JP2022012102A - Method and device for taking out thin sheet - Google Patents

Abstract

To take out the topmost thin sheet one by one from stacked thin sheets and transport it quickly and reliably to the next work area.SOLUTION: Gas is blown from at least both sides at least facing each other of the topmost thin plate to be taken out of the thin plate stack 100 stored in a thin plate containing magazine 10 and a thin plate 100 to be taken out at a predetermined position on the side of the overlapping part of the bottom thin plate. A suction pad is lowered from above the thin plate containing magazine to a predetermined position on both sides of the thin plate to be taken out. One thin plate sucked by the suction pad 40 of a loader 50 is taken out from the thin plate containing magazine and transported to a predetermined position. By raising a thin plate on the lower side of the taken out thin plate to a stacking position of the previously taken out thin plate, the thin plate is made to be in a prepared status as the uppermost thin plate of the stacked thin plates at this point, and the process of taking out a thin plate that has become the uppermost one is taken out, and this process is repeated.SELECTED DRAWING: Figure 1

Description

The present invention is, for example, an insulating plate for electronic components, a substrate on which minute electronic components are mounted by wire bonding, a thin plate such as a semiconductor wafer, and the top thin plate is taken out one by one from the laminated state and described as follows. The present invention relates to a thin plate taking-out method and a taking-out device useful when handling a thin plate to a work area.

For example, regarding the removal of press steel plates used for vehicle monocoque frames, the top press steel plate is taken out and supplied to the press machine from among a plurality of press steel plates in the form of laminated sheet groups. A sheet taking-out device is known (see, for example, Patent Document 1).

Since the sheet take-out device in this case is a steel plate for pressing, it is disclosed that a magnetic floater is used when only the top sheet is taken out from a plurality of laminated sheets (for example). (See paragraph (0002) of Patent Document 1).

On the other hand, for example, a large number of thin plates such as circuit boards for mounting electric components and electronic components used in hybrid vehicles and semiconductor wafers used in solar cells are laminated in the process of manufacturing the solar cells and circuit boards. The thin plates are stored in the thin plate accommodating magazine in the state of being stored, and the thin plates are taken out one by one from the top in order by the handling device equipped with the suction nozzle, and the thin plates are taken out. It is also taken out in the factory where such products are manufactured.

Japanese Patent Application Laid-Open No. 2003-146461

In the former sheet take-out device, which takes out the top press steel plate from the above-mentioned sheet group in which the press steel plates for vehicles are laminated and supplies it to the press machine, a magnetic floater is used because the take-out sheet is a steel plate. It is possible to take out one by one without fail.

On the other hand, in the case of the latter thin plate taking-out device in which the taking-out sheet is made of a thin plate made of a non-magnetic material, the former magnetic floater structure cannot be applied, and the top thin plate among the laminated thin plates is used. When taking out only one sheet and moving it to the next work area, it is common practice to use a loader equipped with a suction nozzle to perform a handling operation for taking out and moving only the top thin plate. ..

However, such a handling operation alone often causes an unexpected problem during the removal of the thin plate. Specifically, substrates for mounting electronic components and electrical components, insulating plates for these components, and other semiconductor wafers, for example, are stored in a thin plate storage magazine in a laminated state with a cleaning liquid attached, for example, in the cleaning process. If they are made to do so, they may be laminated and accommodated in a state of being in close contact with each other.

In such a state, when only one uppermost thin plate is to be taken out by a handling device with a suction nozzle, the second or third thin plate on the lower side is sucked at a time while being in close contact with the thin plate. A phenomenon may occur in which the magazines are collectively taken out from the storage magazine.

If such a phenomenon occurs, the second and subsequent thin plates may fall from the top with the thin plate raised considerably without noticing it, or the second and subsequent sheets may be transferred for handling in the next process as they are. The thin plate of is dropped.

In such a situation, the thin plate that has clearly fallen and is damaged can be removed as a defective product to prevent the yield from decreasing, but when the thin plate storage magazine rises to some extent, the second and subsequent sheets fall again. If the magazine falls into the thin plate accommodating magazine and returns to the original accommodating state, the thin plate itself may have factors that cannot be easily inspected and excluded, such as scratches and internal stress, which may cause the thin plate to be damaged.

In addition, if such a trouble occurs during the continuous handling operation in which only the top thin plates are sequentially taken out from the laminated thin plates and moved to the next predetermined work area, an inspection satisfying the standard shape and standard dimensions is performed. It is not possible to complete the final product using the acceptable thin plate, which not only reduces the yield as a product, but also suspends the work line to reactivate the thin plate removal device and removes the thin plate. Special maintenance of the equipment must be performed, which leads to a decrease in production efficiency and an effect on cost reduction.

Therefore, to prevent the above phenomenon from occurring, the top thin plates of the thin plates stacked by the handling device with nozzles are taken out one by one from the magazine for accommodating the laminated thin plates. It is required to provide a thin plate removal method and a removal device that can be reliably handled in the above process.

An object of the present invention is, for example, various thin plates such as an insulating plate for electronic components, a substrate on which minute electronic components are mounted by wire bonding, and a thin plate such as a semiconductor wafer used for a solar cell or the like, and these are laminated. It is an object of the present invention to provide a method for taking out a thin plate and a taking-out device useful for handling the thin plate from the state to the next work area by taking out the top thin plate one by one.

In order to solve the above-mentioned problems, the method for taking out a thin plate according to claim 1 of the present invention is
In the method of taking out thin plates in a laminated state one by one from the top,
The first step of accommodating the laminated thin plates in a thin plate accommodating magazine having an opening at the top, and
Of the laminated thin plates, the top thin plate to be taken out separately and at least below it in order to separate the uppermost thin plate to be taken out and one or more thin plates overlapping the lower side. A second step of locally spraying gas from at least opposite sides of the thin plates to be taken out at a predetermined position on the side of the overlapping portion of the thin plates on the side.
The thin plate take-out loader provided with the suction pad for taking out the thin plate is taken out from above the opening of the thin plate accommodating magazine in a state where one thin plate on the upper side and one or a plurality of thin plates overlapping on the lower side are separated. The third step of adsorbing the thin plate to be taken out by the thin plate taking-out suction pad by lowering the thin plate to a predetermined position with respect to both sides of the above.
A fourth step of moving the loader by a predetermined route to take out one thin plate adsorbed on the thin plate take-out suction pad from the opening of the thin plate accommodating magazine and transfer it to a predetermined position.
By raising the lower thin plate of the taken out thin plate to the stacking position of the thin plate taken out before it, the thin plate is newly taken out as the uppermost thin plate of the thin plate laminated at this point and is ready to be taken out. The fifth step of preparing and
The present invention includes a sixth step of taking out the thin plate, which is newly the top thin plate among the laminated thin plates in the fifth step, by repeating the second step to the fourth step.
Of the laminated thin plates, the predetermined number of thin plates is taken out one by one from the thin plate accommodating magazine by repeating the second step to the sixth step, and only the required number of thin plates are taken out to a predetermined predetermined position. It is characterized by sequential transfer.

Further, the method for taking out a thin plate according to claim 2 of the present invention is the method for taking out a thin plate according to claim 1.
After sucking the thin plate to be taken out by the suction pad for taking out the thin plate, the loader is temporarily stopped for a predetermined time on the same surface as or below the opening surface of the opening of the thin plate accommodating magazine.

Further, the method for taking out a thin plate according to claim 3 of the present invention is the method for taking out a thin plate according to claim 1 or 2.
After the thin plate is adsorbed on the thin plate take-out suction pad, the gas spraying operation is temporarily performed for a predetermined time when the adsorbed thin plate is taken out from the thin plate accommodating magazine by using the thin plate take-out loader. It is characterized by stopping.

Further, the thin plate taking-out device according to claim 4 of the present invention is
It is a thin plate taking-out device having a structure that enables the first step to the sixth step to be carried out.

According to the present invention, various thin plates such as an insulating plate for electronic components, a substrate on which minute electronic components are mounted by wire bonding, and a thin plate such as a semiconductor wafer used for a solar cell or the like are laminated. It is possible to provide a thin plate removal method and a removal device useful for handling the thin plates from the top to the next work area by taking out the top thin plates one by one.

It is a figure which shows schematically the whole structure of the thin plate take-out apparatus which concerns on one Embodiment of this invention. It is explanatory drawing which shows the state which the air blow was blown out when the thin plate was accommodated in the thin plate accommodating magazine of the thin plate accommodating device shown in FIG. .. It is explanatory drawing which shows the procedure of taking out a thin plate which concerns on this embodiment in the order of FIG. 3 (a), FIG. 3 (b), and FIG. 3 (c). It is explanatory drawing which shows the procedure of taking out a thin plate which concerns on this Embodiment following FIG. 3 in the order of FIG. 4 (d), FIG. 4 (e), and FIG. 4 (f). It is a figure explaining the take-out position relation of the thin plate in this embodiment shown in FIGS. 3 and 4.

Hereinafter, a method for taking out a thin plate and a taking-out device (hereinafter, simply referred to as “a method for taking out a thin plate” or a “device for taking out a thin plate”) according to an embodiment of the present invention will be described with reference to the drawings. First, the overall configuration of the thin plate take-out device will be described.

FIG. 1 is a diagram schematically showing an overall structure of a thin plate taking-out device according to an embodiment of the present invention. Further, FIG. 2 is an explanatory view schematically showing the thin plate from above in which the thin plate is stored in the thin plate accommodating magazine of the thin plate taking-out device shown in FIG. Specifically, FIG. 2 is an explanatory diagram schematically showing a state in which an air blow is ejected when the top thin plate is taken out from the thin plates housed in the thin plate accommodating magazine shown in FIG. 1 from above.

It should be noted that the above drawings are schematically shown for facilitating understanding of the thin plate taking-out device according to the present embodiment, and the dimensional relationship of each component shown in the drawing and the dimensional relationship of the actual component are shown. It should be mentioned in advance that it is different from. Further, in the following description, the thin plate to be taken out will be described assuming an insulating plate for electronic parts of a vehicle.

As shown in FIGS. 1 and 2, the thin plate taking-out device 1 according to the present embodiment is separated by a thin plate laminated body (hereinafter, thin plates laminated in a close contact state and an air blow) supplied in a state where a large number of sheets are laminated. The thin plate accommodating magazine 10 accommodating 100 (also referred to simply as "thin plate 100" together with the individual thin plates) and the air blow portion 20 for separating the thin plates provided so as to face each other on both sides of the thin plate accommodating magazine 10. The thin plate feed push-up portion 30 provided on the lower side of the thin plate supply magazine and the thin plate 101 on the top of the laminated thin plates 100 provided above the thin plate accommodating magazine 10 are adsorbed by the thin plate suction pad 40. A loader 50 taken out from the thin plate accommodating magazine 10 above it, a loader handling unit 60 for transferring the thin plate 101 taken out by the loader 50 together with the loader 50 to the subsequent work process area, and a thin plate suction pad 40 provided at the lower end of the loader 50. A position measurement sensor 70 that appropriately detects the position (height) of the thin plate suction surface and the upper surface position (upper surface height) of the uppermost thin plate 101 taken out by the loader 50 among the thin plates 100 housed in the thin plate accommodating magazine 10. And, it has a control unit (not shown in the drawing) that controls the operation of each of these components.

The thin plate accommodating magazine 10 has a square frame shape, and has a space inside the thin plate accommodating magazine 10 for accommodating the thin plate laminate 100 conveyed from the process before the thin plate taking-out stage without causing a horizontal displacement. ing.

Of the two facing side wall portions of the thin plate accommodating magazine 10, an air blow blowing hole 11 is provided at a predetermined position on one of the facing side wall portions. The position where each air blowout hole 11 is provided is centered in the width direction of the opposite side portion of the thin plate laminated body 100 housed in the thin plate accommodating magazine 10 in the horizontal direction, and is in the center in the height direction. In the thin plate take-out device 1, the air blow nozzle reference position, which is a predetermined reference position, is provided at the same predetermined height.

More specifically, this height is shown as the uppermost thin plate (in FIGS. 1 to 3, the thin plate 101) of the laminated thin plates 100 via the thin plate separation air outlet of the air blow outlet hole 11. Hereinafter, it is referred to as a thin plate 101 for the time being), and is adsorbed by the thin plate suction pad 40 of the loader 50 and taken out from the thin plate accommodating magazine 10. Further, the size (inner diameter) of the air blowout hole 11 corresponds to the thickness of several thin plates in the case of the present embodiment.

More specifically, at this height, the thin plate separation air outlet of the air blow outlet hole 11 is an overlapping portion between the uppermost thin plate 101 of the laminated thin plates 100 and the lower thin plate 102 thereof. The position where the loader 50 is sucked by the thin plate suction pad 40 and is taken out from the thin plate accommodating magazine 10 is always included. This ensures that the uppermost thin plate and the lower thin plate are separated.

The position (height) of the uppermost thin plate of the thin plate laminate 100 is such that each time the thin plates are taken out from the thin plate accommodating magazine 10 one by one, the lower thin plate 102 is immediately before the thin plate feed pushing portion described later. It is designed to push up the removed thin plate to the position before removal. As a result, each time the thin plates 100 (101, 102, 103, ...) Are taken out one by one, the upper surface position (height) of the next thin plate, which is newly the uppermost of the laminated thin plates 100, is set. It is set to a predetermined position where it is adsorbed by the thin plate suction pad 40 of the loader 50 and taken out from the thin plate accommodating magazine 10.

The air blow unit 20 is composed of an air supply unit 21 and an air nozzle 22, and the uppermost thin plate 101 of the laminated thin plates 100 in the thin plate accommodating magazine 10 and the lower thin plate 102 thereof are formed through the air blow outlet holes 11. The thin plate separating air 90 is mainly blown toward the overlapping portion with the thin plate.

As a result, at least the uppermost thin plate 101 of the laminated thin plates 100 and the lower thin plate 102 thereof are separated as shown in FIG. 2 (see the arrow shown by the dotted line in FIG. 2), and the air blow hole is actually blown. Due to the relationship between the size of 11 and the thickness of the thin plate 100 and the air pressure of the thin plate separation air, the uppermost thin plate 101 and the plurality of thin plates 102, 103, ... It has become. This can be understood from the fact that in FIGS. 1 and 3, the upper side of the thin plate laminated body 100 originally housed in the thin plate accommodating magazine 10 is separated from each other and the interval is widened.

The thin plate feed push-up portion 30 is located at the bottom of the internal space of the thin plate accommodating magazine 10 at the upper portion thereof, and while supporting the bottom thin plate of the laminated thin plate 100, the thickness of one thin plate is sequentially taken out while the thin plate is taken out. It plays the role of pushing up the thin plates in a laminated state together. Therefore, the thin plate feed and push-up portion 30 has a thin plate support and push-up plate 31 at the upper part of the thin plate feed and push-up portion 30 in order to fulfill this function. Then, each time the thin plate feed pushing-up portion 30 takes out the uppermost thin plate of the laminated thin plates 100 from the thin plate accommodating magazine 10 as described above, the lower thin plate of the laminated thin plates 100 is newly added. The remaining laminated thin plates are pushed up from the bottom in synchronization with the removal of the thin plates one by one by the thin plate adsorption pad 40 and the loader 50 so that the height of the thin plate at the top is always constant. There is.

As described above, the thin plate feed and push-up unit 30 keeps the thin plates to be taken out next to the thin plates taken out immediately before each taking out work of a large number of laminated thin plates 100 to be taken out from the upper side one by one at the same height. I am trying to be.

