JPH0324513Y2 - - Google Patents

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Publication number
JPH0324513Y2
JPH0324513Y2 JP19179886U JP19179886U JPH0324513Y2 JP H0324513 Y2 JPH0324513 Y2 JP H0324513Y2 JP 19179886 U JP19179886 U JP 19179886U JP 19179886 U JP19179886 U JP 19179886U JP H0324513 Y2 JPH0324513 Y2 JP H0324513Y2
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JP
Japan
Prior art keywords
substrate
push
board
substrates
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19179886U
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Japanese (ja)
Other versions
JPS6396054U (en
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Filing date
Publication date
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Priority to JP19179886U priority Critical patent/JPH0324513Y2/ja
Publication of JPS6396054U publication Critical patent/JPS6396054U/ja
Application granted granted Critical
Publication of JPH0324513Y2 publication Critical patent/JPH0324513Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 産業上の利用分野 本考案は、積み重ねて保管されている基板を一
枚ずつ分離して次の処理工程に移送するための分
離排出装置に関する。
[Detailed Description of the Invention] Industrial Application Field The present invention relates to a separating and discharging device for separating stacked and stored substrates one by one and transporting them to the next processing step.

従来の技術 基板は一般にその製作工程間では保護容器を兼
ねたマガジンに複数枚収容された状態で搬送され
る。このため、マガジンに収容された基板をマガ
ジンから取り出して基板処理装置に供給し、処理
終了後に基板処理装置から排出して再びマガジン
に収容する基板給排装置が多用されている。この
マガジン内に積まれた基板は、一般に吸着パツド
等の手段により基板表面に負圧を作用させて吸着
分離されているが、表面が平滑な新基板が積層さ
れている場合には基板と基板との間に空気の層が
ないため、吸着パツドが2枚以上の基板を同時に
持ち上げてしまう欠点があつた。複数の基板が同
時に搬送されると、途中で何枚かが脱落して破損
したり、次工程に余分な基板が送られて作業がス
トツプするなど、様々な不都合が発生するので、
基板を確実に一枚ずつ分離する機構が必要とされ
る。
2. Description of the Related Art In general, a plurality of substrates are stored in a magazine that also serves as a protective container and are transported between manufacturing processes. For this reason, substrate loading and unloading devices are often used, which take out the substrates housed in the magazine from the magazine, supply them to the substrate processing apparatus, and after the processing is completed, discharge them from the substrate processing apparatus and again house them in the magazine. The substrates stacked in this magazine are generally separated by suction by applying negative pressure to the surface of the substrate using a means such as a suction pad, but if a new substrate with a smooth surface is stacked, the substrate Since there is no air layer between the two, the suction pad has the drawback of picking up two or more substrates at the same time. When multiple boards are transported at the same time, various inconveniences can occur, such as some boards falling off and being damaged, or extra boards being sent to the next process, causing work to stop.
A mechanism is required to reliably separate the substrates one by one.

そこで従来の吸着パツドに加えて、基板を吸着
上昇させる際に圧縮空気を基板に吹き付けて一枚
だけを分離するような機構が提案されたが、前述
したように基板と基板とが密着しているので確実
な分離は困難であつた。
Therefore, in addition to the conventional suction pad, a mechanism has been proposed in which compressed air is blown onto the substrate to separate it when the substrate is lifted up by suction, but as mentioned above, the two substrates are in close contact with each other. It was difficult to separate them reliably because of the presence of

さらに基板の中には任意の位置に穴があけられ
ている穴明き基板(スルホール基板)が存在する
ため、吸着パツドの位置をずらす必要があつた
り、それでもなお吸着できないような状態も発生
していた。基板表面を保護するために、表面への
機械的接触は最小限にとどめる必要があり、吸着
パツドの利用はあまり望まいものではない。
Furthermore, some substrates have holes drilled at arbitrary positions (through-hole substrates), so it may be necessary to shift the position of the suction pad, or there may be situations where the suction pad still cannot be suctioned. was. To protect the substrate surface, mechanical contact with the surface must be kept to a minimum and the use of suction pads is less desirable.

