JPH02175536A - Separating by one piece and feeding device of printed substrate - Google Patents
Separating by one piece and feeding device of printed substrateInfo
- Publication number
- JPH02175536A JPH02175536A JP32828488A JP32828488A JPH02175536A JP H02175536 A JPH02175536 A JP H02175536A JP 32828488 A JP32828488 A JP 32828488A JP 32828488 A JP32828488 A JP 32828488A JP H02175536 A JPH02175536 A JP H02175536A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- stage
- suction
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 12
- 238000007790 scraping Methods 0.000 claims description 13
- 238000000926 separation method Methods 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
真空吸着と擦り切りを用いたプリント基板一枚分離供給
装置に関し、
多数枚の吸い上げによる吸着の失敗を無くした供給装置
の提供を目的とし、
Aステージに積み重ねられたプリント基板を上から吸着
し、吸着したまま、ローラ(211とストッパc!3と
の間隔をプリント基板の板厚に配設構成させた擦り切り
部を通過させ、一枚のみに分離させてからBステージに
移載するプリント基板一枚分離供給装置において、プリ
ント基板に設けた貫通孔が重ならないように、少なくと
も一方向にずらして積み重ねる手段をAステージ側に備
えるように構成する。[Detailed Description of the Invention] [Summary] Regarding a printed circuit board single sheet separation and supply device using vacuum suction and scraping, the purpose is to provide a supply device that eliminates suction failure due to suction of a large number of sheets, and stacks them on the A stage. The printed circuit board is sucked from above, and while it is still sucked, it is passed through the abrasion section between the roller (211 and stopper c!3) arranged to match the thickness of the printed circuit board, and separated into only one sheet. In the device for separating and feeding one printed circuit board from the other to the B stage, the A stage side is provided with a means for stacking the printed circuit boards by shifting them in at least one direction so that the through holes provided in the printed circuit boards do not overlap.
本発明は、真空吸着と擦り切りを用いたプリント基板供
給装置に関する。The present invention relates to a printed circuit board supply device using vacuum suction and scraping.
プリン1〜基板は、プリント配線、積層、孔明は等の加
工が行われて完成するが、板状であるので、その後の取
扱は積み重ねて運ばれ、必要時に一枚毎に取り出されて
加工機に供給している。Pudding 1 ~ The board is completed by processing such as printed wiring, lamination, and perforation, but since it is in the form of a plate, it is subsequently handled in stacks and transported, and when necessary, it is taken out one by one and sent to a processing machine. is supplied to.
このプリント基板供給装置は各種のものがあり、何れの
ものも、確実に一枚が供給出来、且つ、損傷させること
なく安全に、しかも効率よく供給することが要望される
。There are various types of printed circuit board supply devices, and it is required that each of them be able to reliably supply one board, safely and efficiently without causing damage.
ここで、自動部品装着機にプリント基板を供給する場合
の一例について説明する。Here, an example of supplying a printed circuit board to an automatic component mounting machine will be described.
第3図に従来の一例のプリント基板一枚方離供給装置を
示す。FIG. 3 shows an example of a conventional printed circuit board single sheet separating and feeding device.
第3図に示す如く、プリント基板供給装置35は、ロー
ラコンベヤ91と、ローラコンベヤ91のAステージに
プリント基板1を揃えて積み重ねる積み重ね部85と、
真空吸着器7と、擦り切り部2と、Bステージがある供
給コンベヤ92とから構成される。As shown in FIG. 3, the printed circuit board supply device 35 includes a roller conveyor 91, a stacking section 85 that aligns and stacks the printed circuit boards 1 on the A stage of the roller conveyor 91.
It is composed of a vacuum suction device 7, a scraping section 2, and a supply conveyor 92 with a B stage.
積み重ね部85は、払出押し板81と揃えストッパ86
と揃え押し板87と、図示省略のそれらの駆動機構とか
ら構成される。The stacking section 85 has a dispensing push plate 81 and an alignment stopper 86.
It is composed of an alignment push plate 87, and a driving mechanism thereof (not shown).
真空吸着器7は、吸着ヘッド71と、図示省略のその移
動機構及び真空ポンプとから構成される。The vacuum suction device 7 is composed of a suction head 71, a moving mechanism thereof, and a vacuum pump (not shown).
