JPH0322305B2 - - Google Patents
Info
- Publication number
- JPH0322305B2 JPH0322305B2 JP54036042A JP3604279A JPH0322305B2 JP H0322305 B2 JPH0322305 B2 JP H0322305B2 JP 54036042 A JP54036042 A JP 54036042A JP 3604279 A JP3604279 A JP 3604279A JP H0322305 B2 JPH0322305 B2 JP H0322305B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- protective layer
- recording
- resistors
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims description 42
- 239000007788 liquid Substances 0.000 claims description 28
- 239000011241 protective layer Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 14
- 230000008859 change Effects 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 3
- 238000000638 solvent extraction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 18
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 238000009434 installation Methods 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- -1 Furthermore Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000005338 heat storage Methods 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XKEFYDZQGKAQCN-UHFFFAOYSA-N 1,3,5-trichlorobenzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1 XKEFYDZQGKAQCN-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UBUCNCOMADRQHX-UHFFFAOYSA-N N-Nitrosodiphenylamine Chemical compound C=1C=CC=CC=1N(N=O)C1=CC=CC=C1 UBUCNCOMADRQHX-UHFFFAOYSA-N 0.000 description 1
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- WDODWFPDZYSKIA-UHFFFAOYSA-N benzeneselenol Chemical compound [SeH]C1=CC=CC=C1 WDODWFPDZYSKIA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- VGBAECKRTWHKHC-UHFFFAOYSA-N cyclopenta-1,3-diene;1-ethenylcyclopenta-1,3-diene;iron(2+) Chemical compound [Fe+2].C=1C=C[CH-]C=1.[CH2-]C=C1C=CC=C1 VGBAECKRTWHKHC-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- HWMTUNCVVYPZHZ-UHFFFAOYSA-N diphenylmercury Chemical compound C=1C=CC=CC=1[Hg]C1=CC=CC=C1 HWMTUNCVVYPZHZ-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- YUWFEBAXEOLKSG-UHFFFAOYSA-N hexamethylbenzene Chemical compound CC1=C(C)C(C)=C(C)C(C)=C1C YUWFEBAXEOLKSG-UHFFFAOYSA-N 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- CUONGYYJJVDODC-UHFFFAOYSA-N malononitrile Chemical compound N#CCC#N CUONGYYJJVDODC-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- GYVGXEWAOAAJEU-UHFFFAOYSA-N n,n,4-trimethylaniline Chemical compound CN(C)C1=CC=C(C)C=C1 GYVGXEWAOAAJEU-UHFFFAOYSA-N 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- VLZLOWPYUQHHCG-UHFFFAOYSA-N nitromethylbenzene Chemical compound [O-][N+](=O)CC1=CC=CC=C1 VLZLOWPYUQHHCG-UHFFFAOYSA-N 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- BEZDDPMMPIDMGJ-UHFFFAOYSA-N pentamethylbenzene Chemical compound CC1=CC(C)=C(C)C(C)=C1C BEZDDPMMPIDMGJ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- ORQWTLCYLDRDHK-UHFFFAOYSA-N phenylselanylbenzene Chemical compound C=1C=CC=CC=1[Se]C1=CC=CC=C1 ORQWTLCYLDRDHK-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000001454 recorded image Methods 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- NLDYACGHTUPAQU-UHFFFAOYSA-N tetracyanoethylene Chemical group N#CC(C#N)=C(C#N)C#N NLDYACGHTUPAQU-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000007651 thermal printing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- YUKQRDCYNOVPGJ-UHFFFAOYSA-N thioacetamide Chemical compound CC(N)=S YUKQRDCYNOVPGJ-UHFFFAOYSA-N 0.000 description 1
- DLFVBJFMPXGRIB-UHFFFAOYSA-N thioacetamide Natural products CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 229910001935 vanadium oxide Inorganic materials 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1604—Production of bubble jet print heads of the edge shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
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The present invention generally involves ejecting and flying a recording liquid called ink as small droplets from a fine orifice.
The present invention relates to a recording head that performs recording by adhering small droplets to a recording surface, and in particular to an inkjet recording head based on a novel and unprecedented ink ejection principle. Among the various recording methods currently known, it is a non-impact recording method that generates almost no noise during recording, is capable of high-speed recording, and does not require special fixing treatment on plain paper. The so-called inkjet recording method, which can perform recording on images, is recognized as an extremely useful recording method. Various methods have been proposed for this inkjet recording method, some have been improved and commercialized, and others are still being worked on to put them into practical use. be. The inkjet recording method is a method in which droplets of a recording liquid called ink are ejected using various principles of operation, and the droplets are attached to a recording material such as paper to perform recording. The present applicant has also already proposed a new system related to such an inkjet recording method. This new method has been proposed in Japanese Patent Application No. 118798/1982, and its basic principle is as outlined below. In other words, this new in-jet recording method applies a thermal pulse as an information signal to the recording liquid introduced into an action chamber that can contain the recording liquid, causing the liquid to change its state. In this method, the liquid is ejected and flown as small droplets from an orifice attached to the previous chamber according to the generated acting force, and the liquid is attached to the recording member to perform recording. By the way, this new method has the great advantage that the configuration of the implementation device is simpler than the conventional one, and it can be easily adapted to high-speed recording by forming a multi-array configuration, but on the other hand, the durability of the implementation device is quite high. The disadvantage of not having one was acknowledged. That is, since this implementation device employs a heating element as a means for inputting thermal pulses to the recording head, it is oxidized and degraded during repeated use in contact with the recording liquid. Inconveniences were often observed, such as the recording liquid burning on the heating element, and when using a conductive recording liquid, it was electrolyzed, interfering with the intended ejection of droplets. . Therefore, the main object of the present invention is to provide a recording head that has a long service life and an ink jet recording apparatus using the recording head. Another object of the present invention is to provide a recording head that is structurally simple and ensures stable ejection of recording droplets over a long period of time due to thermal action, and an ink jet recording apparatus using the same. The purpose of
A first invention includes a heating resistor, an electrode for energizing the heating resistor, and a protective layer for protecting the heating resistor and the electrode, and the heating resistor is provided in a liquid path communicating with a discharge part. A recording head that causes a state change due to heat in the liquid supplied into a liquid path and ejects the liquid based on the state change, the recording head comprising a plurality of the heating resistors and the electrode as the electrode. A common electrode common to a plurality of heating resistors and a selection electrode for selectively driving the plurality of heating resistors are provided on the same substrate, and the protective layer has a common electrode common to the plurality of heating resistors, a common electrode, and a selection electrode of the substrate. It is formed by laminating it on the surface where the electrode is, and has a specific resistance of 5Ã10 5 Ωã»
cm or more, and has a thickness of 0.1 ÎŒm to 5 ÎŒm, and has a wall portion on the protective layer that partitions the plurality of heat generating resistors and forms a liquid path corresponding to each of the plurality of heat generating resistors. The second invention provides a plurality of heat generating resistors, a common electrode common to the plurality of heat generating resistors as electrodes, and a selection electrode for selectively driving the plurality of heat generating resistors on the same substrate. The specific resistance formed by laminating multiple heating resistors, common electrodes, and selective electrodes on the surface is 5Ã10 5 Ωã»
cm or more, with a thickness of 0.1 ÎŒm to 5 ÎŒm, and a wall portion on the protective layer that partitions the plurality of heat generating resistors and forms a liquid path corresponding to each of the plurality of heat generating resistors. a head, and the heating resistor using the common electrode and selection electrode of the recording head;
means for supplying a voltage pulse that generates thermal energy and causes the ink to change its state due to heat; This is an ink jet recording device that performs recording by depositing ink. In other words, in the recording head of the present invention, the electric/thermal converter (heating resistor) as a means for applying an acting force to the recording liquid and the outer surface of its lead electrode have a specific resistance of 5.