また一般に基板は専用の積みマガジン内に収納
されるが、基板の寸法が変るごとにマガジンを用
意しなければならない。例えば50mm角から125mm
角までの広範なサイズに対応できるようなマガジ
ンは製作が困難である。従つて多数の実装マガジ
ンと空マガジンのストツカが必要になり、装置が
大型になつてスペース効率が悪いという欠点があ
る。
Further, although substrates are generally stored in a dedicated stacking magazine, a magazine must be prepared each time the size of the substrate changes. For example, from 50mm square to 125mm
It is difficult to manufacture magazines that can accommodate a wide range of sizes up to the corners. Therefore, a large number of loaded magazines and a stocker for empty magazines are required, resulting in a large device and a disadvantage that space efficiency is poor.

さらに、マガジン内に積層された基板をその上
端から一枚ずつ取り出す方式では、後から補充さ
れた基板が先に取り出される結果となるため、工
程のロツト管理が複雑になるという欠点があつ
た。
Furthermore, in the method of taking out the substrates stacked in the magazine one by one from the top end, the substrates added later are taken out first, which has the disadvantage of complicating the lot management of the process.

考案が解決しようとする問題点 本考案の目的は、従来技術の欠点を克服できる
ように、基板の種類や寸法の大小にかかわらず確
実に一枚だけを分離することができ、基板を入れ
るためのマガジンを使用せず、先入れ先出しの原
則に従つて基板を排出することが可能な基板の分
離排出装置を提供することにある。
Problems to be Solved by the Invention The purpose of the invention is to overcome the shortcomings of the prior art, to be able to reliably separate only one board regardless of the type or size of the board, and to be able to insert the board into the board. To provide a substrate separation/discharge device capable of discharging substrates according to the first-in, first-out principle without using a magazine.

問題点を解決するための手段とその作用 本考案の前述した目的は、多数の基板を鉛直方
向に向けた状態で斜め方向に整列させて収容する
傾斜したストツカと、該ストツカの下端付近に設
けられて最下端位置にある基板の各上下位置に当
接する上部ストツパ及び下部ストツパと、前記上
部ストツパに隣接して配置された押下げ板と、前
記下部ストツパに隣接して配置された押上げ板
と、該押上げ板に隣接して配置された圧縮空気噴
射ノズルとを備えて成る基板の分離排出装置によ
つて達成される。
Means for Solving the Problems and Their Effects The above-mentioned objects of the present invention are to provide an inclined stocker for accommodating a large number of boards in diagonal alignment with the boards facing vertically; an upper stopper and a lower stopper that come into contact with the upper and lower positions of the board at the lowest end position; a push-down plate that is arranged adjacent to the upper stopper; and a push-up plate that is arranged adjacent to the lower stopper. and a compressed air injection nozzle located adjacent to the lift plate.

かかる構成に基づき、本考案によれば多数の基
板が鉛直方向に向いた状態で傾斜したストツカ内
に斜め方向に整列させられて収容される。従つ
て、隣接する基板との間には斜め方向に段差を生
じると共に重力による押下げ力が作用することに
なり、自重による送り込みが行われる。ストツカ
の最下端位置にある基板は上部ストツパと下部ス
トツパとでその位置を固定されており、最初に押
上げ板が作動してその基板だけを上昇させる。こ
の時噴射ノズルから圧縮空気を基板の底部に向け
て吹き付けると、基板の下端が下部ストツパから
離れる瞬間にその下端が前方へと揺動して第2番
目の基板から離れる。続いて押下げ板が作動し、
基板の上端が上部ストツパから離れると基板は自
重によつて落下し、次工程へと送られる。
Based on this configuration, according to the present invention, a large number of substrates are housed in a diagonally aligned manner in an inclined stocker while facing vertically. Therefore, a step is created in the diagonal direction between adjacent substrates, and a downward force due to gravity acts, so that feeding is performed by the substrate's own weight. The substrate at the lowest position of the stocker is fixed in position by an upper stopper and a lower stopper, and the push-up plate is activated first to lift only that substrate. At this time, when compressed air is blown toward the bottom of the substrate from the injection nozzle, the moment the lower end of the substrate leaves the lower stopper, the lower end swings forward and separates from the second substrate. Then the push-down plate operates,
When the upper end of the substrate leaves the upper stopper, the substrate falls under its own weight and is sent to the next process.

従つて本考案によれば次のような作用効果が得
られる。
Therefore, according to the present invention, the following effects can be obtained.

1 吸着パツドを使用しないので基板表面に触れ
ることなく基板を分離することが出来る。
1. Since no suction pad is used, the substrate can be separated without touching the substrate surface.

2 隣接する基板相互間に段差があるので、密着
の程度が弱められ分離が容易になる。
2. Since there is a step difference between adjacent substrates, the degree of adhesion is weakened and separation becomes easier.

3 穴明き基板であつても穴なし基板と同様に取
扱うことが出来る。
3. Even a board with holes can be handled in the same way as a board without holes.

4 専用の積みマガジンを必要としない。4. Does not require a dedicated stacking magazine.

5 新基板の送り込みには自重を利用しているの
で、特別な動力源を必要としない。
5. Since the new board is fed using its own weight, no special power source is required.

6 基板の寸法を変更する場合は、上下のストツ
パや押上げ板と押下げ板の位置を調整するだけ
でほとんど対応することが出来る。
6. When changing the dimensions of the board, most changes can be made simply by adjusting the upper and lower stoppers and the positions of the push-up and push-down plates.

7 装置を停止させることなく新基板を補充する
ことが出来る。
7 New boards can be added without stopping the equipment.

8 先に収容された基板から順に次工程へと搬送
されるので、先入れ先出しの原則が守られ工程
のロツト管理が容易にならる。
8. Since the substrates accommodated first are transported to the next process in order, the first-in, first-out principle is followed and process lot management is facilitated.

9 各種の自動化装置に容易に接続できる。9. Can be easily connected to various automation devices.

本考案の他の特徴及び利点は、添付図面の実施
例を参照した以下の記載により明らかとなろう。
Other features and advantages of the invention will become apparent from the following description with reference to the embodiments of the accompanying drawings.

実施例 第1図は本考案による分離排出装置の基本的な
機構を表わしており、多数の基板10をそれぞれ
鉛直方向に向いた状態で傾斜したストツカ11内
に斜め方向に整列させて収容する。基板投入部1
2の上端には、ストツカの傾斜に対応して鉛直と
なる押圧面30Aを備えた加圧重錘30を載置
し、基板の倒れを防止すると共に基板を基板分離
部13まで送り込むようにする。投入部12から
入れられた新しい基板は、第2図(基板が大きい
場合)第3図(基板が小さい場合)の断面図に示
すように、基板の下面を摺動させる下部ガイドバ
ー14と基板の側面を摺動させる側部ガイドバー
15とに接触して案内され、分離13に送られ
る。
Embodiment FIG. 1 shows the basic mechanism of the separating and discharging apparatus according to the present invention, in which a large number of substrates 10 are housed in an inclined stocker 11 in an oblique direction, each facing vertically. Board input section 1
A pressurizing weight 30 having a pressing surface 30A that becomes vertical according to the inclination of the stocker is placed on the upper end of 2 to prevent the substrate from falling and to feed the substrate to the substrate separating section 13. . As shown in the cross-sectional views of FIG. 2 (in the case of a large substrate) and FIG. 3 (in the case of a small substrate), the new substrate inserted from the input section 12 is placed between the lower guide bar 14 that slides on the bottom surface of the substrate, and the substrate. is guided in contact with a side guide bar 15 that slides on the side surface of the container, and is sent to the separation 13.