擦り切り部2は、ローラ21とストッパ22との間隔を
プリント基板1の板厚と同しに対向配設させた構成であ
る。The scraping section 2 has a configuration in which a roller 21 and a stopper 22 are disposed facing each other with a distance equal to the thickness of the printed circuit board 1.
このプリント基板供給装置35の動作は、図示省略のス
トッカーから、積み重ねの状態でローラコンベヤ91に
排出されたプリント基板1は、ローラコンベヤ91上を
搬送方向に可動自在とした垂直の払出押し板81により
所定距離押されて、Aステージ位置で、前方を直角な垂
直二面、X面Y面を備えた揃えストッパ86のX面と、
後方を払出押し板81とに挟まれ適度な隙間を持って配
置される。The operation of the printed circuit board supply device 35 is such that the printed circuit boards 1 are discharged from a stocker (not shown) to a roller conveyor 91 in a stacked state, and are transferred to a vertical delivery push plate 81 which is movable in the conveyance direction on the roller conveyor 91. is pushed a predetermined distance by, at the A stage position, the front of the alignment stopper 86 has two perpendicular planes, the X plane and the Y plane, and the X plane.
The rear part is sandwiched between the dispensing push plate 81 and is arranged with an appropriate gap.
次に、そのままの状態で、更に、ローラコンベヤ91の
搬送方向Y軸方向と直角なX軸方向に可動する、垂直面
の揃え押し板87が所定距離可動して、揃えストッパ8
6のY面との間にプリント基板1を押し込み、これによ
り、プリント基板1はAステジにて積み重ねの四辺を、
払出押し板81、揃え押し板87及び揃えストッパ86
の二面により、隙間をもって囲まれ、隙間があるのでプ
リント基板1の取り出しが容易に行え、且つ積み重ねが
位置ずれも少なく揃えられる。Next, in this state, the vertical alignment press plate 87, which is movable in the X-axis direction perpendicular to the conveyance direction Y-axis direction of the roller conveyor 91, moves a predetermined distance, and the alignment stopper 8
The printed circuit board 1 is pushed in between the Y plane of 6 and the four sides of the stack are
Dispensing push plate 81, alignment push plate 87, and alignment stopper 86
The printed circuit boards 1 are surrounded by two sides with a gap between them, and because of the gap, the printed circuit boards 1 can be easily taken out, and the printed circuit boards 1 can be stacked in alignment with less misalignment.
次に、吸着ヘッド71が移動して来て、上からプリント
基板1を吸着し、所定高さまで持ち上げ、そのままY方
向に水平に移動させ、揃えストッパ86のX面上縁に設
けた擦り切り部2を通過させると、擦り切り部2のロー
ラ21とストッパ22の対向間隔がプリント基板1の板
厚としであるので、同時に複数枚吸着されていても、一
番上に吸着のプリント基板1のみが通過出来、その下側
に同時に吸着されたプリント基板1は、ストッパ22に
当たり通過出来ずにAステージに落下し、再度積み重な
る。Next, the suction head 71 moves and suctions the printed circuit board 1 from above, lifts it up to a predetermined height, and then moves it horizontally in the Y direction. When passing the roller 21 of the scraping section 2 and the stopper 22, the spacing between them is equal to the thickness of the printed circuit board 1, so even if multiple boards are sucked at the same time, only the topmost printed circuit board 1 will pass. The printed circuit boards 1, which are produced and simultaneously attracted to the lower side thereof, hit the stopper 22 and cannot pass through, falling onto the A stage and being stacked again.
かくして、吸着された一番上のプリント基板1のみがB
ステージまで運ばれて、吸着を解いて移載される。In this way, only the topmost printed circuit board 1 that has been sucked is B.
It is carried to the stage, released from suction, and transferred.
しかしながら、
■ プリント基板lには部品リード挿入孔、スルーホー
ル等の貫通孔11が多数設けてあり、吸着ヘッド72の
吸着面積内にも多数の貫通孔11が在る場合には、吸着
時に貫通孔11を通じて多数枚のプリント基板1を吸い
上げようとするために、プリント基板1の自重で吸着出
来なくなることが屡発生していた。However, if the printed circuit board l has many through holes 11 such as component lead insertion holes and through holes, and there are many through holes 11 within the suction area of the suction head 72, the When trying to suck up a large number of printed circuit boards 1 through the holes 11, it often happens that the printed circuit boards 1 cannot be sucked up due to their own weight.