By coating with a thin film of Ã10 5 Ωã»cm or more so that it comes into direct contact with the recording liquid, or by electrically insulating it and the recording liquid, its usage durability can be improved. The performance and printing stability have been sufficiently improved. Hereinafter, the present invention will be described in detail with reference to illustrations and specific examples. FIG. 1 shows an outline of the main parts of the recording apparatus of the present invention. That is, the heat generating part 2 is provided on the surface of the heat generating element installation board 1. Further, as the material of the substrate 3, glass, ceramics, heat-resistant plastic, etc. are used. The substrate 3 is pre-formed with a chamber 4' that accommodates ink before ejection and a long groove 4 that constitutes an ejection orifice 5. After aligning the
They are joined and integrated with adhesive. Next, the liquid ejection principle related to this illustrated device will be briefly described. FIG. 2 is a cross-sectional view of the groove 4 along the axis. Recording ink is supplied into the chamber 4' as indicated by the arrow in the figure. Now, when a signal is applied from the outside to the heat generating part 2 attached to a part of the chamber 4', the heat generating part 2 generates heat and gives thermal energy to the ink in the vicinity thereof. The ink that has received thermal energy undergoes a change in state such as volumetric expansion or generation of bubbles, resulting in a pressure change, and this pressure change is transmitted in the direction of the ejection orifice 5, and the ink is ejected in the form of small droplets 10. Recording is then performed by the droplets 10 adhering to an arbitrary recording material such as paper (not shown). In FIG. 2, the detailed structure of the heating element installation board 1 is illustrated, and this heating part 2 includes a heat storage layer 7, a heating resistor 11, and an electrode 8 in this order on a substrate 6 made of alumina or the like. After the heating resistor 11 and the electrode 8 are laminated using a thin film forming technique and patterned into a predetermined shape, a protective layer 9 is further laminated. This heat generating part 2 has a groove 4.
The structure is such that the inside is exposed. In the heating element installation substrate 1, the protective layer 9 is in direct contact with the ink (that is, the surface of the heating element installation substrate 1 that is the ink contact area is covered with a protective layer). This prevents the heat generating resistor 11 and the electrode 8 from being oxidized by contact with the ink, and conversely from insulating them and preventing the ink from being electrolyzed. This prevents the ink from being electrolyzed. On this protective layer, a wall for forming an ink liquid path, which will be described later, will be placed to separate multiple heat generating parts, but since the protective layer covers the entire surface, it will make the thermal characteristics uniform. It is possible to bring about an effect in the direction of Also,
Overall stabilization is achieved since the areas where the walls are located are all protective layers. Specifically, in the present invention, the protective layer 9 has a specific resistance of 5Ã10 5 Ω·cm.
A thin film having a thickness of about 0.1 Όm to 5 Όm is formed. Note that the thickness of the protective layer 9 influences the thermal response of ink droplet ejection or the quality of energy efficiency, so it is desirable that it be as thin as possible. Considering this and the quality of the insulation effect, it is estimated that 0.2Ό
A thin film with a thickness of m to 3 ÎŒm is more preferable. With the protective layer having the above structure, it is possible to provide a recording head that has excellent overall ejection response and further improves the effective use of thermal energy. Further, the details of the protective layer 9 will be explained, but in the present invention, various materials listed below are formed using known film forming techniques. That is, in the present invention, the protective layer 9 may include titanium oxide, vanadium oxide, niobium oxide, molybdenum oxide, tantalum oxide, tungsten oxide, chromium oxide, zirconium oxide, hafnium oxide, lanthanum oxide, yttrium oxide, manganese oxide, etc. transition metal oxides,
Furthermore, metal oxides such as aluminum oxide, calcium oxide, strontium oxide, barium oxide, silicon oxide, and complexes thereof. High-resistance nitrides such as silicon nitride, aluminum nitride, boron nitride, tantalum nitride, composites of these oxides and nitrides, and even semiconductors such as amorphous silicon and amorphous selenium, which have low resistance in bulk, can be sputtered, Thin films that become highly resistive during manufacturing processes such as CVD, vapor deposition, gas phase reaction, and liquid coating are generally 0.1 ÎŒm to 5 ÎŒm thick, preferably
A film is formed to a thickness of 0.2 ÎŒm to 3 ÎŒm. In addition, other characteristics include good film formation properties, a dense structure with few pinholes, no swelling or dissolution in the ink used, good insulation properties when formed, and high heat resistance. Resins with physical properties, such as silicone resins, fluororesins, aromatic polyamides, addition polymerization polyimides, polybenzimidazole, metal chelate polymers, titanate esters, epoxy resins, phthalate resins, thermosetting phenolic resins, P-vinylphenol resin, Zylock resin, triazine resin,
The protective layer 9 can also be formed by forming a film of BT resin (triazine resin and bismaleimide addition polymer resin) or the like. In addition to this, there is also a method of forming a film using a polyxylylene resin and its derivatives by vapor deposition. Furthermore, various organic compound monomers such as thiourea, thioacetamide, vinylferrocene,
1,3,5-trichlorobenzene, chlorobenzene, styrene, ferrocene, picoline, naphthalene, pentamethylbenzene, nitrotoluene, acrylonitrile, diphenylselenide, P-toluidine, P-xylene, N,N-dimethyl-P
-Toluidine, toluene, aniline, diphenylmercury, hexamethylbenzene, malononitrile, tetracyanoethylene, thiophene, benzeneselenol, tetrafluoroethylene, ethylene, N-nitrosodiphenylamine, acetylene, 1,2,4-tri The protective layer 9 can also be formed by forming a film of chlorobenzene or propane by a plasma polymerization method. The effects of the present invention will be more clearly understood from the Examples and Comparative Examples detailed below. Examples 1 to 19 First, heating element installation boards corresponding to the following Examples and Comparative Examples were created in the following manner. FIG. 3a shows an enlarged perspective view of the substrate. SiO 2 heat storage layer 13 (thickness
After forming the ZrB 2 heating resistor layer 14 (thickness: 800 Ã
) and the aluminum electrode layer 15 (thickness: 5000 Ã
), selective etching was performed to form a pattern with a width of 40 ÎŒm and a length of 40 ÎŒm.
A heating resistor 14' of 200 ÎŒm was formed. In addition, the selection electrode 15a and the common electrode 15b are etched.
was formed. Furthermore, as shown in FIG. 3b, the electrode 1
5a, 15b and the heating resistor 14', a protective layer 16 as shown in Table 1 below was laminated on the substrate as described in FIG. In addition, apart from these, a plurality of grooves 18 (width 40 ÎŒm, depth
A grooved plate 20 was also created by cutting a groove (40 ÎŒm) and a groove to become the common ink chamber 19 using a micro cutter. Each heating element installation board and grooved plate created in this way are joined together after aligning the heating elements and the grooves, and then ink is supplied from an ink supply section (not shown) to the common ink chamber 19. An ink introduction tube 21 for introducing the ink was also connected to complete a recording head block 22 as shown in FIG. 5 in an integrated manner. Furthermore, this block 22 includes the aforementioned selection electrode,
A lead board having electrode leads (a common electrode lead and a selection electrode lead) connected to the common electrode was attached. Next, as a discharge experiment condition, a rectangular voltage pulse of 40 V was applied to the heating resistor portion through the electrode lead with a pulse width of 10 ÎŒsec (short pulse width) and a pulse input period of 200 ÎŒsec. Incidentally, the composition of the ink used was 70 parts by weight of water, 29 parts of diethylene glycol, and 1 part of black dye. When an ink droplet ejection experiment was conducted using the above ejection test conditions and ink, excellent results in terms of durability were obtained as shown in Table 1 below. It was also excellent in recording performance. The durability of these Examples and Comparative Examples was evaluated based on the number of times electric pulses could be repeatedly applied, as follows. Durability evaluation criteria A...10 9 times or more B...10 8 to 10 9 times C...10 5 times or less
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ãã[Table] From the above examples, by interposing the protective layer,
It can be seen that the durability of the recording head is significantly improved. Incidentally, the heating element shown in the above explanation is conventionally a thermal printing head (that is, a thermal head) widely used in the field of thermal recording.
can be applied. They are: how to create;
The head is classified into thick film heads, thin film heads, and semiconductor heads depending on the heat generating resistor, but all of them can be used in the present invention. However, especially when performing high speed, high resolution recording, it is currently desirable to utilize thin film heads. Further, the recording ink used in the present invention includes water,
It is prepared by dissolving or dispersing a wetting agent such as ethylene glycol, a surfactant, various dyes, etc. in a main solvent such as alcohol such as ethanol or toluene. In order to avoid clogging the ejection orifice, it is effective to filter the ink after it is produced or to provide a filter in the ink flow path, as in the case of existing inkjet recording methods. As described above in detail, the present invention provides a high-performance recording head that always performs stable ink discharge and produces high-quality recorded images at high speed, and an ink jet recording apparatus using the same. I can do it.
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1 and 2 are schematic diagrams depicting only the main parts of a droplet jet recording device, and FIGS. 5 are schematic diagrams for explaining other embodiments of the present invention, respectively. In the figure, 1 is the heating element installation board, 2 is the heating element,
4' is a chamber, 5 is a discharge orifice, 8, 15, 15
a, 15b are electrodes, 9, 16 are protective layers, 11, 1
4 and 14' are heating resistors, 18 is a groove, 19 is a common ink chamber, 20 is a grooved plate, and 22 is a recording head block.
Claims (1)
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èšé²è£ 眮ã[Scope of Claims] 1. A heating resistor, an electrode for energizing the heating resistor, and a protective layer for protecting the heating resistor and the electrode, and a liquid path communicating with the discharge part. A recording head which causes the heating resistors to correspond to each other, causes a state change due to heat in the liquid supplied into the liquid path, and ejects the liquid based on the state change, the plurality of the heating resistors and the above recording head. The protective layer has a common electrode common to the plurality of heat generating resistors as an electrode, and a selection electrode for selectively driving the plurality of heat generating resistors on the same substrate, and the protective layer includes a plurality of heat generating resistors of the substrate, The specific resistance formed by laminating on the surface with the common electrode and the selection electrode is 5 à 10 5 Ωã»cm or more,
A wall portion having a thickness of 0.1 ÎŒm to 5 ÎŒm and partitioning the plurality of heating resistors and forming a liquid path corresponding to each of the plurality of heating resistors is provided on the protective layer. Record head. 2. A plurality of heating resistors, a common electrode common to the plurality of heating resistors as electrodes, and a selection electrode for selectively driving the plurality of heating resistors are provided on the same substrate, and the plurality of heating resistors of the substrate are common. a protective layer which is laminated on the surface of the electrode and the selection electrode and has a specific resistance of 5Ã10 5 Ω·cm or more and a thickness of 0.1 ÎŒm to 5 ÎŒm; and a protective layer that partitions the plurality of heat generating resistors. A recording head is provided with a wall portion on the protective layer that forms a liquid path corresponding to each body, and the common electrode and selection electrode of the recording head are used to generate thermal energy in the heating resistor. means for supplying a voltage pulse that causes the ink to change its state due to heat, and performs recording by attaching ink droplets ejected from the ejection part of the recording head to the recording medium in accordance with the state change. Ink jet recording device.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3604279A JPS55128468A (en) | 1979-03-27 | 1979-03-27 | Recording head |
DE19803011919 DE3011919A1 (en) | 1979-03-27 | 1980-03-27 | METHOD FOR PRODUCING A RECORDING HEAD |
DE3051228A DE3051228C2 (en) | 1979-03-27 | 1980-03-27 | Ink jet printing head mfg. method |
US06/309,411 US4392907A (en) | 1979-03-27 | 1981-10-07 | Method for producing recording head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3604279A JPS55128468A (en) | 1979-03-27 | 1979-03-27 | Recording head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55128468A JPS55128468A (en) | 1980-10-04 |
JPH0322305B2 true JPH0322305B2 (en) | 1991-03-26 |
Family
ID=12458645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3604279A Granted JPS55128468A (en) | 1979-03-27 | 1979-03-27 | Recording head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55128468A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69610482T2 (en) * | 1995-07-14 | 2001-02-01 | Seiko Epson Corp | LAMINATED PRINT HEAD FOR INK JET RECORDING, MANUFACTURING METHOD THEREFOR AND PRINTER EQUIPPED WITH THE RECORDING HEAD |
WO2016078957A1 (en) * | 2014-11-19 | 2016-05-26 | Memjet Technology Limited | Inkjet nozzle device having improved lifetime |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6159913A (en) * | 1984-08-30 | 1986-03-27 | Shin Kobe Electric Mach Co Ltd | Ad converting circuit |
-
1979
- 1979-03-27 JP JP3604279A patent/JPS55128468A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6159913A (en) * | 1984-08-30 | 1986-03-27 | Shin Kobe Electric Mach Co Ltd | Ad converting circuit |
Also Published As
Publication number | Publication date |
---|---|
JPS55128468A (en) | 1980-10-04 |
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