JP3643141B2

JP3643141B2 - Electronic component replacement method in electronic component mounting apparatus

Info

Publication number: JP3643141B2
Application number: JP19273795A
Authority: JP
Inventors: 浩一矢吹; 恵二花田; 良治犬塚
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 1995-07-28
Filing date: 1995-07-28
Publication date: 2005-04-27
Anticipated expiration: 2015-07-28
Also published as: JPH0946092A

Description

【０００１】
【発明の属する技術分野】
本発明は電子部品を吸着して回路基板に実装する電子部品実装装置に利用される電子部品交換方法に関するものである。
【０００２】
【従来の技術】
一般に電子部品実装装置は図７に示すように、回路基板２０に装着すべき電子部品の形状を示す部品データを予め設定しておき、このデータを基に部品供給部１２で電子部品の上面と吸着ノズル１４の高さを制御し、吸着ノズル１４は部品供給位置１６で電子部品を吸着して回路基板に向かって搬送する。この搬送工程中に認識ステーション１７で一旦停止し、予め設定してある部品の形状を示す部品データを基に、電子部品の部品位置や姿勢を認識し、認識した部品の吸着位置や姿勢の補正を行い、装着ステーションの部品実装位置１９で回路基板２０上に装着する。回路基板２０に電子部品を装着している途中において、実装部品の部品切れが発生すると、部品実装装置が停止し、部品供給部１２内の部品切れが発生した電子部品を交換した後、電子部品実装装置を再びスタートさせ回路基板２０の生産を再開させる。
【０００３】
【発明が解決しようとする課題】
一般に回路基板２０に装着する電子部品の部品切れが発生した場合、部品供給部１２内に部品切れが発生した電子部品と同一性能、同一形状の電子部品を部品供給部１２内にセットする。ところが、回路基板２０の性能上、部品切れした電子部品と性能上同一であるが形状が異なる電子部品を回路基板に装着してもよい場合には、部品切れした電子部品と性能上同一であるが形状が異なる電子部品を部品切れした電子部品と交換することもできる。しかし、部品切れした電子部品と性能上同一であるが形状が異なる電子部品を部品供給部１２内にセットしたにも関わらず、交換した電子部品の部品データを電子部品実装装置に再登録することなく、電子部品実装装置をスタートさせ回路基板２０の生産を再開すると、部品供給部１２において予め設定してある電子部品の形状を示す部品データを基に、交換した電子部品の上面とノズル高さを制御し、交換した電子部品を吸着するため、交換前の電子部品と交換後の電子部品の厚みが異なる場合には、電子部品の吸着ミスを生ずる。また、部品供給部１２で吸着ノズル１４の吸着高さを制御し、電子部品を正常に吸着して回路基板２０に向かって搬送しても、その途中で認識部１７において、予め実装作業に入る前に設定してある部品の形状を示す部品データを基に、吸着した電子部品の吸着位置や姿勢を認識し、電子部品の吸着位置や姿勢の補正を行う。そのため、交換前の電子部品と交換後の電子部品の形状が異なる場合は、異なる電子部品を吸着した、または、異常な姿勢で電子部品を吸着したと判断する認識エラーが発生し、電子部品を回路基板２０に装着することなく廃棄したり、また、認識エラーは発生しないが、吸着した電子部品の吸着位置や姿勢を誤認識し、高精度に回路基板２０に装着できない問題がある。この吸着ミス、認識エラー、装着精度の低下などの問題は、部品供給部１２内の部品切れが発生した電子部品を交換した後、電子部品実装装置をスタートさせ回路基板２０の生産を再開する前に、予め設定してある実装データの中の電子部品の形状を示す部品データを、交換した電子部品の形状を示す部品データに再登録した後、電子部品実装装置をスタートさせることにより防ぐことができる。しかし、この実装データの中の部品データを再登録する方法は、再登録する部品データの電子部品が生産している回路基板２０のどの位置に装着する電子部品なのか、また、部品供給部１２内のどの位置にセットされている電子部品なのか等を熟知しておかなければならず、電子部品実装装置のオペレータが部品データを再登録するのに時間を要し、生産性の低下を招く問題がある。
【０００４】
本発明は上記従来の問題点に鑑み、回路基板２０に電子部品を装着している途中に電子部品の部品切れが発生し、部品供給部１２内の部品切れが発生した電子部品を交換する時、部品切れした電子部品と性能上同一であるが形状が異なる電子部品を交換しても、簡易に効率良く、正確に交換した電子部品の部品データを電子部品実装装置に再登録し、その再登録した部品データを基に回路基板２０を生産することにより、吸着ミス、認識エラー、装着精度の低下などを防ぐことができる電子部品実装装置における電子部品交換方法を提供することを目的とする。
【０００５】
【課題を解決するための手段】
本発明は、上記課題を解決するために、部品切れが発生した時、部品切れした電子部品のセット位置と部品切れ交換した電子部品の替わりに部品供給部内にセットした電子部品の電子部品名を入力する欄を表示部に表示する表示手段、部品切れした電子部品の替わりに部品供給部内にセットした電子部品名を入力部から入力する手段と、入力された電子部品名から、その入力された電子部品の部品データを部品データ群から抽出し電子部品実装装置に実装データとして再登録する手段とを備えたことを特徴とするものである。
【０００６】
また、部品切れが発生した時、その部品切れした電子部品と交換可能な電子部品名を予め複数登録できる手段と、部品切れが発生した時、その部品切れした電子部品と交換可能な予め登録されている複数の電子部品名を電子部品実装装置の表示部に表示する手段と、部品切れした電子部品の替わりに部品供給部内にセットした電子部品を電子部品実装装置の表示部に表示された複数の電子部品名の中から選択し、入力部から入力する手段と、入力された電子部品名から、その入力された電子部品の部品データを部品データ群から抽出し電子部品実装装置に実装データとして再登録する手段とを備えたことを特徴とするものである。
【０００７】
【発明の実施の形態】
以下、本発明の一実施例を図面に基づいて説明する。図１は、本発明の一実施例を示すブロック図である。図１において、１は電子部品実装装置の制御装置、２は入力部６より部品切れした電子部品の替わりに部品供給部１２内にセットした電子部品として入力された電子部品名を処理する入力処理部、３は入力された電子部品名から、その入力された電子部品の部品データを部品データ群４から抽出し電子部品実装装置に実装データ５として再登録する再登録処理部である。７は表示部８に部品切れが発生した電子部品の部品供給部１２内の電子部品セット位置を表示したり、入力部６から入力した内容を表示する表示処理部である。入力部６は、例えば、電子部品名を入力するキーボード、その入力内容を表示する表示部８は、ＣＲＴや液晶パネルからなり、または、入力部６と表示部８を兼ねたタッチパネルによって構成することもできる。
【０００８】
回路基板を生産中に部品切れが発生した時、図２（ａ）に示すように、部品切れで交換すべき電子部品の部品供給部１２内の電子部品セット位置と、部品切れした電子部品の変わりに交換した電子部品名を入力する表を表示部８に表示し、図２（ｂ）に示すように、各部品切れした部品供給部１２内のセット位置にセットした電子部品名を入力部６より入力する。入力部６から入力された電子部品名をキーにし、部品データ群４の電子部品名欄を検索し、図２（ｃ）に示すように同一名の電子部品の部品データを部品データ群４より抽出する。部品データ群４から抽出された部品データを電子部品実装装置の実装データ５の部品データとして図３に示すようなデータ構造で再登録し、この再登録データに基づいて回路基板の生産を行なうので、回路基板の生産中に、形状が異なる電子部品を部品切れした電子部品と交換しても引き続いて回路基板を生産することができる。
【０００９】
次に、図４は、本発明の第二の実施例を示すブロック図である。図４において、１は電子部品実装装置の制御装置、９は部品切れした電子部品と交換可能な電子部品名を予め複数登録する処理部、１０は交換可能部品名登録処理部９より登録された部品名を保持している交換可能部品名群、１１は回路基板を生産中に部品切れが発生した時、部品切れした電子部品と交換可能な電子部品名が予め登録されており、電子部品名を交換可能部品名群１０より抽出し、電子部品実装装置の表示部８に表示する交換可能部品名表示処理部、２は部品切れした電子部品の替わりに部品供給部１２内にセットした電子部品を、電子部品実装装置の表示部８に表示された複数の電子部品名の中から選択し、入力部６より入力する入力処理部、３は入力された電子部品名から、その入力された電子部品の部品データを部品データ群４から抽出し、電子部品実装装置に実装データ５として再登録する再登録処理部である。入力部６は、例えば電子部品名を入力するキーボード、その入力内容を表示する表示部８はＣＲＴ、液晶パネル、または、入力部６と表示部８を兼ねた電子部品名の入力と入力内容が確認できるタッチパネルからなる。
【００１０】
回路基板を生産する前に部品切れした電子部品と交換可能な電子部品名を交換可能部品名登録処理部９より、交換可能部品名群１０に予め複数登録する。図５に交換可能部品名群１０のデータ構造例を示す。回路基板を生産中に部品切れが発生した時、交換可能部品名表示処理部１１が、部品切れした電子部品の部品供給部１２内のセット位置毎に、部品切れした電子部品と予め登録されている交換可能な電子部品名を交換可能部品名群１０より抽出し、電子部品実装装置の表示部８に図６に示すデータ構造の表示が行われる。このデータは部品切れした電子部品の部品供給部１２内のセット位置毎に、部品切れした電子部品と交換可能電子部品名を表示した構造のものである。次に部品切れした電子部品の替わりに、部品供給部１２内にセットした電子部品を、表示部８に表示された複数の電子部品名の中から選択し、入力部６から選択した電子部品名を入力する。入力部６から入力された電子部品名をキーにし、図２（ｃ）に示す部品データ群４のデータ構造の電子部品名欄を検索し、同一名の電子部品の部品データを部品データ群４より抽出する。部品データ群４から抽出された部品データを、電子部品実装装置の実装データ５の新品データとして、図３に示すようなデータ構造で再登録し、この再登録データに基づいて回路基板の生産を行なうので、形状が異なる電子部品を部品切れした電子部品と交換しても、吸着ミス、認識エラーを生ずることなく回路基板を生産することができる。
【００１１】
【発明の効果】
以上のように、本発明の第１の実施例では、回路基板を生産中に部品切れが発生した時、部品切れした電子部品の替わりに部品供給部内にセットした電子部品名を入力部から入力し、入力された電子部品名から、その入力された電子部品の部品データを部品データ群から抽出し、電子部品実装装置に実装データとして再登録し、再登録した部品データを基に回路基板を生産するので回路基板の生産中に、形状が異なる電子部品を部品切れした電子部品と交換しても、吸着ミスや認識エラーを生ずることなく、また、装着精度を低下することなく引き続いて回路基板を生産することができる。
【００１２】
次に、本発明の第２の実施例では、部品切れした電子部品と交換可能な電子部品名を予め複数登録し、回路基板を生産中に部品切れが発生した時、予め登録されている電子部品名から部品切れした電子部品と交換可能な電子部品名を、電子部品実装装置の表示部に表示し、部品切れした電子部品の替わりに部品供給部内にセットした電子部品を、電子部品実装装置の表示部に表示された複数の電子部品名の中から選択し、入力部から入力し、入力された電子部品名から、その入力された電子部品の部品データを電子部品群から抽出し、電子部品実装装置に実装データとして再登録することにより、形状が異なる電子部品を部品切れした電子部品と交換しても、回路基板の生産中に、交換した電子部品の部品データを簡単かつ正確に電子部品実装装置に実装データとして再登録できるので、吸着ミスや認識エラーを生ずることなく、また、装着精度を低下することなく回路基板を引き続き生産することができる。
【図面の簡単な説明】
【図１】本発明の一実施例を示すブロック図である。
【図２】（ａ）は電子部品名入力前のデータ構造例を示す図である。
（ｂ）は電子部品名入力後のデータ構造例を示す図である。
（ｃ）は部品データ群のデータ構造例を示す図である。
【図３】実装データに登録する部品データの構造例を示す図である。
【図４】本発明の第二実施例を示すブロック図である。
【図５】交換可能部品名群のデータ構造例を示す図である。
【図６】電子部品名入力後の交換可能電子部品名のデータ構造例を示す図である。
【図７】電子部品実装装置の概略平面図である。
【符号の説明】
１電子部品実装装置の制御装置
２入力処理部
３再登録処理部
４部品データ群
５実装データ
６入力部
７表示処理部
８表示部
９交換可能部品名登録処理部
１０交換可能部品名群
１１交換可能部品名表示処理部
１２物品供給部
１４吸着ノズル
１５実装ヘッド
１６部品吸着位置
１７認識ステーション
１９部品実装位置
２０回路基板
２１回路基板位置決め部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component replacement method used in an electronic component mounting apparatus that picks up electronic components and mounts them on a circuit board.
[0002]
[Prior art]
In general, as shown in FIG. 7, the electronic component mounting apparatus presets component data indicating the shape of the electronic component to be mounted on the circuit board 20, and based on this data, the component supply unit 12 determines the upper surface of the electronic component. The height of the suction nozzle 14 is controlled, and the suction nozzle 14 picks up the electronic component at the component supply position 16 and conveys it toward the circuit board. During the transfer process, the apparatus is temporarily stopped at the recognition station 17, and based on the part data indicating the shape of the part set in advance, the part position and orientation of the electronic part are recognized, and the suction position and orientation of the recognized part are corrected. And mounting on the circuit board 20 at the component mounting position 19 of the mounting station. If a component out of a mounted component occurs while the electronic component is being mounted on the circuit board 20, the component mounting apparatus stops, and after replacing the electronic component in the component supply unit 12, the electronic component is replaced. The mounting apparatus is restarted and the production of the circuit board 20 is resumed.
[0003]
[Problems to be solved by the invention]
In general, when a component out of an electronic component to be mounted on the circuit board 20 occurs, an electronic component having the same performance and shape as the electronic component in which the component out has occurred is set in the component supply unit 12. However, in the performance of the circuit board 20, when an electronic component that is the same in performance but different in shape from the electronic component that is different in shape may be mounted on the circuit board, the performance is the same as the electronic component that is out of the component. However, it is also possible to replace an electronic component having a different shape with an electronic component that has been cut. However, the electronic data of the replaced electronic component is re-registered in the electronic component mounting apparatus even though the electronic component having the same performance but different shape from the electronic component which has run out is set in the component supply unit 12. When the electronic component mounting apparatus is started and the production of the circuit board 20 is resumed, the upper surface of the replaced electronic component and the nozzle height are based on the component data indicating the shape of the electronic component preset in the component supply unit 12. Therefore, if the thickness of the electronic component before replacement is different from the thickness of the electronic component after replacement, an electronic component suction error occurs. Further, even if the component supply unit 12 controls the suction height of the suction nozzle 14 and normally sucks and conveys the electronic component toward the circuit board 20, the recognition unit 17 enters a mounting operation in advance. Based on the part data indicating the shape of the part set in advance, the suction position and posture of the sucked electronic component are recognized, and the suction position and posture of the electronic component are corrected. Therefore, if the shape of the electronic component before replacement is different from the shape of the electronic component after replacement, a recognition error that determines that a different electronic component has been picked up or that the electronic component has been picked up in an abnormal posture occurs. Although it is discarded without being mounted on the circuit board 20 or a recognition error does not occur, there is a problem that it cannot be mounted on the circuit board 20 with high accuracy by erroneously recognizing the suction position and orientation of the sucked electronic component. Problems such as suction mistakes, recognition errors, and reduced mounting accuracy occur after replacement of an electronic component in the component supply unit 12 where the component has run out, before starting the electronic component mounting apparatus and restarting production of the circuit board 20. In addition, after re-registering the component data indicating the shape of the electronic component in the mounting data set in advance to the component data indicating the shape of the replaced electronic component, the electronic component mounting apparatus can be prevented from starting. it can. However, the method of re-registering the component data in the mounting data is based on the position of the electronic component to be mounted on the circuit board 20 where the electronic component of the component data to be re-registered is produced, and the component supply unit 12. It is necessary to be familiar with the position of the electronic component set in the device, and it takes time for the operator of the electronic component mounting apparatus to re-register the component data, resulting in a decrease in productivity. There's a problem.
[0004]
In the present invention, in view of the above-described conventional problems, when an electronic component is cut out while the electronic component is mounted on the circuit board 20, the electronic component in the component supply unit 12 is replaced. Even if an electronic component that is the same in performance but different in shape from an electronic component that has run out is replaced, the component data of the replaced electronic component can be re-registered in the electronic component mounting device easily and efficiently. It is an object of the present invention to provide an electronic component replacement method in an electronic component mounting apparatus that can prevent a suction error, a recognition error, a decrease in mounting accuracy, and the like by producing a circuit board 20 based on registered component data.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides the electronic component name of the electronic component set in the component supply unit in place of the electronic component that has been replaced and the electronic component that has been replaced when the component has been removed. Display means for displaying the input field on the display part, means for inputting the electronic part name set in the part supply part from the input part instead of the electronic part that has run out of parts, and the input electronic part name from the input part And a means for extracting component data of the electronic component from the component data group and re-registering it as mounting data in the electronic component mounting apparatus.
[0006]
In addition, when a component breakage occurs, a means for pre-registering a plurality of electronic component names that can be exchanged with the broken component and a pre-registered exchangeable item for the component breakage when a component breakage occurs. Means for displaying a plurality of electronic component names displayed on the display unit of the electronic component mounting apparatus, and a plurality of electronic components set in the component supply unit instead of the out-of-part electronic components displayed on the display unit of the electronic component mounting apparatus The electronic component name is selected and input from the input unit, and the input electronic component part data is extracted from the component data group from the input electronic component name and is mounted on the electronic component mounting apparatus as mounting data. And means for re-registration.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a control device for an electronic component mounting apparatus, and reference numeral 2 denotes an input process for processing an electronic component name input as an electronic component set in the component supply unit 12 instead of an electronic component that has run out of the input unit 6. Reference numeral 3 denotes a re-registration processing unit that extracts part data of the input electronic part from the part data group 4 from the input electronic part name and re-registers it as mounting data 5 in the electronic part mounting apparatus. Reference numeral 7 denotes a display processing unit that displays the electronic component set position in the component supply unit 12 of the electronic component in which the component breakage has occurred on the display unit 8 or displays the contents input from the input unit 6. The input unit 6 is, for example, a keyboard for inputting electronic component names, and the display unit 8 for displaying the input contents is composed of a CRT or a liquid crystal panel, or is configured by a touch panel that serves as both the input unit 6 and the display unit 8. You can also.
[0008]
When a part breakage occurs during the production of the circuit board, as shown in FIG. 2A, the electronic part set position in the part supply unit 12 of the electronic part to be replaced due to the part breakage, and the electronic part breakage part Instead, a table for inputting the name of the replaced electronic component is displayed on the display unit 8, and as shown in FIG. 2B, the name of the electronic component set at the set position in the component supply unit 12 where each component has run out is input unit 6. Enter more. The electronic component name input from the input unit 6 is used as a key to search the electronic component name column of the component data group 4, and the component data of the electronic component having the same name is retrieved from the component data group 4 as shown in FIG. Extract. Since the component data extracted from the component data group 4 is re-registered as the component data of the mounting data 5 of the electronic component mounting apparatus with a data structure as shown in FIG. 3, and the circuit board is produced based on the re-registered data. During the production of a circuit board, even if an electronic component having a different shape is replaced with a cut-out electronic component, the circuit board can be produced continuously.
[0009]
FIG. 4 is a block diagram showing a second embodiment of the present invention. In FIG. 4, reference numeral 1 denotes a control device for the electronic component mounting apparatus, 9 denotes a processing unit that registers in advance a plurality of electronic component names that can be exchanged for an out-of-part electronic component, and 10 denotes registration by the replaceable component name registration processing unit 9. A replaceable part name group 11 that holds part names is registered in advance as electronic parts names that can be exchanged for electronic parts that have run out when the parts are cut out during the production of the circuit board. Is extracted from the replaceable component name group 10 and displayed on the display unit 8 of the electronic component mounting apparatus. The replaceable component name display processing unit 2 is an electronic component set in the component supply unit 12 in place of the electronic component that has run out of components. Is selected from a plurality of electronic component names displayed on the display unit 8 of the electronic component mounting apparatus, and an input processing unit 3 is input from the input unit 6, and the input electronic component name is input from the input electronic component name. Parts data of parts Extracted from data group 4, a re-registration processing unit to re-register as a mounting data 5 to the electronic component mounting apparatus. For example, the input unit 6 is a keyboard for inputting an electronic component name, and the display unit 8 for displaying the input content is a CRT, a liquid crystal panel, or the input and input content of an electronic component name that serves as both the input unit 6 and the display unit 8 are input. It consists of a touch panel that can be confirmed.
[0010]
Before the circuit board is produced, a plurality of electronic component names that can be replaced with electronic components that have run out are registered in advance in the replaceable component name group 10 from the replaceable component name registration processing unit 9. FIG. 5 shows an example of the data structure of the replaceable part name group 10. When a part breakage occurs during production of a circuit board, the replaceable part name display processing unit 11 is pre-registered with a broken part electronic component for each set position in the part supply unit 12 of the missing part. The replaceable electronic component names are extracted from the replaceable component name group 10 and the data structure shown in FIG. 6 is displayed on the display unit 8 of the electronic component mounting apparatus. This data has a structure in which, for each set position in the component supply unit 12 of the electronic component that is out of parts, the name of the electronic component that is out of component and the name of the replaceable electronic component are displayed. Next, instead of the electronic component that has run out, the electronic component set in the component supply unit 12 is selected from a plurality of electronic component names displayed on the display unit 8, and the electronic component name selected from the input unit 6 is selected. Enter. Using the electronic component name input from the input unit 6 as a key, the electronic component name column of the data structure of the component data group 4 shown in FIG. Extract more. The component data extracted from the component data group 4 is re-registered as new data of the mounting data 5 of the electronic component mounting apparatus in the data structure as shown in FIG. 3, and the production of the circuit board is performed based on the re-registered data. Therefore, even if an electronic component having a different shape is replaced with an electronic component that has been cut, a circuit board can be produced without causing a suction error or a recognition error.
[0011]
【The invention's effect】
As described above, in the first embodiment of the present invention, when a component breakage occurs during production of a circuit board, the name of the electronic component set in the component supply unit is input from the input unit in place of the component breakage. The component data of the input electronic component is extracted from the component data group from the input electronic component name, re-registered as mounting data in the electronic component mounting apparatus, and the circuit board is based on the re-registered component data. During production of circuit boards, even if an electronic component with a different shape is replaced with a cut-out electronic component, there will be no suction error or recognition error, and the mounting accuracy will not be reduced. Can be produced.
[0012]
Next, in the second embodiment of the present invention, a plurality of electronic component names that can be exchanged with electronic components that have run out of parts are registered in advance, and when the parts run out during the production of the circuit board, An electronic component name that can be exchanged for an electronic component that is out of the component name is displayed on the display unit of the electronic component mounting device, and the electronic component set in the component supply unit is replaced with the electronic component mounting device instead of the electronic component that is out of component Select from a plurality of electronic component names displayed on the display section, input from the input section, extract the input electronic component data from the input electronic component name from the electronic component group, and By re-registering it as mounting data in the component mounting device, even if an electronic component with a different shape is replaced with a broken electronic component, the component data of the replaced electronic component can be easily and accurately stored during circuit board production. Parts Because it can be re-registered as a device in the mounting data, without causing adsorption mistakes and recognition errors, and can continue to produce the circuit board without reducing the mounting accuracy.
[Brief description of the drawings]
FIG. 1 is a block diagram showing an embodiment of the present invention.
FIG. 2A is a diagram illustrating an example of a data structure before an electronic component name is input.
(B) is a figure which shows the example of a data structure after an electronic component name input.
(C) is a diagram showing a data structure example of a part data group.
FIG. 3 is a diagram illustrating a structure example of component data to be registered in mounting data.
FIG. 4 is a block diagram showing a second embodiment of the present invention.
FIG. 5 is a diagram illustrating an example of a data structure of a replaceable part name group.
FIG. 6 is a diagram illustrating an example of a data structure of a replaceable electronic component name after inputting the electronic component name.
FIG. 7 is a schematic plan view of the electronic component mounting apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Control apparatus of electronic component mounting apparatus 2 Input processing part 3 Re-registration processing part 4 Component data group 5 Mounting data 6 Input part 7 Display processing part 8 Display part 9 Replaceable part name registration processing part 10 Replaceable part name group 11 Exchange Possible component name display processing unit 12 Article supply unit 14 Suction nozzle 15 Mounting head 16 Component suction position 17 Recognition station 19 Component mounting position 20 Circuit board 21 Circuit board positioning unit

Claims

A step of transporting toward a predetermined position on the circuit board and picks up a component at the component supply section, a step of recognizing the part in the course of conveying the parts, substrates have row position correction in accordance with the recognition result of the component An electronic component replacement method in an electronic component mounting method comprising a step of mounting a component at a predetermined position on the electronic component set position in the component supply unit of the electronic component to be replaced with an electronic component that has been cut, and the electronic to be replaced Input the part name, extract the part data from the part data group from the input electronic part name, re-register it as mounting data, and input the electronic part name to be replaced with the part that has run out of parts from the input part extracts component data of the input electronic component from the component data group, the electronic component mounting apparatus to re-register as mounting data, circuits electronics electronic components of different shapes and parts sold out during production of the substrate Features and that electronic component replacement process to the allowing replaced with.

The component supply unit picks up the component and transports it toward a predetermined position on the circuit board, recognizes the component while transporting the component, and corrects the position according to the recognition result of the component. An electronic component replacement method in an electronic component mounting method comprising a step of mounting a component at a predetermined position, wherein a plurality of replaceable electronic component name processing steps for registering in advance a plurality of electronic component names that can be replaced with a broken electronic component A replaceable component name group that holds the component names registered in the replaceable component name registration process, and an electronic component name that can be replaced with a broken component electronic component when a component failure occurs during circuit board production. From the replaceable part name group, and display the replaceable part name display processing step for displaying on the display unit and the electronic parts set in the part supply unit in place of the electronic parts that have run out of parts. Select from the child parts name, input from the input part and input electronic part name, extract the input electronic part data from the part data group and re-register as mounting data With a re-registration process, when a part breaks out during production of a circuit board, the replaceable part name display process replaces the electronic part that has run out of parts with a pre-registered replaceable electronic part name. Extract from the name group, display on the display unit, select the electronic component set in the component supply unit instead of the out-of-part electronic component from the multiple electronic component names displayed on the display unit, and from the input unit Enter the name of the selected electronic component, use the input electronic component name as a key, extract the component data of the electronic component with the same name from the component data group, and use the component data extracted from the component data group as the mounting data Register and electronic components replacing the electronic component mounting method characterized by the replaceable electronic component parts out of stock in the circuit board production and shape of different electronic components.