The loader 50 is provided with a plurality of (4 in this embodiment) thin plate suction pads 40 on the lower side surface thereof, and takes out the lower end portion of the thin plate suction pads 40 by a vacuum function of sucking air from the opening of the thin plate suction pads 40. When the distance from the upper end surface of the power thin plate is within a predetermined range, the air blow portion 20 adsorbs the top thin plate that has already been separated from the lower thin plate. When the thin plate 100 is taken out, the loader 50 descends from the upper side of the opening of the thin plate accommodating magazine 10 until the distance between the lower end portion of the thin plate suction pad 40 and the upper end surface of the thin plate to be taken out is within a predetermined range.

Specifically, as shown in FIG. 5, the position measurement sensor 70 detects a sensor corresponding to a predetermined height from an allowable upper limit position (sensor upper limit value) for sensor detection corresponding to a predetermined height. The loader 50 is controlled by a control unit (not shown) so as to be lowered to the allowable lower limit position (sensor lower limit value) of.

In the case of the present embodiment, the lowering position of the loader 50 is set in advance as the allowable lower limit position (sensor lower limit value) for sensor detection, and the reason for stopping the lowering of the loader 50 when descending to that position is the loader 50. This is to prevent the loader 50 from further descending and hitting the uppermost thin plate of the laminated thin plate 100 with its momentum to damage a large number of thin plates 100.

The loader handling unit 60 rises while adsorbing the thin plate 100 with the thin plate suction pad 40, takes out the top thin plate 101 housed in the thin plate accommodating magazine 10, and then puts the thin plate 101 together with the loader 50 in the subsequent work area. It plays the role of transporting.

As shown in FIG. 5, the position measurement sensor 70 measures the vertical height from the air blow nozzle reference position to the suction pad tip 41 corresponding to the suction surface of the thin plate 100, and will be described later in the operation process procedure. The control unit (not shown) measures the hovering position where the loader 50 pauses while ascending after the thin plate is adsorbed, and determines whether or not this hovering position is within a predetermined range between the upper limit value and the lower limit value. It is supposed to tell to.

As can be seen from the above description, the control unit is for preventing the operation of each component of the thin plate ejecting device 1, the positional relationship between the related components, and the interference between the related components. It is designed to manage the operating time. The specific role of the control unit will be described together with the operation procedure of FIGS. 3 and 5 for explaining the operation of the thin plate taking-out device 1.

Subsequently, an operation process for taking out the thin plate using the thin plate taking-out device according to the present embodiment will be described with reference to the drawings. In this drawing, the minimum necessary components for facilitating the understanding of the explanation are shown among the components of the thin plate take-out device.

FIG. 3 is an explanatory diagram showing the procedure for taking out the thin plate according to the present embodiment in the order of FIGS. 3 (a), 3 (b), and 3 (c). Further, FIG. 4 is an explanatory diagram showing the procedure for taking out the thin plate according to the present embodiment in the order of FIGS. 4 (d), 4 (e), and 4 (f) following FIG. 3. Further, FIG. 5 is a diagram illustrating the relationship of taking out the thin plate in the present embodiment.

FIG. 3A shows a state in which the thin plate laminated body 100 before taking out the thin plates, in which a large number of thin plates 100 are laminated in close contact with each other, is housed in the thin plate accommodating magazine 10. Although a gap is seen between the thin plates in FIG. 3A, the thin plates initially housed in the thin plate accommodating magazine 10 are actually in close contact with each other and blocked by a cleaning liquid or the like in the thin plate manufacturing process. It is in the form of a thin plate laminate.

In this state, the thin plate feed pushing portion pushes up the thin plate laminate 100 from the lower side, and the upper surface of the thin plate 101 at the top of the thin plate laminate is the air blow position at a predetermined height from the air blow reference position shown in FIG. That is, it can be seen that the air blow portion 20 has risen to a position corresponding to the blow position.

In FIG. 5, both the air blow nozzle reference position and the air blow position (sensor zero point position) are fixed point positions predetermined in the height direction in relation to the structure of the thin plate take-out device 1.

Further, in the operation process of FIG. 3A, the thin plate separating air 90 has not yet been ejected from the air nozzle 22 of the air blow unit 20, so that the thin plates constituting the thin plate laminated body 100 are also in close contact with each other (separation). Not done).

In the operation process of FIG. 3 (b), immediately after the operation process of FIG. 3 (a), the thin plate accommodating magazine 10 is provided with air for thin plate separation from the two air nozzles 22 facing each other through the air blowout hole 11 of the thin plate accommodating magazine 10. The fact that the thin plate separation air 90 is mainly blown toward the overlapping portion of the uppermost thin plate 101 of the laminated thin plates 100 and the slightly plurality of thin plates 102, 103, ... Shows.

As a result, for example, when the thin plate 100 is an insulating plate, the overlapping portion between the uppermost thin plate 101, which has been in close contact with the cleaning liquid or the like, and a plurality of appropriate thin plates 102, 103, ... Then, the two are separated (see the thin plate separating air 90 shown by the dotted line in FIG. 2).

As described above, in the case of the present embodiment, in order to ensure the relationship between the thickness of each thin plate 100 and the inner diameter of the air nozzle 22 and the separation of the upper thin plates of the thin plate laminated body 100 from each other, the operation step of FIG. 3 (b). In the above, not only the uppermost thin plate and one lower thin plate thereof but also a plurality of thin plates are separated at the same time (see the thin plate shown in FIG. 3 (b)).

In FIG. 3 (c), as a result of the operation step of FIG. 3 (b), the uppermost thin plate 101 to be taken out from the thin plate accommodating magazine 10 is lifted by the thin plate separating air 90, and is below the tip of the suction pad shown in FIG. 4 (d). It shows the state of approaching to the side.

Although not shown in FIGS. 3 (b) and 3 (c), the loader 50 shown in FIG. 4 (d) covers the upper opening of the thin plate accommodating magazine 10 between them and is at the top. The thin plate 101 is prevented from being blown out from the opening of the thin plate accommodating magazine 10 by the thin plate separating air 90.

Next, as shown in FIG. 4 (d), the loader 50 further descends from a position (not shown) in FIG. 3 (c), and the suction surface of the thin plate suction pad 40 provided under the loader 50, that is, the suction pad tip 41. Approaches the upper surface of the thin plate 101. As shown in FIG. 5, the loader 50 is lowered by the position measurement sensor 70 until the lower limit of the sensor is reached. Then, in this process, when the state shown in FIG. 4 (d) is reached, as shown in FIG. 4 (e), the top thin plate 101 to be taken out by the air suction force generated in the thin plate suction pad 40 is removed. It is adsorbed by the thin plate adsorption pad 40.

After that, as shown in FIG. 4 (f), the loader 50 rises and is transferred by the loader handling device to the continuous work process area together with the loader 50. In the state shown in FIG. 4 (f), the blowing of the thin plate separating air 90 by the air blow unit 20 is temporarily stopped, and the thin plate newly located at the top to be taken out after that shown in FIG. 4 (f). Prevents 102 from popping out of the thin plate accommodating magazine 10.

In this temporary stop of the blowing of the thin plate separating air, the loader 50 finishes the transfer of the thin plate 101, returns to the original position again, is located in the upper opening of the thin plate accommodating magazine 10, and should be taken out next. Is performed until it can be prevented by the loader 50 from jumping out of the thin plate accommodating magazine 10. In this state, the thin plate support push-up plate 31 of the thin plate feed push-up unit 30 pushes up the thin plate 100 by the thickness of one thin plate by the timing control of the control unit.

Due to the temporary stop of the blowing of the thin plate separating air by the air blow portion 20, the thin plate 102 to be taken out next and the plurality of thin plates 103, 104, ... -Returns to the state shown in FIG. 3 (a), repeats the operation steps shown in FIGS. 3 (a) to 4 (f) again, and pops out the thin plate accommodating magazine 10.

