Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989085647U priority Critical patent/JP2513151Y2/ja
Publication of JPH0325237U publication Critical patent/JPH0325237U/ja
Application granted granted Critical
Publication of JP2513151Y2 publication Critical patent/JP2513151Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例であり、本考案の装
置の構成を示す概略図、第２図は第１図に示すパ
ツドを拡大した拡大図である。 １……カメラ、２……ＸＹテーブル駆動機構、
３……ＸＹθテーブル駆動機構、４……ペレツト
、５……パツド、６……画像処理装置、７……Ｘ
Ｙテーブル制御部、８……モニタ。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 被ボンデイング部品を撮像するカメラと、
    該カメラを搭載しＸ方向及びＹ方向に移動可能な
    ＸＹテーブル駆動機構と、前記カメラにより撮像
    された情報を２値化する２値化回路及び該情報を
    記憶し制御する制御回路等で構成される画像処理
    手段とを備え、前記画像処理手段は、前記カメラ
    により撮像された被ボンデイング部品の情報を２
    値化回路により２値化した後、予め求められてい
    るＸＹテーブル駆動機構上の座標点を基準として
    被ボンデイング部品のＸ方向及びＹ方向の中心と
    のずれ量を算出し、該算出された値を基にボンデ
    イング点の座標を求めて記憶するようにしたこと
    を特徴とするボンデイング装置。 (2) 前記画像処理手段により撮像される被ボン
    デイング部品は、パツドてあることを特徴とする
    請求項１記載のボンデイング装置。
JP1989085647U 1989-07-24 1989-07-24 ボンディング装置 Expired - Fee Related JP2513151Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989085647U JP2513151Y2 (ja) 1989-07-24 1989-07-24 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989085647U JP2513151Y2 (ja) 1989-07-24 1989-07-24 ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0325237U true JPH0325237U (ja) 1991-03-15
JP2513151Y2 JP2513151Y2 (ja) 1996-10-02

Family

ID=31634888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989085647U Expired - Fee Related JP2513151Y2 (ja) 1989-07-24 1989-07-24 ボンディング装置

Country Status (1)

Country Link
JP (1) JP2513151Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002157582A (ja) * 2000-11-21 2002-05-31 Matsushita Electric Ind Co Ltd 半導体ウエハ上のｉｃ傾き補正方法、及びｉｃ傾き補正装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS575342A (en) * 1980-06-11 1982-01-12 Fujitsu Ltd Pattern center position recognition system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS575342A (en) * 1980-06-11 1982-01-12 Fujitsu Ltd Pattern center position recognition system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002157582A (ja) * 2000-11-21 2002-05-31 Matsushita Electric Ind Co Ltd 半導体ウエハ上のｉｃ傾き補正方法、及びｉｃ傾き補正装置

Also Published As

Publication number Publication date
JP2513151Y2 (ja) 1996-10-02

Similar Documents

Publication Publication Date Title
JPH0325237U (ja)
JPS60132399A (ja) 電子部品の位置規正方法
JPH0212024B2 (ja)
JPH0323930U (ja)
JPS6339118B2 (ja)
JPH0547470Y2 (ja)
JPS61136538U (ja)
CN207733080U (zh) 一种印刷电路板焊接平台
JPS6251741U (ja)
JPH02104406U (ja)
JPH01127052U (ja)
JPS61138245U (ja)
JPS57183046A (en) Wire bonding device
JPH01124072A (ja) ピックアンドプレイス
JPS582098A (ja) 部品の自動位置決め接合装置
JPS63169034A (ja) 半導体デバイス組立装置
JPH0864630A (ja) ワイヤボンディング方法
JPS609258U (ja) ボンデイング接合条件の制御装置
JPH0348227U (ja)
JPH0436111Y2 (ja)
JPH0220333U (ja)
JPS6335377U (ja)
JPS62116599U (ja)
JPH05198624A (ja) Ｉｃチップ実装装置
JPS6113930U (ja) ボンデイング装置用半導体素子認識装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees