JPH0323700A - Mounting method for electronic component - Google Patents
Mounting method for electronic componentInfo
- Publication number
- JPH0323700A JPH0323700A JP1158652A JP15865289A JPH0323700A JP H0323700 A JPH0323700 A JP H0323700A JP 1158652 A JP1158652 A JP 1158652A JP 15865289 A JP15865289 A JP 15865289A JP H0323700 A JPH0323700 A JP H0323700A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- printed circuit
- circuit board
- section
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 28
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 235000000385 Costus speciosus Nutrition 0.000 description 1
- 244000258136 Costus speciosus Species 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子部品自動実装における電子部品実装方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electronic component mounting method in automatic electronic component mounting.
従来の技術
近年、社会のエレクトロニクス化が進み、電子部品自動
実装機に対して高精度化が望まれている。BACKGROUND OF THE INVENTION In recent years, as society has become increasingly electronic, higher precision has been desired for automatic electronic component mounting machines.
以下、図面を参照しながら電子部品自動実装機について
説明する。第２図は電子部品自動実装機の概念図である
。第２図において、１ｌは搬入部、１２は搬出部、ｌ３
は部品実装ヘッド、Ｉ４はＸＹテーブル、ｌ５は画像人
力部、１６は部品供給部、ｌ７は制御部、ｌ８は主操作
盤である。The automatic electronic component mounting machine will be described below with reference to the drawings. FIG. 2 is a conceptual diagram of an electronic component automatic mounting machine. In Fig. 2, 1l is the loading section, 12 is the unloading section, and l3
14 is a component mounting head, I4 is an XY table, 15 is an image manual section, 16 is a component supply section, 17 is a control section, and 18 is a main operation panel.
以上のように構成された電子部品自動実装機について、
以下その動作を説明する。Regarding the electronic component automatic mounting machine configured as above,
The operation will be explained below.
制御部１７は全体の動作を制御しており、部品実装ヘッ
ド１３は部品供給部１６から部品を吸着し、ＸＹテーブ
ル１４上のプリント基板に部品を実装する。またプリン
ト基板は搬入部１１，ＸＹテーブル１４，搬出部１２と
順次搬送され、特にＸＹテーブル１４にて部品実装中、
次のプリン１・基板が搬入部１１に搬入されれば搬入部
１１にて待機する。The control section 17 controls the overall operation, and the component mounting head 13 picks up components from the component supply section 16 and mounts the components on the printed circuit board on the XY table 14. In addition, the printed circuit board is sequentially transported to the carry-in section 11, the XY table 14, and the carry-out section 12, and in particular, during component mounting on the XY table 14,
When the next pudding 1/substrate is carried into the carry-in section 11, it waits in the carry-in section 11.
さて、部品実装密度の向上に伴い、電子部品自動実装機
にも実装精度が強く要求されてわり、プリント基板の挿
入穴、プリントパターン等に対し、より正確に実装する
必要がある。この為画像入力部１５を設け、プリント基
板の挿入穴、プリントパターン等の実装位置情報を画像
認識によって得て、実装時の位置決め補正を行っている
。Now, with the increase in component mounting density, mounting accuracy is strongly required for electronic component automatic mounting machines, and it is necessary to more accurately mount electronic components into insertion holes, printed patterns, etc. of printed circuit boards. For this purpose, an image input section 15 is provided to obtain mounting position information such as the insertion hole of the printed circuit board, the printed pattern, etc. by image recognition, and perform positioning correction during mounting.
第４図は従来の部品実装方法の流れを示すものである。FIG. 4 shows the flow of a conventional component mounting method.
その部品実装方法は、搬入工程２０で搬入部１１よりプ
リント基板がＸＹテーブル１４に搬入されると、第１位
置決め工程２１でＸＹテーブル１４は画像入力部ｌ５の
下へ位置決めされ、認識工程２２でプリント基板の画像
認識を行い、実装位置情報を得る。第２位置決め工程２
３で、画像認識した結果の実装位置情報に基づいて補正
し位置決めし、実装工程２４で部品をプリント基板に実
装する。第１ ｌ４断工程２５で基板１枚の実装が終了
したかを判断し、終わっていなければ、第１位置決め工
程２１から繰り返し、終わっていれば搬出工程２６でプ
リント基板をＸＹテーブル１４から搬出部にて搬出する
。第２判断工程２７にて、生産が終了でないなら、再度
搬入工程２０から繰り返す。In this component mounting method, when a printed circuit board is loaded into the XY table 14 from the loading section 11 in a loading step 20, the XY table 14 is positioned below the image input section 15 in a first positioning step 21, and in a recognition step 22. Performs image recognition of the printed circuit board and obtains mounting position information. Second positioning process 2
In step 3, the parts are corrected and positioned based on the mounting position information as a result of image recognition, and in the mounting step 24, the components are mounted on the printed circuit board. In the first 14 cutting process 25, it is determined whether the mounting of one board is completed. If not, the process repeats from the first positioning process 21, and if it is finished, in the unloading process 26, the printed circuit board is unloaded from the XY table 14. Transported by. In the second judgment step 27, if production is not completed, the process is repeated from the carrying-in step 20.
発明が解決しようとする課題
しかしながら、上記のような従来構成では、部品１個の
実装につき２度の位置決めを行うため、実装タクトが低
下することの他に，２箇所に位置決めを行うためＸＹテ
ーブルの可動エリアが広く必要となり、機械寸法が大き
くなるという問題点を有していた。Problems to be Solved by the Invention However, in the conventional configuration as described above, positioning is performed twice for each component mounted, which reduces the mounting takt time. The problem was that a large movable area was required, resulting in an increase in machine dimensions.
本発明は上記問題点に鑑み、電子部品自動実装機の高精
度実装を高速に、省スペースで行い、高速・高品質生産
を可能とするものである。In view of the above-mentioned problems, the present invention allows an electronic component automatic mounting machine to perform high-precision mounting at high speed and in a space-saving manner, thereby enabling high-speed, high-quality production.
課題を解決するための手段
上記問題を解決するために、本発四の部品実装方法は、
搬入部に画像入力部を備え、搬入部にわいてプリント基
板の画像認識を行う認識工程と、それに基づいて補正し
位置決めを行う位置決め工程と、部品を実装する実装工
程とからＩ．よるものである。Means for solving the problem In order to solve the above problem, the fourth component mounting method of this invention is as follows.
The loading section is equipped with an image input section, and the loading section includes a recognition step of performing image recognition of the printed circuit board, a positioning step of performing correction and positioning based on the image recognition, and a mounting step of mounting the components. It depends.
作用 本発明は上記した構成により、次のようになる。action The present invention has the following configuration according to the above-described configuration.
ＸＹテーブルにて部品実装中、次のプリント基板は搬入
部に搬入され、部品実装と並行してあらかじめ実装位置
情報を画像認識によって得ようというものである。While components are being mounted on the XY table, the next printed circuit board is carried into the loading section, and in parallel with the component mounting, mounting position information is obtained in advance by image recognition.
すなわち、あらかじめ搬入部において、プリント基板の
実装位置情報を画像認識によって得て、そのプリント基
板がＸＹテーブルに搬入され実際に実装する際に、補正
し位置決めを行い、精度良く実装を行う。これにより従
来と比べ高品質なプリント基板を高速に生産することが
可能となり、また機械の寸法も従来と同等、あるいは同
等以下にすることができる。That is, the mounting position information of the printed circuit board is obtained in advance by image recognition in the carrying-in section, and when the printed circuit board is carried into the XY table and actually mounted, correction and positioning are performed to perform mounting with high precision. This makes it possible to produce printed circuit boards of higher quality at a higher speed than before, and the dimensions of the machine can also be made the same or smaller than before.
実施例
以下、本発明の一実施例の実装位置補正方法について第
１図，第２図および第３図を参照しながら説明する。第
１図は本発明の実施例における動作の流れを示すもので
あり、第３図は搬入部の概念図である。Embodiment Hereinafter, a mounting position correction method according to an embodiment of the present invention will be explained with reference to FIGS. 1, 2, and 3. FIG. 1 shows the flow of operations in an embodiment of the present invention, and FIG. 3 is a conceptual diagram of the loading section.