基板分離部13には、最下端位置にある基板1
0Aの上端付近に当接する上部ストツパ16、基
板10Aの下端付近に当接する下部ストツパ1
7、上部ストツパ16に隣接する押下げ板18、
下部ストツパ17に隣接する押上げ板19、押下
げ板18を駆動するシリンダ20、押下げ板19
を駆動するシリンダ21、基板の上面が突出しな
いように案内する基板ガイド22、及び押上げ板
19に隣接する圧縮空気噴射ノズル28が配置さ
れている。かかる配置に基づき、基板分離部13
では、第4図乃至第6図に示すような分離動作が
行われる。
The substrate separation unit 13 has the substrate 1 located at the lowermost position.
Upper stopper 16 abuts near the upper end of 0A, lower stopper 1 abuts near the lower end of board 10A
7. A push-down plate 18 adjacent to the upper stopper 16;
A push-up plate 19 adjacent to the lower stopper 17, a cylinder 20 that drives the push-down plate 18, and a push-down plate 19.
A cylinder 21 for driving the substrate, a substrate guide 22 for guiding the substrate so that the upper surface thereof does not protrude, and a compressed air injection nozzle 28 adjacent to the push-up plate 19 are arranged. Based on this arrangement, the substrate separating section 13
Then, the separation operation as shown in FIGS. 4 to 6 is performed.

第4図において、最下端の基板10Aは上下の
ストツパ16,17により制止されており、最初
にシリンダ21が作動して押上げ板19を駆動
し、押上げ板19の上端が基板10Aを押し上げ
る。基板10Aは下部ストツパ17に沿つて押し
上げられる。これと同時に圧縮空気噴射ノズル2
8から基板10Aの底面に向けて清浄な圧縮空気
を噴射する。この時、基板10Aの上端付近は最
下端から2番目の基板10Bにより下方に押され
ているので、基板10Aの下端が下部ストツパ1
7から離れる瞬間に空気噴射力の作用が加わつて
基板10Aは第5図の矢印で示すように円弧を描
いて揺動し、基板10Bから離れた後に上部スト
ツパ16の傾斜面16Aにならつた位置で停止す
る。次にシリンダ20が作動して押下げ板18を
駆動し、押下げ板18の下端が基板10Aを下方
へ押し出す。押下げ板18の先端は、第4図に示
すように幅が狭くなつた平坦部18Aと内側側面
のテーパ部18Bとで形成されており、第6図に
示すように平坦部18Aで基板10Aを押し出す
と同時にテーパ部18Bで次の基板10Bを押し
戻す働きをする。かくして基板10Aは他の基板
から分離されて押し出され、滑走案内板23上を
滑つて基板検出センサー24により基板の分離排
出が確認され、次工程のコンベアベルト25(例
えば印刷機自動化装置)へと送られる。噴射ノズ
ル28からの空気の噴射を停止させ、シリンダ2
0,21を初期の位置に復帰させると、次の基板
10Bが10Aの位置に停止するので、前述した
分離排出動作を繰り返す。
In FIG. 4, the lowest board 10A is stopped by upper and lower stoppers 16 and 17, and the cylinder 21 is activated first to drive the push-up plate 19, and the upper end of the push-up board 19 pushes up the board 10A. . The substrate 10A is pushed up along the lower stopper 17. At the same time, compressed air injection nozzle 2
Clean compressed air is injected from 8 toward the bottom surface of the substrate 10A. At this time, the vicinity of the upper end of the board 10A is pushed downward by the second board 10B from the bottom, so the lower end of the board 10A is pushed downward by the lower stopper 1.
At the moment of separation from the substrate 10B, the air jet force is applied to the substrate 10A, causing the substrate 10A to swing in an arc as shown by the arrow in FIG. Stop at. Next, the cylinder 20 operates to drive the push-down plate 18, and the lower end of the push-down plate 18 pushes the substrate 10A downward. As shown in FIG. 4, the tip of the push-down plate 18 is formed of a flat part 18A with a narrow width and a tapered part 18B on the inner side surface, and as shown in FIG. At the same time, the tapered portion 18B functions to push back the next substrate 10B. In this way, the substrate 10A is separated from other substrates and pushed out, slides on the sliding guide plate 23, the separation and discharge of the substrate is confirmed by the substrate detection sensor 24, and the substrate is transferred to the next process conveyor belt 25 (for example, a printing press automation device). Sent. The injection of air from the injection nozzle 28 is stopped, and the cylinder 2
When substrates 0 and 21 are returned to their initial positions, the next substrate 10B is stopped at position 10A, and the above-described separation and ejection operation is repeated.

