JPH03232731A - Method for dividing chemical cuttable photosensitive glass product - Google Patents

Abstract

PURPOSE:To obtain a product with a high dimensional accuracy at a low dividing cost without dividing during handling by forming many slits on both surfaces of photosensitive glass according to a specific method, then heat-treating the glass and subsequently dividing the product from the slit parts. CONSTITUTION:A mask 3 (with a vacuum deposited Cr film 4) having a transparent part (2a) for forming many slits is superposed on chemically cuttable photosensitive glass 1 and then irradiated with ultraviolet rays. The mask 3 is subsequently removed to primarily heat-treat the chemically cuttable photosensitive glass 1 and deposit Li2O.SiO2 crystals 5. The resultant glass is then etched with a hydrofluoric acid solution to form slits 2... with a depth of 15-40% based on the thickness of the chemically cuttable photosensitive glass 1. The etched glass is further secondarily heat-treated to afford crystallized glass 6, which is finally divided (broken with hand) from the parts of the slits 2 to provide plural products 8... (7; selvage parts for handling).

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for dividing chemically cuttable photosensitive glass (hereinafter referred to as photosensitive glass).

(Prior Art) Photosensitive glass is used in cell sheets for plasma displays, wire guides for printers, in-jet printer heads, hard disk pads for magnetic disks, and the like. The dimensions of these products are small parts on the order of a few inches. When manufacturing these small parts, processing each product one by one requires processing costs for the number of products, which increases manufacturing costs.9 Normally, standard-sized photosensitive glass plates of about 10 to 20 cm square are prepared. A large number of products were manufactured at once by irradiating them with ultraviolet rays through a mask, heat-treating them, then immersing them in an HF aqueous solution and etching them.

For example, as shown in FIG. 4, a glass mask is prepared in which a plurality of mask patterns each having windows that transmit ultraviolet rays are formed in the shape of a standard-sized photosensitive glass plate, corresponding to the outer shape of the product 8 and the holes 9. Next, a glass mask is placed over the photosensitive glass plate, and a predetermined amount of parallel ultraviolet light having a wavelength around 31 Onm, which corresponds to the absorption peak of Ce3+ ions contained in the photosensitive glass, is perpendicular to the glass surface. irradiate.

Next, the photosensitive glass is placed in a heat treatment furnace.

Crystals of LizO・SjO□, which are easily soluble in HF, are precipitated only in the ultraviolet irradiated area, and L120・5i crystals are deposited in the non-UV irradiated area.
An appropriate temperature at which Ch crystals do not precipitate (usually 500 to 600
℃) - main heat treatment. Next, the product is immersed in an HF aqueous solution having a concentration of 2 to 10% to dissolve and remove the LixO-8ift crystal precipitated portion, thereby processing the outer shape of the product at the same time as hole processing. At this time, a thin bridging portion 10 is left to connect the photosensitive glass frame 11 and the product so that the product does not fall out and fall into the HF aqueous solution.This bridging portion is attached to the UV irradiation mask. This can be achieved by masking. Thereafter, the surface of the roughened photosensitive glass was polished with an HF aqueous solution as necessary.

A secondary heat treatment (600 to 900°C) is performed to crystallize the entire surface of the photosensitive glass, producing a high-strength crystallized glass.

In this way, a method is used in which a large number of products are formed all at once on a single sheet of standard-sized photosensitive glass, and then the products are divided from the frame.

Another method is when the final product shape is rectangular, consisting of straight parts on four sides, and high dimensional accuracy is required, the conventional method is to open a window corresponding to the hole in the product in the UV pattern irradiation mask. After UV irradiation and secondary heat treatment in the same manner as above, HF etching is performed to form holes, followed by secondary heat treatment.

Thereafter, the crystallized photosensitive glass is fixed to a jig, and the product is cut with a diamond blade or the like using a dicing machine. At this time, the position of the product outline is read from the hole position, ensuring high dimensional accuracy.

(Problems to be Solved by the Invention) However, the above-mentioned conventional technology has the following problems.

Although the final product can be divided more easily than the glass frame by dissolving and removing other parts while leaving the part that bridges the glass frame and the product, as well as the product and the frame, there may be cases where cracks remain on the product after division, and the accuracy of the product external shape may be affected. If this is necessary, it is necessary to polish the edges after dividing into 9 parts, resulting in an increase in manufacturing costs due to an increase in manufacturing steps.

Also, the product and frame are supported by one point.

The support strength of the product is weak and it easily splits due to external force, so careful handling is required.

Furthermore, although the method of dividing into pieces by dicing is easy to handle and ensures the accuracy of external processing, a lot of time is required for alignment and cutting, leading to an increase in manufacturing costs.

The present invention solves the above-mentioned problems and provides a method for dividing photosensitive glass products with high dimensional accuracy, which is easy to link, is inexpensive to divide, and has high dimensional accuracy.

(Means for Solving Problem ii1) The present inventors irradiated ultraviolet rays of a narrow width to a portion corresponding to the external shape of photosensitive glass through an ultraviolet irradiation mask, and after heat treatment, HF etched/etched the ultraviolet irradiated portion. We have discovered that this problem can be solved by providing a slit groove that does not penetrate through the surface.

In the present invention, a mask having a large number of transparent parts for forming slits is stacked on top of photosensitive glass and irradiated with ultraviolet rays.Next, the photosensitive glass is subjected to a primary heat treatment, and then etched with a hydrofluoric acid solution to make the depth of the photosensitive glass. This invention relates to a method for dividing photosensitive glass products, which is characterized in that a slit with a thickness of 15 to 40 inches is formed and the product is divided from the slit portion after a secondary heat treatment.

The composition of the photosensitive glass is not particularly limited, but it may be one that precipitates Li2O.Si0g crystals that are easily soluble in an HF aqueous solution only in the ultraviolet irradiated area by partial ultraviolet irradiation and heat treatment at an appropriate temperature. Ultraviolet light source lampliHg-Xe
Any device that generates ultraviolet light with a wavelength around 310 nm may be used, such as a lamp or an ultra-high pressure mercury lamp. The optical lenses and mirrors used to irradiate the chemical cutting photosensitive glass with ultraviolet rays from the lamp must absorb little or no ultraviolet rays around 310 nm. The mask material may be any material as long as it can form a portion that transmits ultraviolet rays and a portion that shields the UV rays, and a mask made of a transparent quartz glass plate with a Cr--Cr0 film is usually used. - The conditions for this heat treatment may be as long as LixO.S i (h crystals are precipitated only in the ultraviolet irradiated area. Usually, the temperature is 500 to 600° C. in the atmosphere.

The diffusion and replenishment speed of the HF solution to the tip of the groove formed by this process is slow, and it takes time to form the groove, but the cross-sectional shape of the slit becomes trapezoidal.

This is undesirable because cracks develop in the substrate whose end surfaces do not form a straight line but have a zigzag shape upon division.

The plate thickness of the photosensitive glass can be 0.5 to 20 mm.

The slit depth is 15 to 40% of the glass plate thickness. If the slit depth is less than 15%, the load for dividing will be large, and the product will crack when dividing.
If the slit depth exceeds 100 mL, the slit will split during handling due to a very weak external force, making it impossible to handle it well. Preferably it is 20 to 40 inches.

The hydrofluoric acid solution for etching that dissolves the LizO.Si0g crystal to form slits is usually an aqueous solution with an HF concentration of 2 to 10% by weight. Rinse with water after etching.

After drying, it undergoes a secondary heat treatment to improve its strength.

The temperature of the secondary heat treatment is usually 600-900'l:.

Finally, the slit part is divided by hand to obtain the product.

(Function) Under appropriate heat treatment conditions, photosensitive glass precipitates Li2O.5i02 crystals that are easily soluble in HF aqueous solution only in the UV irradiated area. Because the slit 2 with a fine width and an acute angle perpendicular to the surface of the glass 1 can be formed from both sides.
By hand-separating, it is possible to form a large number of products with sharp cross-sections and high dimensional accuracy at low cost.

(Example) Next, the present invention will be explained in detail.

Example 1 FIG. 1 is a diagram showing the manufacturing process of a photosensitive glass product.

A photosensitive glass (manufactured by Chuyu Optical Glass, PSG-1) with dimensions of 0.9 t x 60 x 120 (mm) was prepared.

On the other hand, as shown in FIG.
A mask 3 made of Cr-deposited transparent quartz glass provided with a transparent part 2a for forming slits having a μm width was prepared, and the mask 3 was placed on the photosensitive glass 1 as shown in FIG.

■ Newly manufactured oak high-precision exposure equipment for glass substrates Of'
With tCHMW-661B-1, parallel ultraviolet light is transmitted from above the mask at 10 J/c! ff2 irradiation was performed. Next, the mask 3 is removed, the photosensitive glass 1 is placed in an electric furnace, and exposed to the atmosphere.
Primary heat treatment was performed by heating at 545°C for 3 hours.

LixO·S i Ch crystal 5 was precipitated as shown in FIG. 2 (cl). Next, it was immersed in a 6-ts HF aqueous solution.

The glass was stirred to form slits 2.2 on both sides of the glass as shown in FIG. This crystallized glass 6 was manually folded from the slit 2 to obtain a plurality of products 8...8 as shown in FIG. 2(e).

Reference numeral 7 indicates an ear portion for handling. As a result of observing the cross section after division, the slit depth was 180 μm, which was 20% of the thickness of the shikarasu. There was no product cracking at all.

Example 2 0, 511II11 to 2. A slit of a certain depth was formed in the photosensitive glass PSG-1 up to Orm according to the method of Example 1, and the dividing load was measured when the glass was divided after being subjected to secondary heat treatment at 650°C. The results are shown in FIG. The horizontal axis is slit depth/glass thickness.

In the figure, the X mark indicates a product in which cracking occurred during splitting, and the ○ mark indicates a product in which no cracking occurred. As is clear from FIG. 3, if the slit depth is less than 15%, the divided load is large and the product is likely to crack. There is no product cracking at all over 20 inches.

(Effects of the Invention) According to the present invention, the
The division cost is low and products with high dimensional accuracy can be obtained.

[Brief explanation of drawings]

Fig. 1 is an enlarged sectional view of the slit portion of the photosensitive glass according to the present invention, Fig. 2 is a diagram showing the manufacturing process of the photosensitive glass product according to the embodiment of the present invention, and Fig. 3 is a diagram showing the slit depth and divided load. A diagram showing the relationship between the two and FIG. 4 are diagrams illustrating a conventional manufacturing method of photosensitive glass products. Explanation of symbols 1...Photosensitive glass 2...Slit 3.
...Mask 4...Cr vapor deposited film 5...
・LizO・S10! Crystal 6... Crystallized glass 7... Ear part 8... Product 9... Hole 10... Bridging part 11... Frame number

Claims (1)

[Claims] 1. A mask having a large number of transparent parts for forming slits is placed on top of the chemically cuttable photosensitive glass and irradiated with ultraviolet rays, and then the chemically cuttable photosensitive glass is etched with a hydrofluoric acid solution after the primary heat treatment to increase the depth. A method for dividing chemically cutting photosensitive glass products, which comprises forming a slit with a thickness of 15 to 40% of the thickness of the chemically cutting photosensitive glass, and dividing from the slit portion after secondary heat treatment.