■ 真空吸着器7での吸着の失敗があると、異常状態と
判断して、自動供給装置を停止させてしまい、この場合
、人手により異常チエツクを行い、異常なしを確認して
からでないと、再稼働は行えず、人手を要し、装置の稼
働率を悪化させていた。■ If there is a suction failure in the vacuum suction device 7, it will be judged as an abnormal condition and the automatic feeding device will be stopped. It was not possible to restart the system, which required manpower and worsened the equipment's operating rate.
■ 吸着力を増やせば、吸着の失敗を少なくし得るが、
後の擦り切り部2を通過させる際に、下側の吸着プリン
ト基板1の吸着力も大となり、吸着へンド71のみが滑
ってしまい、プリント基板1を擦り切ることが出来なく
なる。■ Increasing the suction power can reduce suction failures, but
When passing through the subsequent scraping section 2, the suction force of the lower suction printed circuit board 1 also increases, and only the suction head 71 slips, making it impossible to scrape off the printed circuit board 1.
等の問題点があった。There were problems such as.
本発明は、かかる問題点に鑑みて、多数枚の吸い上げに
よる吸着の失敗を無くした供給装置の提供を目的とした
ものである。SUMMARY OF THE INVENTION In view of these problems, it is an object of the present invention to provide a feeding device that eliminates suction failures caused by sucking up a large number of sheets.
上記問題点は、第1図の原理構成図に示す如く、Aステ
ージに積み重ねられたプリント基板1を上から吸着し、
吸着したまま、ローラ21とストッパ22との間隔をプ
リント基板1の板厚に配設構成させた擦り切り部2を通
過させ、一枚のみに分離させてからBステージに移載す
るプリント基板−・枚方離供給装置3において、プリン
ト基板1に設けた貫通孔11が重ならないように、少な
くとも一方向にずらして積み重ねる手段をAステージ側
に備える、本発明のプリント基板一枚方離供給装置によ
り解決される。The above problem is solved by suctioning the printed circuit boards 1 stacked on the A stage from above, as shown in the principle configuration diagram in FIG.
While adsorbed, the printed circuit board is passed through the scraping section 2 in which the distance between the roller 21 and the stopper 22 is arranged to match the thickness of the printed circuit board 1, and the printed circuit board is separated into only one sheet and then transferred to the B stage. This problem is solved by the printed circuit board separating and supplying device 3 of the present invention, which is equipped with a means for stacking the printed circuit boards 1 while shifting them in at least one direction so that the through holes 11 provided in the printed circuit boards 1 do not overlap on the A stage side. Ru.
即ち、貫通孔が上下でずれれば、プリント基板は上下2
枚のみが吸着され、多数枚吸着による吸着の失敗は無く
なり、目的が適えられる。In other words, if the through holes are shifted vertically, the printed circuit board will be
Only the sheets are suctioned, and there is no suction failure caused by suctioning a large number of sheets, and the purpose can be achieved.
第1図(a)に本発明の原理構成図、同図(b)に同H
部拡大図を示す。FIG. 1(a) is a diagram showing the principle configuration of the present invention, and FIG. 1(b) is a diagram of the principle of the present invention.
An enlarged view of the part is shown.
プリント基板1の払出は、同種のもの毎に積み重ねられ
て行われるので、プリント基板1に設けられた各種の貫
通孔11、例えば、スルーホールや部品リードの挿入孔
等、は当然実装格子上の同一位置に設けられており、第
1図(b)に示すように、Aステージで揃える時に、上
下隣接のプリント基板1間でその貫通孔11の孔径以上
ずらせば、貫通孔11は一枚のみで塞がり、吸着ヘッド
71で吸着した場合に、吸着プリント基板1と、その直
下の一枚の計2枚のみが吸着され、多数枚が吸い上げら
れることは無くなる。Since the printed circuit boards 1 are stacked in piles of the same type, the various through holes 11 provided in the printed circuit boards 1, such as through holes and insertion holes for component leads, are naturally placed on the mounting grid. They are provided at the same position, and as shown in FIG. 1(b), if the upper and lower adjacent printed circuit boards 1 are shifted by more than the hole diameter of the through hole 11 when aligning them on the A stage, only one through hole 11 will be left. When the suction head 71 suctions the suction head 71, only the suction printed circuit board 1 and the one immediately below it are suctioned, and a large number of sheets are not suctioned up.
このプリント基板1の積み重ねのずらし方向は、一方向
のずらし或いは二方向としてもよい。The direction in which the printed circuit boards 1 are stacked may be shifted in one direction or in two directions.
又、このずらし手段としては、例えば、平行傾斜面間に
積み重ねプリント基板1を押し当てる等により容易にず
らすことが出来る。Further, as this shifting means, for example, the stacked printed circuit boards 1 can be pressed against each other between parallel inclined surfaces, etc. to easily shift the printed circuit boards 1.
かくして、多数枚の吸い上げによる吸着の失敗を無くし
た供給装置の提供が可能となる。In this way, it is possible to provide a feeding device that eliminates suction failure due to suction of a large number of sheets.
以下図面に示す実施例によって本発明の要旨を具体的に
説明する。全図を通し同一符号は同一対象物を示し、第
2図(a)に本発明の一実施例の構成図、同図(b)に
同Y矢夜回を示す。The gist of the present invention will be specifically explained below with reference to embodiments shown in the drawings. The same reference numerals indicate the same objects throughout the drawings, and FIG. 2(a) is a block diagram of an embodiment of the present invention, and FIG. 2(b) is a diagram showing the same Y-axis.
本実施例は、自動部品装着機に積み重ねたプリント基板
から一枚づつ取り出して供給させる装置に適用させたも
のである。The present embodiment is applied to a device that takes out and supplies printed circuit boards one by one from stacked printed circuit boards to an automatic component mounting machine.
プリント基板供給装置31は、第2図(a)のように、
ローラコンベヤ91と、ローラコンベヤ91のAステー
ジにプリント基板lをずらして積み重ねる積み重ね部8
と、真空吸着器7と、擦り切り部2と、Bステージがあ
る供給コンベヤ92とから構成される。The printed circuit board supply device 31, as shown in FIG. 2(a),
A roller conveyor 91 and a stacking section 8 that shifts and stacks printed circuit boards l on the A stage of the roller conveyor 91.
, a vacuum suction device 7, a scraping section 2, and a supply conveyor 92 with a B stage.
積み重ね部8は、払出押し板81と、揃えストッパ82
と、ずらし押し板A83と、同板B84と、図示省略の
それらの駆動機構とから構成される。The stacking section 8 includes a dispensing push plate 81 and an alignment stopper 82.
, a shift and push plate A83, a same plate B84, and their drive mechanisms (not shown).
真空吸着器7は、吸着ヘッド71と、上昇/下降シリン
ダ72と、図示省略の移動機構及び真空ポンプとから構
成される。The vacuum suction device 7 is composed of a suction head 71, a rising/lowering cylinder 72, a moving mechanism and a vacuum pump (not shown).
擦り切り部2は、ローラ21とストッパ22との間隔を
プリント基板1の板厚と同じに対向配設させた構成であ
る。The scraping section 2 has a configuration in which a roller 21 and a stopper 22 are disposed facing each other with the same distance as the thickness of the printed circuit board 1.
このプリント基板供給装置31の動作は、図示省略のス
トッカーから、積み重ねの状態でローラコンベヤ91に
排出されたプリント基板1は、ローラコンベヤ91上を
搬送方向に可動自在とした垂直の払出押し板81により
所定距離押されて、Aステージ位置で、前方を直角な垂
直二面、X面Y面を備えた揃えストッパ82のX面と、
後方を払出押し板81とに挟まれ適度な隙間を持って配
置される。The operation of this printed circuit board supply device 31 is such that the printed circuit boards 1 are discharged from a stocker (not shown) to a roller conveyor 91 in a stacked state, and a vertical delivery push plate 81 that is movable in the conveying direction on the roller conveyor 91 is used. is pushed a predetermined distance by, at the A stage position, the front of the alignment stopper 82 has two perpendicular planes, an X plane and a Y plane, and the X plane thereof;
The rear part is sandwiched between the dispensing push plate 81 and is arranged with an appropriate gap.
次に、そのままの状態で、更に、第2図(b)に示す如
く、ローラコンベヤ91の搬送方向、Y軸方向と直角な
X軸方向に可動する、直立の三角波形端面を有し、嵌ま
り合う関係位置に対向して設けられたずらし押し板A8
3と同板B84とで、積み重ねられたプリント基板1を
挟みつけて、端面の三角波形に、X軸方向に複数枚毎に
向きを変えて交互にずらして積み重ねる。Next, as shown in FIG. 2(b), as shown in FIG. Shifting push plate A8 provided opposite to the mating related position
The stacked printed circuit boards 1 are sandwiched between 3 and the same board B84, and stacked in a triangular waveform on the end face, with the direction of each plurality of boards changed in the X-axis direction and alternately shifted.
このずらしは、1.6%板厚の使用プリント基板1の貫
通孔11の直径0.4〜1.2ミリに適する如く、1.
2ミ1.ずれるようにしてあり、プリント基板1の実装
格子は2.5ミリを使用しているので、貫通孔11が重
なることは無くなる。This shift is 1.2 mm so as to be suitable for the diameter of 0.4 to 1.2 mm of the through hole 11 of the printed circuit board 1 with a board thickness of 1.6%.
2 mi 1. Since the mounting grid of the printed circuit board 1 is 2.5 mm, the through holes 11 do not overlap.
尚、ずらし積み重ねたた後に、ずらし押し板A83及び
同B84は共に、プリント基板1の吸着取り出しに差支
え無い位置まで後退する。Incidentally, after shifting and stacking, both the shifting and pushing plates A83 and B84 retreat to a position where there is no problem in suctioning and taking out the printed circuit boards 1.
これにより、プリント基板1はAステージにて積み重ね
の四辺を、払出押し板81、揃えストッパ82の二面、
及びずらし押し板A83の端面により囲まれ、X軸方向
に貫通孔11が重なら無いようにずれて積み重ね揃えら
れ、積み重ね数が多量になってもローラコンベヤ91の
幅からはみ出ることなく積み重ねが行える。As a result, the printed circuit boards 1 are stacked on the A stage so that the four sides of the stack are the two sides of the payout push plate 81, the alignment stopper 82,
The through holes 11 are stacked and aligned so that they do not overlap in the X-axis direction, and even if the number of stacks becomes large, stacking can be performed without protruding from the width of the roller conveyor 91. .
次に、吸着ヘッド71が移動して来て、上昇/下降シリ
ンダ72が働き、上からプリン1一基板1を吸着し、所
定高さまで持ち上げ、そのままY方向に水平に移動させ
、揃えストッパ82のX面上縁に設けた擦り切り部2を
通過させると、擦り切り部2のローラ21とストッパ2
2の対向間隔がプリント基板1の板厚としであるので、
同時に複数枚吸着されていても、一番上に吸着のプリン
1一基板1のみが通過出来、その下側に同時に吸着され
たプリント基板1は、ストッパ22に当たり通過出来ず
にAステージに落下し、再度積み重なる。Next, the suction head 71 moves, and the raising/lowering cylinder 72 operates to suction the print 1 and the substrate 1 from above, lift it up to a predetermined height, and move it horizontally in the Y direction. When passing through the scraping section 2 provided on the upper edge of the X plane, the roller 21 of the scraping section 2 and the stopper 2
Since the facing interval of 2 is equal to the thickness of the printed circuit board 1,
Even if multiple boards are suctioned at the same time, only the printed circuit board 1 and the printed circuit board 1 that are suctioned at the top can pass, and the printed circuit board 1 that is suctioned at the bottom at the same time hits the stopper 22 and cannot pass and falls to the A stage. , pile up again.
この吸着枚数はずらしにより2枚であるが、稀に3枚の
こともあるが、吸着の失敗は殆ど無くなった。The number of sheets to be suctioned is two due to the shift, but in rare cases it is three, but failures in suction have almost disappeared.
かくして、吸着された一番上のプリント基板1のみがB
ステージまで運ばれて、吸着を解いて移載される。In this way, only the topmost printed circuit board 1 that has been sucked is B.
It is carried to the stage, released from suction, and transferred.
上記実施例は一例を示し、ずらし積み重ねをX軸方向に
て行わせたが、揃えストッパ82のX面と、払出押し板
81の押し面とにずらし斜面を設けてX軸方向にて行わ
せることも差支えない。The above embodiment shows an example, and the stacking is performed in the X-axis direction, but the stacking is performed in the X-axis direction by providing a tilted slope on the X surface of the alignment stopper 82 and the pushing surface of the dispensing push plate 81. There is no problem with that.
以上の如く、本発明の供給装置により、多数枚の吸い上
げによる吸着の失敗を、従来のものと比べ1710以下
に低減させることが出来、装置の稼働率の向上と、取扱
作業者を減らすことが出来、その効果は著しいものがあ
る。As described above, with the feeding device of the present invention, the number of suction failures caused by sucking up a large number of sheets can be reduced to 1710 or less compared to the conventional device, improving the operating rate of the device and reducing the number of handling workers. Yes, the effect is remarkable.
第1図は本発明の原理図、
第2図は本発明の一実施例、
第3図は従来の一例のプリント基板一枚分離供給装置で
ある。
図において、
1はプリント基板、 2は擦り切り部、3はプリント基
板一枚分離供給装置、
7は真空吸着器、 8,85は積み重ね部、11は貫
通孔、 21はローラ、22はストッパ、
3L35はプリント基板供給装置、
71は吸着ヘッド、
72は上昇/下降シリンダ、
81は払出押し板、 82.86は揃えストッパ、8
3はずらし押し板A、84はずらし押し板B、87は揃
え押し板、 91はローラコンベヤ、92は供給コン
ベヤである。
−271=
僅来の一伽1のプリントI阪−較分離供飴装置1 3
図FIG. 1 is a diagram showing the principle of the present invention, FIG. 2 is an embodiment of the present invention, and FIG. 3 is a conventional example of a single printed circuit board separation and supply device. In the figure, 1 is a printed circuit board, 2 is a scraping section, 3 is a printed circuit board separation and supply device, 7 is a vacuum suction device, 8 and 85 are stacking sections, 11 is a through hole, 21 is a roller, 22 is a stopper, 3L35 is a printed circuit board feeding device, 71 is a suction head, 72 is a lifting/lowering cylinder, 81 is a dispensing push plate, 82.86 is an alignment stopper, 8
3 is a shifting and pushing plate A, 84 is a shifting and pushing plate B, 87 is an alignment pushing plate, 91 is a roller conveyor, and 92 is a supply conveyor. -271= Print Ichika 1 of the recent past - Separation candy device 1 3
figure
Claims (1)
ら吸着し、吸着したまま、ローラ(21)とストッパ(
22)との間隔をプリント基板(1)の板厚に配設構成
させた擦り切り部(2)を通過させ、一枚のみに分離さ
せてからBステージに移載するプリント基板一枚分離供
給装置(3)において、 該プリント基板(1)に設けた貫通孔(11)が重なら
ないように、少なくとも一方向にずらして積み重ねる手
段をAステージ側に備えることを特徴とするプリント基
板一枚分離供給装置。[Claims] The printed circuit boards (1) stacked on the A stage are sucked from above, and while being sucked, the rollers (21) and stoppers (
22) A single printed circuit board separation/supply device that passes through a scraping section (2) whose distance from the printed circuit board (1) corresponds to the thickness of the printed circuit board (1), separates it into only one sheet, and then transfers it to the B stage. In (3), the printed circuit board single sheet separation supply is provided with means for stacking the printed circuit boards by shifting them in at least one direction so that the through holes (11) provided in the printed circuit boards (1) do not overlap. Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32828488A JPH02175536A (en) | 1988-12-26 | 1988-12-26 | Separating by one piece and feeding device of printed substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32828488A JPH02175536A (en) | 1988-12-26 | 1988-12-26 | Separating by one piece and feeding device of printed substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02175536A true JPH02175536A (en) | 1990-07-06 |
Family
ID=18208507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32828488A Pending JPH02175536A (en) | 1988-12-26 | 1988-12-26 | Separating by one piece and feeding device of printed substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02175536A (en) |
-
1988
- 1988-12-26 JP JP32828488A patent/JPH02175536A/en active Pending
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