なお、押上げ板19の板厚は基板10の板厚よ
りも小さくする。押下げ板18の中央部分の板厚
は基板一枚分よりも大きく二枚分よりも小さい寸
法とし、先端の平坦部18Aの厚さは基板の板厚
と同じかやや小さい寸法にする。
Note that the thickness of the push-up plate 19 is made smaller than the thickness of the substrate 10. The thickness of the central part of the push-down plate 18 is larger than that of one board and smaller than that of two boards, and the thickness of the flat part 18A at the tip is the same as or slightly smaller than the thickness of the board.

第7図は、本考案の実施例による分離排出装置
の正面図であり、押上げ板19の上面は19A,
19B,19Cの3カ所の突出部で形成され、突
出部の谷間の位置2カ所に圧縮空気噴射ノズル2
8が設けられている。従つて、第5図においてノ
ズル28から噴射される空気は押上げ板19には
衝突せず、直接基板10Bと10Bの間の隙間に
向つて噴射されていることを理解されたい。前述
したように、基板相互間には段差があるので密着
の程度が弱められており、基板の間の隙間にめが
けて圧縮空気を噴射することは、両者を分離する
のに有効な手段となる。
FIG. 7 is a front view of the separation and discharge device according to the embodiment of the present invention, in which the upper surface of the push-up plate 19 is 19A,
It is formed by three protruding parts 19B and 19C, and compressed air injection nozzles 2 are installed at two positions between the valleys of the protruding parts.
8 is provided. Therefore, it should be understood that in FIG. 5, the air injected from the nozzle 28 does not collide with the push-up plate 19, but is directly injected toward the gap between the substrates 10B and 10B. As mentioned above, since there is a step between the substrates, the degree of adhesion is weakened, and jetting compressed air into the gap between the substrates is an effective means to separate them. .

第8図は第7図の装置の右側面を表わしてお
り、上部ストツパ16と押下げ板18の摺動面が
鉛直面に対して角度θだけ傾斜している状態が示
されている。第9図は第8図の矢視R部分を表わ
している。
FIG. 8 shows the right side of the device shown in FIG. 7, and shows a state in which the sliding surfaces of the upper stopper 16 and the push-down plate 18 are inclined at an angle θ with respect to the vertical plane. FIG. 9 shows a portion shown by arrow R in FIG.

製作工程のロツトが変つて、基板10の厚さや
縦横の寸法が変更される場合は、上下のストツパ
16,17や押下げ板18、押下げ板19等の一
部又は全部を調整したり交換したりすることによ
り、本考案の装置をほとんどそのまま利用するこ
とが出来る。
If the manufacturing process changes and the thickness or vertical and horizontal dimensions of the board 10 are changed, some or all of the upper and lower stoppers 16, 17, push-down plates 18, 19, etc. may be adjusted or replaced. By doing so, the device of the present invention can be used almost as is.

本考案の装置は、各種センサーやリミツトスイ
ツチを組合せて各動作の進行をシーケンス制御に
よつて実行することが望ましい。
It is preferable that the device of the present invention combines various sensors and limit switches to execute each operation by sequence control.