第３図において、画像入力部１５′は搬入部１１の上部
に設けられており、プリント基板１９の画像を入力し、
制御部１７で画像認識処理を行い実装位置情報を得る。In FIG. 3, an image input section 15' is provided at the top of the loading section 11, and inputs an image of the printed circuit board 19.
The control unit 17 performs image recognition processing to obtain mounting position information.
この際、画像入力方法としては、プリント基板１枚分を
一度にー゛括して人力する方法、画像入力部１５あるい
は搬入Ｈｌｌが順次位置決めし順次入力する方法、また
プリント基板が順次位置決め、あるいは搬入中に定速移
動しながら入力する方法などがある。At this time, image input methods include a method in which one printed circuit board is input manually at a time, a method in which the image input unit 15 or the carry-in Hll sequentially positions and inputs the image, a method in which the printed circuit board is sequentially positioned, or There is a method of inputting data while moving at a constant speed during delivery.
第１図において、搬入部と実装部は並行して動作を行っ
ている。まず第１搬送工程ｌでプリント基板が搬入部１
ｌに搬入され、認識工程２でプリント基板の画像認識を
行い実装ｆヶ置ｔ？？報を得て、第２搬送工程３で搬入
部ｌ１からＸＹテーブル１４ヘプリント基板が搬出され
、一方実装部では同時に第３搬送工程５でＸＹテーブル
ｌ４にプリント基板を搬入する。次いで位置決め工手κ
６で先の実装位置情報を基に蒲正し位置決めを行い、実
装工程７で部品実装ヘッド１３がプリント基板に部品を
実装する。第２ ’ｒＩ！断工程により、プリント基板
１枚の実装が終了するまで位置決め工程０以降をくり返
す。実装が終了すれば第４搬送工程９にてＸＹテーブル
１４から搬出部１２ヘプリント基板を搬出する。第１判
断工程４と第３判断工程１０にて生産終了まで、処理を
くり返す。In FIG. 1, the loading section and the mounting section operate in parallel. First, in the first transport process l, the printed circuit board is transferred to the loading section 1.
The image of the printed circuit board is recognized in the recognition process 2, and the printed circuit board is mounted at f places. ? After receiving the information, the printed circuit board is carried out from the loading section l1 to the XY table 14 in the second transport step 3, while at the same time, in the mounting section, the printed circuit board is carried into the XY table l4 in the third transport step 5. Next, the positioning worker κ
In step 6, correct positioning is performed based on the previous mounting position information, and in mounting step 7, the component mounting head 13 mounts the component on the printed circuit board. 2nd 'rI! The positioning process 0 and subsequent steps are repeated until the mounting of one printed circuit board is completed by the cutting process. When the mounting is completed, the printed circuit board is carried out from the XY table 14 to the carry-out section 12 in a fourth carrying step 9. The process is repeated in the first judgment step 4 and the third judgment step 10 until production is completed.
これにより部品実装動作と、画像認識動作を並行して行
い、部品実装を高速に高精度で行うことが可能となる。This allows component mounting operations and image recognition operations to be performed in parallel, allowing component mounting to be performed at high speed and with high accuracy.
また、ＸＹテーブルは実装ヘッド下にのみ位置決めすれ
ば良く、ＸＹテーブル可動エリアの削減ひいては機械の
小型化が可能となる。In addition, the XY table only needs to be positioned under the mounting head, which makes it possible to reduce the movable area of the XY table and thus downsize the machine.
ただし、さらに高精度化を求める際、ＸＹテーブル１４
へのプリント基板固定のくり返し精度が問題となる場合
，ＸＹデーブル１４上へも画像入力部１５を設け、プリ
ント基板の代表箇所の実装位置情報を得て、搬入部１ｌ
で得た実装位置情報とのずれからプリント基板の固定ず
れを補正し、より高精度化することが可能である。However, when seeking even higher precision,
If the repeat accuracy of fixing the printed circuit board to is a problem, an image input section 15 is also provided on the XY table 14 to obtain mounting position information of representative points on the printed circuit board, and
It is possible to correct the fixing deviation of the printed circuit board based on the deviation from the mounting position information obtained in , and to achieve higher accuracy.