In this way, the thin plates 100 are taken out from the thin plate accommodating magazine 10 one by one from the thin plate laminated bodies 100 that were originally in close contact with each other and integrated, and the thin plates 100 are sequentially transferred to the next work process area.

After the thin plate 102 is taken out from the thin plate accommodating magazine 10, the thin plate feed push-up portion 30 is made so that the thin plate 100 + N (N is a natural number starting from 3) becomes the top thin plate located at the specified height again. After being pushed up by and the thin plate 100 + N is taken out, the thin plate 100 + N + 1 is subsequently made to be the top thin plate newly located at the specified height. In this way, the operation of taking out the thin plates one by one is repeated until the thin plates originally constituting the thin plate laminate are almost eliminated.

5A and 5B are views at the air blow nozzle reference position, the air blow position (position measurement sensor zero point position), and the tip position of the thin plate suction pad (suction surface position at the lower end of the thin plate suction pad 40) in FIGS. 3 (a) to 4 (f). The position of the tip 41 of the suction pad in 1), the upper limit of the position measurement sensor (the upper limit of the hovering position by the loader 50), and the lower limit of the position measurement sensor (the lower limit of the hovering position by the loader 50) are shown in the figure. The length indicated by the arrow in the vertical direction in this drawing corresponds to each of the above-mentioned positions shown in FIGS. 3 (a) to 4 (f).

That is, FIG. 5 is enlarged and shown in order to facilitate understanding of each of the above-mentioned positional relationships shown in FIGS. 3 (a) to 4 (f), and is shown in a specific height direction. Numerical values are appropriately defined by dimensions such as the individual shape and dimensional relationship of the thin plate taking-out device 1, the number of thin plates laminated on the thin plate laminate 100, and the shape and thickness of the thin plate itself.

In FIG. 4A, when the loader 50 is lowered, suction is started (vacuum) after the control unit issues a lowering command, but it is constant from the air blow nozzle reference position as in the above embodiment. Instead of performing open loop control that uniquely lowers to the height, for example, a pressure sensor is provided in the loader 50 to measure the suction pressure, and at the moment when this suction pressure is detected, the thin plate 100 sucks the thin plate. It may be determined that the loader 50 is adsorbed by the pad 40, the lowering operation of the loader 50 is stopped, and instead, the thin plate 100 is taken out from the thin plate accommodating magazine 10 to shorten the tact time for taking out the thin plate. ..

As is clear from the above description of the embodiment of the present invention, according to the present invention, for example, an insulating plate for electronic components, a substrate on which minute electronic components are mounted by wire bonding, for example, a semiconductor wafer as a substrate component for a solar cell, etc. It is possible to provide a method for taking out thin plates and a taking-out device useful for handling the thin plates from the state in which the thin plates are laminated to the next work area by taking out the top thin plates one by one. Specifically, according to the present invention, various problems described in the above-mentioned problem to be solved column can be solved at once.

Although one embodiment of the present invention has been described above, it goes without saying that the present invention is not limited to the above-described embodiments. That is, even if it has a form different from the above-described embodiment, it is within the scope of the present invention as long as it has a configuration applicable to the creation of the technical idea specified in the present invention and exhibits its effect. It is naturally included.

Specifically, in the above-described embodiment, the thin plate is a square-shaped insulating plate, but the shape itself is not limited to a square shape, and may be a circular or other polygonal thin plate, and is limited to an insulating plate. However, for example, a thin plate forming an electronic component circuit board having a complicated shape or a thin plate made of a circular silicon wafer used for a solar cell or the like may be used.

Further, in the above-described embodiment, the air blow portions are provided as a pair at two facing locations on the outer side of the thin plate accommodating magazine, but in the configuration shown in FIG. 2, such a pair is further shifted by 90 degrees. In addition to the addition, air blowing holes for thin plate separation corresponding to this are additionally provided in the thin plate accommodating magazine, and air for thin plate separation is provided on each of the four sides of the thin plate having a quadrangle in a plan view in the configuration shown in FIG. It may be sprayed at the same time to quickly and surely separate the upper and lower thin plates.

