JP3316298B2 - Parts assembly equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component assembling apparatus for performing a predetermined operation for assembling chip components on a substrate.

[0002]

2. Description of the Related Art A prior art of this kind is disclosed in Japanese Patent Application Laid-Open No. 2-36100 filed earlier by the present applicant. In this method, after a coating agent is applied to a printed board by a coating device in a preceding process, a chip component is mounted on the coating material by a component mounting device in a subsequent process. At this time, data relating to application such as a position at which the application agent is applied, application diameter and the like, and data relating to mounting such as a position at which a component is mounted and a type of a component to be mounted are input by a computer.

[0003]

SUMMARY OF THE INVENTION Accordingly, the present invention is to create data relating to the mounting of a component mounting device, and to replace the data with the data relating to the coating corresponding to the device when using the coating device. With the goal.

[0004]

SUMMARY OF THE INVENTION Accordingly, the present invention relates to a component assembling apparatus for performing a predetermined operation for assembling a chip component on a substrate, wherein the chip component is mounted on the substrate by a component mounting device in a later process. Data on mounting when performing
And the chip component data in the mounting order of the data
Data of various coating diameters corresponding to
Displays the relationship between the cloth diameter data and the application time, nozzle type, etc.
A conversion device is provided which converts the application condition data into data relating to application when the application agent is applied to the substrate based on the application condition data .

[0005]

According to the above configuration, the data relating to the mounting of the chip component on the printed circuit board by the component mounting device in the subsequent process is the same as the data of the chip component in the data mounting order and the various types of chips.
Data of various coating diameters corresponding to
Displays the relationship between the cloth diameter data and the application time, nozzle type, etc.
Based on the application condition data, the conversion device converts the application condition into data relating to application when the application agent is applied to the substrate by the application device in the previous process.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. 2 is stored in a syringe 6 through a plurality of application nozzles 5 installed on a printed circuit board 4 which is supplied on an XY table 3 which can be moved XY via a supply conveyor 2 from an upstream apparatus (not shown). This is a coating device for applying an adhesive as a coating agent. The conveyor width of the supply conveyor 2 can be adjusted according to various substrate sizes of the substrate 4 to be handled. In the present embodiment, four nozzles 5 are prepared, and in a state where a desired nozzle 5 is selectively fixed to an unillustrated vertically moving device, the adhesive ejected from the tip of the nozzle 5 by lowering the vertically moving device. The agent is applied to the substrate 4.

An operation unit 7 includes a keyboard 8 as an input device for setting various data, a screen selection key 10 of a CRT 9, a start key 11 for starting a coating operation, and the like, and generates various data by operating the keys. . Reference numeral 13 shown in FIG. 1 denotes a RAM as a storage device for storing various data relating to coating, and a coating position (area) for each substrate 4 handled.
The data on the data is also stored.

Reference numeral 14 denotes a ROM as a storage device for storing a coating operation program. Reference numeral 15 denotes a CPU as a control device that controls the coating device 1 according to various data related to the coating operation. 16 is a RAM 13, a ROM 14, a CP
This is a bus line to which the U15 and the interface 17 are connected.

In FIG. 3, reference numeral 20 denotes a supply conveyor for transporting the substrate 4 to which the adhesive has been applied by the coating device 1 to, for example, an XY table 22 of a component mounting device 21 which is a downstream device. Reference numeral 21 denotes a discharge conveyor for transporting the substrate 4 on which chip components (not shown) are mounted to a downstream device (not shown). The conveyors 20 and 23 can be adapted to various substrate sizes of the substrates 4 by an automatic width adjustment mechanism (not shown) similarly to the conveyor 2.

Reference numeral 25 denotes a rotary disk which is intermittently rotated by a drive source (not shown). At its lower end, a plurality of suction nozzles 26 (four in this embodiment) for picking up chip components from a component supply device (not shown) are prepared. ) With mounting head 2)
7 are radially arranged. Reference numeral 30 denotes a keyboard 31 as an input device for setting various data, a screen selection key 33 of a CRT 32, and a start key 3 for starting a mounting operation.
An operation unit composed of four or the like generates various data by operating the keys.

Reference numeral 36 denotes a RAM as a storage device for storing various data, which also stores data relating to a mounting position (area) for each board 4 to be handled. Reference numeral 37 denotes a ROM as a storage device for storing a mounting operation program. Reference numeral 38 denotes a CPU as a control device that controls the component mounting device 21 in accordance with various data related to the mounting operation.

39 is a RAM 36, a ROM 37, a CPU 3
8 and a bus line to which the interface 40 is connected. A predetermined area of the RAM 36 of the component mounting apparatus 21 stores mounting data as shown in FIG. 6, component placement data as shown in FIG. 7, and part library data as shown in FIG.

The mounting data is different for each type of printed circuit board 4 on which chip components are to be mounted.
Although stored in the M36, the reel number (the field indicated by “R-NO”), the X data (the field indicated by “X”), and the Y Data (the column labeled “Y”) and θ data (the column labeled “θ”) are stored. The reel number is a number indicating an arrangement position of a plurality of component supply devices mounted on a supply table (not shown), and corresponds to, for example, a number sequentially assigned from the left side of the supply table. The X data and the Y data represent the XY position coordinates at which the chip component on the printed circuit board 4 is to be mounted, and the θ data is the θ direction at which the chip component is to be mounted, that is, the amount of rotation of the sucked chip component. Show. “E” in the column “C” indicates that component mounting per printed circuit board ends at this step number.

The component placement data differs for each type of printed circuit board 4 and is stored in the RAM 36. Each of the component placement data and the mounting data form a set. Indicates whether it is mounted. In the component arrangement data, a component ID indicating the type of component supplied by the component supply device for each reel number is stored as shown in FIG. The mounting data and the component arrangement data are called NC data and are handled as one set.

The parts library data is created for each part ID and stored in the RAM 36. Each part library data of each station of the parts mounting device 21 for mounting the chip part of the parts ID on the printed circuit board 4 is stored. Various types of data are stored so that the operation to be performed by the device can be controlled in accordance with the part. For example, as shown in FIG. 8, the component thickness data is obtained by a standing state detection sensor (not shown) provided in the component mounting apparatus 21 detecting whether the suction nozzle 26 is suctioning a normal surface of the chip component. In this case, when it is detected that the thickness is larger than this thickness, it is used so that the standing state can be detected. Component X size and component Y size are XY of chip components
It is used to determine that the part is of a different type when it is recognized by a recognition device (not shown) that the size exceeds the allowable value indicated by the size allowable value. You. In addition, if data indicating whether the recognition method is transmission or reflection is entered as data, it is possible to illuminate according to the recognition method of various components.

When the CPU 38 reads the reel number for each step number in the mounting data, it reads the part ID of the same reel number in the part arrangement data, reads each part ID data of the part library data, and performs necessary control. . The mounting data, the component placement data, and the part library data are usually created by the computer 42 using the keyboard 43, and stored in the RAM 36 of the component mounting apparatus 21 via the communication line 45.

Similarly, data relating to the application of the coating apparatus 1 is stored in the RAM 13 of the coating apparatus 1. Hereinafter, an operation of creating data regarding application will be described.
The data relating to the mounting and stored in the RAM 36 created via the computer 42 is converted into data relating to coating by the coating apparatus 1 in the computer 42. Data conversion switch unit 46 provided in the computer 42
By touching, the data on the mounting is converted into data on the application. That is, for example, various application diameters corresponding to various components shown in FIG. 9 stored in the RAM 47 in the computer 42 corresponding to various conditions such as the discharge diameter of the nozzle 5 prepared in the application device 1 and the type of adhesive. Based on the correspondence table, the CPU 49 converts the data ("R-NO") relating to the reel number in the mounting data into the application condition data ("D-NO") in the application data shown in FIG. At this time, the application condition data (“D-NO”) for obtaining the application diameter corresponding to the component in FIG. 9 is selected from the application condition data in FIG. 5 and set in the application data in FIG. 48, 5
0 is a ROM and a CRT of the computer 42.

The operation will be described below. First, when the substrate 4 is positioned and placed on the XY table 3 of the coating apparatus 1 from the upstream apparatus (not shown) via the supply conveyor 2, the CPU 15 of the coating apparatus 1 returns to FIG. 4 and FIG. The application operation is started based on the indicated application data. First, the application step number (M-N) indicating the application order
O) The XY table 3 is moved based on the X and Y data set to the first "0001" in the first step, and the first is set below the application nozzle 5 of the nozzle number 1 which is the condition set in the application condition data "001". Is positioned. Then, the application nozzle 5 is lowered via the vertical movement mechanism in a state where the vertical movement mechanism (not shown) is selectively fixed, and set in advance from the tip of the nozzle 5 to the syringe 6 by an air supply mechanism (not shown) using the application condition data. The compressed air is supplied for a predetermined application time (discharge time) at the set gauge pressure (in the present embodiment, two types of pressures set by gauge 1 and gauge 2 are selected for each nozzle 5). The adhesive discharged to the tip is applied. At this time, if the rotation is set to θ in accordance with the angle of the component to be mounted in a later step, the nozzle 5 is applied while being rotated by a rotation mechanism (not shown). After completion of the application, the nozzle 5 is raised.

Thereafter, the coating operation is similarly continued in the order of the coating steps set in the coating data of FIG. When the coating operation on one substrate is completed, the substrate 4 is moved to the component mounting device 21.
The component mounting apparatus 21 on the downstream side by the supply conveyor 20
Transported to Then, the component is mounted on the board 4 by the component mounting device 21.

That is, first, based on the mounting data shown in FIG. 6, the reel number "10" designated by the step number "0001" by the desired suction nozzle 26 of the mounting head unit 27.
Component ID “C1608R” supplied by the component supply device of “1”
The chip component “OHM” (see the component placement data in FIG. 7) is sucked. Thereafter, a component detection sensor (not shown) detects whether or not the component is sucked by the nozzle 26, and when the suction is detected, the mounting head 27 is recognized by the rotation of the turntable 25. Reached,
Recognition of the positional shift of the chip component being sucked by the suction nozzle 26 is performed. In this case, the CPU 38 determines the component ID “C160” of the reel number in the component arrangement data from the reel number “101” of the step number “0001” of the mounting data.
8ROHM ", read out various data of the part ID from the parts library data, and switch the illumination (not shown) from the upper part of the chip part because the recognition method is" transparent ". Recognition processing is performed, and the positional deviation is recognized, for example, by confirming that the component is not a different type from the component X size, component Y size, and allowable size value.

Next, the rotary disk 25 is rotated and the head 2 is rotated.
7 reaches the angle correction station,
The CPU 38 rotates the suction nozzle 26 by the head rotating device (not shown) by an angle amount obtained by adding the angle amount for correcting the angular deviation recognized in the recognition station to the data “θ1”. Control the moving equipment. Next, the head unit 27 reaches the mounting station, and the XY table 22 moves in the XY directions by correcting the positional deviation recognized by the recognition device, and moves to the position (X1, Y1) on the printed circuit board 4. The chip components are mounted on.

As for the step number "0002" of the mounting data, the reel number "105" is read out, and the component supply device for supplying the chip component with the component ID "R1608A" of the reel number is similarly operated. Suction is performed, and the substrate is similarly moved to the position (X2, Y2) on the substrate 4. Hereinafter, similarly, the components are mounted, and the substrate 4 which has been mounted on one substrate is conveyed to a downstream device (not shown) via the discharge conveyor 23.

In this embodiment, the application diameter of the adhesive corresponding to the component shown in FIG. 9 is searched from the application condition data in FIG. 5, and the result is set in the application data in FIG.
However, the present invention is not limited to this.
May be picked up and the optimum nozzle 5 among them is determined to complete the application data and the application condition data. In this case, the following relational expressions of the gauge pressure (application pressure), the application time, and the application diameter when each nozzle 5 is used are stored in the RAM 47 of the computer 42.

[0024]

(Equation 1)

(A, B, C, and D are obtained from experimental values.
Each value may be “0”, where X is the coating diameter and t is the coating time. Then, from this relational expression, a calculation device (not shown) in the CPU 49 calculates how long the coating time is applied to each nozzle 5 to obtain the coating diameter. As a result, of the plurality of picked-up nozzles 5 capable of obtaining the application diameter, the nozzle having the shortest application time (ejection time) for obtaining the application diameter is given priority, and the nozzle number and the application time Is set in the application condition data, and the application condition number is set in the application data.

Further, as a criterion, several steps before and after that in the mounting data may be searched, and a determination may be made so as to preferentially use the nozzle 5 that is used frequently.
In this case, the loss of work time due to the work of switching the nozzles 5 by the vertical movement mechanism that selectively moves and moves the nozzles 5 can be reduced. When a desired nozzle is selected from nozzles having a plurality of adhesive ejection parts such as two-point coating or three-point coating, the nozzles must have a nozzle pitch corresponding to the component size. Become.

Further, as described above, it is also possible to optimize the order of the coating steps based on each data of the optimum nozzle 5 determined to obtain a desired coating diameter. That is, the optimal nozzle is selected based on the application diameter correspondence table corresponding to the component set in the reel number data of all mounting steps,
Based on the result, the application step order of the application data is set. At this time, the application operation is started from the nozzle 5 of the nozzle number 1, for example, and the application operation is completed by the nozzle 5 of the nozzle number 4 by dividing into groups using the same nozzle. As a matter of course, the order of the group using the same nozzle 5 can be variously set. Further, an optimal order may be set in a group using the same nozzle 5.

The criterion for selecting the nozzle 5 is not limited to the shortest coating time for obtaining a desired coating diameter as in this embodiment, but is moved to the next coating position, for example. In this case, the shorter the moving distance (moving time) of the XY table 3 may be given priority, or the most suitable combination of these may be given priority. Further, in this embodiment, the data relating to the mounting is converted into the data relating to the coating by the computer 42 connected to the coating apparatus 1 and the component mounting apparatus 21 via the communication line 45. A function may be provided.

[0029]

As described above, according to the present invention, only the data relating to the mounting of the component mounting device is prepared, and when the coating device is used , the chip components in the mounting order of the data relating to the mounting are used .
Data and data of various application diameters corresponding to various chip components
Data of the various application diameters, application time and nozzles
Coating device based on coating condition data showing the relationship with species
Order to be replaced by the data relates to a coating corresponding to,
The time required for setting the data on the coating is not wasted, and the productivity is improved. Further, the rate of making a setting error is reduced as compared with the case where the operator directly sets the data regarding the application, so that the production efficiency is improved without producing a defective substrate.

[Brief description of the drawings]

FIG. 1 is a configuration circuit diagram of a component mounting line.

FIG. 2 is a perspective view showing a coating apparatus.

FIG. 3 is a perspective view of the component mounting device.

FIG. 4 is a diagram showing application data.

FIG. 5 is a diagram showing application condition data.

FIG. 6 is a diagram showing mounting data.

FIG. 7 is a diagram showing component arrangement data.

FIG. 8 is a diagram showing part library data.

FIG. 9 is a diagram showing a correspondence table between parts and application diameters.

[Explanation of symbols]

 Reference Signs List 1 coating device 13 RAM 15 CPU 21 component mounting device 36 RAM 38 CPU 42 computer 45 communication line 47 RAM 49 CPU

Claims (1)

(57) [Claims] In a component assembling apparatus for performing a predetermined operation for assembling a chip component on a substrate, data relating to mounting when the chip component is mounted on the substrate by a component mounting device in a later process is stored in the device. Chip components in data loading order
Data and data of various application diameters corresponding to various chip parts.
Data, data on the various application diameters, application time and nose
A component assembling apparatus, comprising: a conversion device that converts data on application when a coating material is applied to the substrate by a coating device in a previous process based on application condition data indicating a relationship with a type of the component.