JPH03236296A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH03236296A JPH03236296A JP3289390A JP3289390A JPH03236296A JP H03236296 A JPH03236296 A JP H03236296A JP 3289390 A JP3289390 A JP 3289390A JP 3289390 A JP3289390 A JP 3289390A JP H03236296 A JPH03236296 A JP H03236296A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flat
- leads
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、フラットＩＣを装着して接続するためのプリ
ント配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board for mounting and connecting a flat IC.
従来フラットＩＣ用のプリント配線基板は、第３図に示
すように、プリント配線基板１３のフラットＩＣのリー
ド２をはんだ付けする部分が平面的な構造となっている
。In a conventional printed wiring board for a flat IC, as shown in FIG. 3, the portion of the printed wiring board 13 to which the leads 2 of the flat IC are soldered has a planar structure.
上述したように、従来のプリント配線基板１３は、フラ
ットＩＣのリード２をはんだ付けする部分が平面的構造
となっているため、はんだ付けをすると、はんだ１５が
隣接するリード２をショートすることがあるという欠点
がある。As mentioned above, since the conventional printed wiring board 13 has a planar structure in which the leads 2 of the flat IC are soldered, the solder 15 may short-circuit the adjacent leads 2 when soldered. There is a drawback.
本発明のフラットＩＣ装着用のプリント配線基板は、フ
ラットＩＣの各リードを半田付は部分の間に突起部を設
けたものである。The printed wiring board for mounting a flat IC of the present invention has protrusions provided between the soldered portions of each lead of the flat IC.
次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の断面図、第２図は第１図の
実施例のフラットＩＣのリードをはんだ付けする部分の
拡大断面図である。FIG. 1 is a cross-sectional view of an embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view of a portion to which leads of the flat IC of the embodiment of FIG. 1 are soldered.
第１図および第２図に示すように、本実施例のフラット
ＩＣ用プリント配線基板３は、隣接するフラットＩＣＩ
のり−ド２の装着部分の間に突起部４を設けたものであ
る。このように構成したプリント配線基板３にフラット
ＩＣＩのリード２を適正に装着してはんだ付けを行なう
と、突起部４が隣接するリード間に入ってはんだ５によ
るショートを防止する。As shown in FIGS. 1 and 2, the flat IC printed wiring board 3 of this embodiment is connected to adjacent flat ICs.
A protrusion 4 is provided between the mounting portions of the glued 2. When the leads 2 of the flat ICI are properly attached to the printed wiring board 3 configured as described above and soldered, the protrusions 4 enter between the adjacent leads to prevent short circuits caused by the solder 5.
以上説明したように、本発明のプリント配線基板は、プ
リント配線基板のリード装着部分の間に突起部を設ける
ことにより、はんだによるショートを防止し、信頼性お
よび作業性を向上させるという効果がある。As explained above, the printed wiring board of the present invention has the effect of preventing short circuits caused by solder and improving reliability and workability by providing protrusions between the lead attachment parts of the printed wiring board. .
第１図は本発明の一実施例を示す断面図、第２図は第１
図の実施例の部分拡大断面図、第３図は従来例のフラッ
トＩＣ用立体型プリント配線基板の一例のはんだによる
ショート状態を示す拡大断面図である。
１・・・フラットＩＣ５２・・・リード、３・１３・・
・プリント配線基板、４・・・突起部、５・１５・・・
はんだ。FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG.
FIG. 3 is a partially enlarged sectional view of the embodiment shown in the figure, and FIG. 3 is an enlarged sectional view showing a short-circuit state due to solder in an example of a conventional three-dimensional printed wiring board for a flat IC. 1...Flat IC52...Lead, 3.13...
・Printed wiring board, 4... protrusion, 5/15...
Solder.
Claims (1)
けたことを特徴とするプリント配線基板。A printed wiring board characterized in that a protrusion is provided between parts to which leads of a flat IC are attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3289390A JPH03236296A (en) | 1990-02-13 | 1990-02-13 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3289390A JPH03236296A (en) | 1990-02-13 | 1990-02-13 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03236296A true JPH03236296A (en) | 1991-10-22 |
Family
ID=12371569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3289390A Pending JPH03236296A (en) | 1990-02-13 | 1990-02-13 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03236296A (en) |
-
1990
- 1990-02-13 JP JP3289390A patent/JPH03236296A/en active Pending
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