考案の効果 以上詳細に説明した如く、本考案によれば前述
したような作用効果が得られ、特に新しい基板を
その表面に接触することなく確実に一枚ずつ分離
できるようになつたので、高品質の厚膜回路基板
の製作が可能になる等、その実用的価値には顕著
なものがある。
Effects of the invention As explained in detail above, according to the present invention, the above-mentioned effects can be obtained, and in particular, new substrates can be reliably separated one by one without touching the surface, resulting in high performance. Its practical value is remarkable, such as making it possible to manufacture high-quality thick-film circuit boards.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による分離排出装置の機構を表
わす側断面図、第2図は第1図のP−P線に沿う
断面図であつて基板の摺動案内部を表わす正面断
面図、第3図は第2図と同様の正面断面図、第4
図は基板の静止状態を表わす側断面図、第5図は
基板が分離する状態を表わす側断面図、第6図は
基板が押し出される状態を表わす側断面図、第7
図は分離排出装置の正面図、第8図は第7図の中
央部分に沿つて右から見た側断面図、第9図は第
8図の矢視R部分の正面図である。 10……基板、11……ストツカ、112……
投入部、13……分離部、16……上部ストツ
パ、17……下部ストツパ、18……押下げ板、
19……押上げ板、28……噴射ノズル。
1 is a side cross-sectional view showing the mechanism of the separation and discharge device according to the present invention; FIG. 2 is a front cross-sectional view taken along line P-P in FIG. Figure 3 is a front sectional view similar to Figure 2, and Figure 4 is a front sectional view similar to Figure 2.
Figure 5 is a side sectional view showing the board in a stationary state, Figure 5 is a side sectional view showing the board being separated, Figure 6 is a side sectional view showing the board being pushed out, and Figure 7 is a side sectional view showing the board being pushed out.
The figure is a front view of the separation and discharge device, FIG. 8 is a side sectional view taken from the right along the center portion of FIG. 7, and FIG. 9 is a front view of the portion R in FIG. 8. 10... Board, 11... Stotsuka, 112...
Input part, 13...Separation part, 16...Upper stopper, 17...Lower stopper, 18...Pushing down plate,
19... Push-up plate, 28... Injection nozzle.

Claims (1)

【実用新案登録請求の範囲】 多数の基板を鉛直方向に向けた状態で斜め方向
に整列させて収容する傾斜したストツカと、 該ストツカの下端付近に設けられて最下端位置
にある基板の各上下位置に当接する上部ストツパ
及び下部ストツパと、 前記上部ストツパに隣接して配置された押下げ
板と、 前記下部ストツパに隣接して配置された押上げ
板と、 該押上げ板に隣接して配置された圧縮空気噴射
ノズルとを備えることを特徴とする基板の分離排
出装置。
[Claims for Utility Model Registration] An inclined stocker for accommodating a large number of boards in diagonal alignment while facing in the vertical direction; and an inclined stocker that accommodates a large number of boards arranged in a diagonal direction while facing in the vertical direction; an upper stopper and a lower stopper that abut against the position; a push-down plate disposed adjacent to the upper stopper; a push-up plate disposed adjacent to the lower stopper; and a push-up plate disposed adjacent to the push-up plate. 1. A substrate separation and discharge device comprising: a compressed air injection nozzle;
JP19179886U 1986-12-15 1986-12-15 Expired JPH0324513Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19179886U JPH0324513Y2 (en) 1986-12-15 1986-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19179886U JPH0324513Y2 (en) 1986-12-15 1986-12-15

Publications (2)

Publication Number Publication Date
JPS6396054U JPS6396054U (en) 1988-06-21
JPH0324513Y2 true JPH0324513Y2 (en) 1991-05-28

Family

ID=31146275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19179886U Expired JPH0324513Y2 (en) 1986-12-15 1986-12-15

Country Status (1)

Country Link
JP (1) JPH0324513Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002321842A (en) * 2001-04-25 2002-11-08 Okamura Corp Device for separating and feeding thin plate-shaped conveyed articles

Also Published As

Publication number Publication date
JPS6396054U (en) 1988-06-21

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