また、制御部１７を機械制御部と認識制御部に分離した
構成、画像入力部１５゛を前工程の搬送部あるいは前工
程との中間の搬送部（コンベヤー〉に設けた構威、認識
制御部と画像入力部１５′を凡用搬送部（コンベヤー〉
に設け機械の間に連結し、後工程の機種にかかわらず実
装位置情報を得られる構成等も可能である。In addition, the control section 17 is separated into a machine control section and a recognition control section, the image input section 15 is provided in a conveyance section of the previous process or a conveyance section (conveyor) intermediate to the previous process, and the recognition control section and the image input section 15' are connected to a general purpose conveyance section (conveyor).
It is also possible to have a configuration in which mounting position information can be obtained regardless of the type of machine in the subsequent process by providing the mounting position on the machine and connecting it between machines.
発明の効果
以上のように、本発明によれば、高速に高精度な実装が
可能となり、高品質化・高生産性による高効率生産が可
能となる。Effects of the Invention As described above, according to the present invention, high-speed and high-precision mounting is possible, and highly efficient production with high quality and high productivity is possible.
第１図は本発明の一実施例における部品実装方法の流れ
を示す図、第２図は電子部品自動実装機の概念図、第３
図は搬入部の概念図、第４図は従来の部品実装方法の流
れを示す図である。
１ｌ・・・・・・搬入部、１３・・・・・・部品実装ヘ
ッド、１４・・・・・・ＸＹテブーＪＬ、１５′・・・
・・・画像人力部、１７・・・・・・制御部。Fig. 1 is a diagram showing the flow of a component mounting method in an embodiment of the present invention, Fig. 2 is a conceptual diagram of an electronic component automatic mounting machine, and Fig. 3 is a diagram showing the flow of a component mounting method in an embodiment of the present invention.
The figure is a conceptual diagram of the loading section, and FIG. 4 is a diagram showing the flow of a conventional component mounting method. 1l... Loading section, 13... Component mounting head, 14... XY Tebu JL, 15'...
...Image human power department, 17...Control department.
Claims (1)
めプリント基板の実装位置情報を画像認識によって得る
工程と、実装位置情報に基づいて補正し位置決めを行う
工程と、部品を実装する工程とを有することを特徴とす
る電子部品実装方法。An image input section is provided in the loading section of the printed circuit board, and the method includes a step of obtaining mounting position information of the printed circuit board in advance by image recognition, a step of performing correction and positioning based on the mounting position information, and a step of mounting the component. An electronic component mounting method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1158652A JP2773256B2 (en) | 1989-06-21 | 1989-06-21 | Electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1158652A JP2773256B2 (en) | 1989-06-21 | 1989-06-21 | Electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0323700A true JPH0323700A (en) | 1991-01-31 |
| JP2773256B2 JP2773256B2 (en) | 1998-07-09 |
Family
ID=15676391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1158652A Expired - Fee Related JP2773256B2 (en) | 1989-06-21 | 1989-06-21 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2773256B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003069288A (en) * | 2001-08-24 | 2003-03-07 | Matsushita Electric Ind Co Ltd | Method and apparatus for mounting part |
| USRE39774E1 (en) | 1999-03-02 | 2007-08-14 | Delta Electronics, Inc. | Fan guard structure for additional supercharging function |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63191524A (en) * | 1987-01-30 | 1988-08-09 | Sony Corp | Working device |
-
1989
- 1989-06-21 JP JP1158652A patent/JP2773256B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63191524A (en) * | 1987-01-30 | 1988-08-09 | Sony Corp | Working device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE39774E1 (en) | 1999-03-02 | 2007-08-14 | Delta Electronics, Inc. | Fan guard structure for additional supercharging function |
| JP2003069288A (en) * | 2001-08-24 | 2003-03-07 | Matsushita Electric Ind Co Ltd | Method and apparatus for mounting part |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2773256B2 (en) | 1998-07-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |