JPH0322886Y2 - - Google Patents

Info

Publication number

JPH0322886Y2

JPH0322886Y2 JP14343385U JP14343385U JPH0322886Y2 JP H0322886 Y2 JPH0322886 Y2 JP H0322886Y2 JP 14343385 U JP14343385 U JP 14343385U JP 14343385 U JP14343385 U JP 14343385U JP H0322886 Y2 JPH0322886 Y2 JP H0322886Y2

Authority

JP

Japan

Prior art keywords

varistor

electrode

insulating layer

chip

electrodes

Prior art date

1985-09-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 9
• 239000011521 glass Substances 0.000 claims description 4
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
• 229910052709 silver Inorganic materials 0.000 description 4
• 239000004332 silver Substances 0.000 description 4
• 230000000694 effects Effects 0.000 description 3
• 238000007747 plating Methods 0.000 description 3
• 229920005989 resin Polymers 0.000 description 3
• 239000011347 resin Substances 0.000 description 3
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
• UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
• 239000007772 electrode material Substances 0.000 description 2
• 230000035939 shock Effects 0.000 description 2
• 239000011800 void material Substances 0.000 description 2
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000004593 Epoxy Substances 0.000 description 1
• ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
• 239000004952 Polyamide Substances 0.000 description 1
• 239000004642 Polyimide Substances 0.000 description 1
• BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
• 238000007605 air drying Methods 0.000 description 1
• 229910045601 alloy Inorganic materials 0.000 description 1
• 239000000956 alloy Substances 0.000 description 1
• QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
• JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
• 229910002113 barium titanate Inorganic materials 0.000 description 1
• 238000009835 boiling Methods 0.000 description 1
• 238000003763 carbonization Methods 0.000 description 1
• 230000015556 catabolic process Effects 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 238000007654 immersion Methods 0.000 description 1
• 238000001746 injection moulding Methods 0.000 description 1
• 229910052742 iron Inorganic materials 0.000 description 1
• 229910044991 metal oxide Inorganic materials 0.000 description 1
• 150000004706 metal oxides Chemical class 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 229910052760 oxygen Inorganic materials 0.000 description 1
• 239000001301 oxygen Substances 0.000 description 1
• 238000004806 packaging method and process Methods 0.000 description 1
• 229920002647 polyamide Polymers 0.000 description 1
• 229920000515 polycarbonate Polymers 0.000 description 1
• 239000004417 polycarbonate Substances 0.000 description 1
• 229920001721 polyimide Polymers 0.000 description 1
• 239000000843 powder Substances 0.000 description 1
• HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
• 229910010271 silicon carbide Inorganic materials 0.000 description 1
• 238000005245 sintering Methods 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 230000000087 stabilizing effect Effects 0.000 description 1
• VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
• 229920005992 thermoplastic resin Polymers 0.000 description 1
• 229920001187 thermosetting polymer Polymers 0.000 description 1
• 238000001721 transfer moulding Methods 0.000 description 1
• 229920006305 unsaturated polyester Polymers 0.000 description 1
• 239000011787 zinc oxide Substances 0.000 description 1