Further, the thin plate accommodating magazine has a square frame shape in the above-described embodiment, but when the thin plate laminates are separated into individual thin plates, all the thin plate accommodating magazines do not have a displacement in the horizontal positional relationship between the thin plates. It suffices to restrain the thin plate of the above, and in order to prevent this positional relationship, a plurality of shafts are provided in the vertical direction, and the outer edge of the thin plate is pressed by this shaft to prevent the horizontal deviation of the separated thin plate. You may try to do it.

Further, the number of thin plate suction pads may be an appropriate number as long as the thin plates can be taken out from the thin plate accommodating magazine and transferred to the subsequent work process area without being displaced with respect to the suction pads after suction.

Further, as for the position measurement sensor, a sensor other than the laser position measurement sensor may be used as long as the effect of the present invention is exhibited. Further, as for the inner diameter of the air blow nozzle for separating thin plates, an appropriate inner diameter can be used as long as the action of the present invention is exhibited.

1 Thin plate take-out device 10 Thin plate storage magazine 11 Air blow outlet hole 20 Air blow part 21 Air supply part 22 Air nozzle 30 Thin plate feed push-up part 31 Thin plate support push-up plate 40 Thin plate suction pad 41 Suction pad tip 50 Loader 60 Loader handling part 70 Position measurement Sensor 90 Thin plate separation air 100 (101, 102, 103, ...) Thin plate, thin plate laminate

Claims (4)

In the method of taking out thin plates in a laminated state one by one from the top,
The first step of accommodating the laminated thin plates in a thin plate accommodating magazine having an opening at the top, and
Of the laminated thin plates, the top thin plate to be taken out separately and at least below it in order to separate the uppermost thin plate to be taken out and one or more thin plates overlapping the lower side. A second step of locally spraying gas from at least opposite sides of the thin plates to be taken out at a predetermined position on the side of the overlapping portion of the thin plates on the side.
The thin plate take-out loader provided with the suction pad for taking out the thin plate is taken out from above the opening of the thin plate accommodating magazine in a state where one thin plate on the upper side and one or a plurality of thin plates overlapping on the lower side are separated. The third step of adsorbing the thin plate to be taken out by the thin plate taking-out suction pad by lowering the thin plate to a predetermined position with respect to both sides of the above.
A fourth step of taking out one thin plate adsorbed on the thin plate take-out suction pad from the opening of the thin plate accommodating magazine, moving the loader by a predetermined route, and transferring the loader to a predetermined position.
By raising the lower thin plate of the taken out thin plate to the stacking position of the thin plate taken out before it, the thin plate is newly taken out as the uppermost thin plate of the thin plate laminated at this point and is ready to be taken out. The fifth step of preparing and
The present invention includes a sixth step of taking out the thin plate, which is newly the top thin plate among the laminated thin plates in the fifth step, by repeating the second step to the fourth step.
Of the laminated thin plates, the predetermined number of thin plates is taken out one by one from the thin plate accommodating magazine by repeating the second step to the sixth step, and only the required number of thin plates are taken out to a predetermined predetermined position. A method for taking out thin plates, which comprises sequentially transferring them. The claim is characterized in that after the thin plate to be taken out is adsorbed by the suction pad for taking out the thin plate, the loader is temporarily stopped for a predetermined time on the same surface as or below the opening surface of the opening of the thin plate accommodating magazine. Item 2. The method for taking out a thin plate according to Item 1. After the thin plate is adsorbed on the thin plate take-out suction pad, the gas spraying operation is temporarily performed for a predetermined time when the adsorbed thin plate is taken out from the thin plate accommodating magazine by using the thin plate take-out loader. The method for taking out a thin plate according to claim 1 or 2, wherein the thin plate is stopped. A thin plate taking-out device having a structure capable of carrying out the first step to the sixth step.

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