JPH0323925U - - Google Patents
Info
- Publication number
- JPH0323925U JPH0323925U JP8415289U JP8415289U JPH0323925U JP H0323925 U JPH0323925 U JP H0323925U JP 8415289 U JP8415289 U JP 8415289U JP 8415289 U JP8415289 U JP 8415289U JP H0323925 U JPH0323925 U JP H0323925U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- organic solvent
- tray
- drying apparatus
- wafer drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 7
- 238000004140 cleaning Methods 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8415289U JPH0323925U (enExample) | 1989-07-18 | 1989-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8415289U JPH0323925U (enExample) | 1989-07-18 | 1989-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323925U true JPH0323925U (enExample) | 1991-03-12 |
Family
ID=31632400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8415289U Pending JPH0323925U (enExample) | 1989-07-18 | 1989-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323925U (enExample) |
-
1989
- 1989-07-18 JP JP8415289U patent/JPH0323925U/ja active Pending
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