JPH03219659A - Semiconductor device - Google Patents

Abstract

PURPOSE:To switch an input, an output, an input/output interface by merely adding wirings and contacts by composing an input/output interface cell of two pads and two output cells having adjustable driving capacity. CONSTITUTION:An output interface is conducted via an output circuit drain 103, an output circuit P-channel side gate 104, an output circuit source 105, and an output circuit N-channel side gate 108 by a signal controlled by a controller 109 for controlling an output signal from an IC interior, an output interface is conducted by pads 101, 115, and output out of the IC via the pads 101, 115. Even if the pads 101, 115 are used as input/output cells, the input/output are controlled by the controller 109. If the pads 101, 115 are used as input cells, the pads 101, 115 are connected to wirings 102 by aluminum, and an interface of the exterior and the interior of the IC is conducted by a circuit 110, and input by using the wiring of 111 to the interior of the IC.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to a semiconductor device, and particularly to a semiconductor device using a master slice method in which input/output cells or the like are previously used as masters.

[Prior Art] A semiconductor device having a conventional input/output interface cell as a master has one input cell and one output cell per l pad, and at the CAD design stage, it is determined whether it is an input cell or an output cell. The configuration was such that wiring could be used to determine whether the cell was a cell or an input/output cell.

[Problem to be solved by the invention] However, after defining inputs, outputs, and input/outputs at the CAD design stage, except when setting input/output terminals, when setting input terminals, the output circuit section At the time of setup, each input circuit section was placed and designed in an unused state. Also,
When high drive output is required, a high drive design is achieved by connecting two adjacent output cells between pads or during bonding. In both conventional methods, nearly half of the in-chip interface cell area remains on the pattern as an unused area.
In addition, as the area of a single interface cell increases, the limit on the number of pads that can be secured within a chip becomes stricter, and when setting a high drive output, two pads are required per terminal, making it necessary to handle ICs with a large number of pins and a small number of gates. It was a hindrance.

Therefore, the present invention makes it possible to switch between input interface, output interface, and human output interface by simply adding wiring and contacts in CAD design, as in the past, and allows variable setting of output capacity even when designing high drive output. This is suitable for designing a small number of gates Ic.

[Means for Solving the Problems] A semiconductor device of the present invention includes two adjacent pads and a corresponding 2m input interface circuit in a semiconductor device that has an external interface input/output circuit as a master in advance; 2
It is characterized by consisting of two output interface circuits that can be connected from either of the gA pads and whose drive capabilities can be variably adjusted.

[Implementation example 1] Embodiments of the present invention will be described below with reference to the drawings.

Figure 1 shows the layout configuration of a semiconductor device according to the present invention. In the figure, 101 and 105 are pad portions for connecting the input, output, and human output of the chip to the lead frame of the IC package using bonding wires. is 0
In the figure, 102 is a circuit that interfaces an input signal from outside the IC with the IC and introduces it into the IC. In the figure, 103 is a drain section of an interface circuit that outputs a signal from inside the IC to the outside of the IC. When designing 101 as output or human output, by connecting 101.115 and 103 with aluminum etc., it is possible to output the signal inside the IC to the outside of the IC. 104 in the figure is the output signal to the outside of the IC. 105 in the figure, which is the P-channel side gate part of the interface drive circuit, is the source part of the output signal interface circuit from the inside of the IC to the outside of the IC.The number 106 in the figure is 103.104.
107 in the figure is the VDD line that supplies the output interface circuit section constituted by 105 and 103,1.
04.105 is the ■SS line that supplies the output interface circuit section configured by 0. 1O8 in the figure is the I
109 in the figure is the N-channel side gate part of the output signal interface circuit from the inside of the IC to the outside of the IC.
This is a control circuit section that controls output signals from inside. The signal controlled by 108 is 103.104.105
．． 108 performs the output interface 101.1
15 provides an output interface, 101, 11
5 to the outside of the IC. Also, when 101.115 is used as an input/output cell, input/output is controlled by 109 and output is performed. When pads 101 and 115 are used as input cells, the pads 110 and 115 in the figure are connected by connecting pads 115 and 102 with aluminum or the like.
interface between the outside and inside of the IC, and input to the inside of the IC using wiring 111.

In the figure, 112 indicates the output control signal from inside the IC when pads 101 and 115 are used as input/output cells.
This is the wiring for inputting to 09.

In the figure, 113 is a wiring for outputting a signal inside the IC to the outside of the IC. In the figure, when a high output is required from either 110 or 115, 114 in the figure can be used to change the dimension of the output interface circuit by connecting 103 to the output interface pattern using aluminum or the like.

FIG. 2 is a supplementary simplified circuit diagram that can be viewed overlapping with FIG. 1 to make it easier to understand FIG.

[Effect of the invention 1] As described above, the present invention has a configuration in which two pads constitute two input interface cells and one variable output interface cell, so normally the output interface cell is divided into two. The pad has a configuration of two input interface cells and two output interfaces,
When high drive output is required, it is possible to have a configuration of two input interface cells and one variable output interface cell with two pads, reducing the area of the input interface circuit and output interface circuit in the interface cell part of the IC. This makes it possible to efficiently arrange ICs with more pins and fewer gates, and to reduce the chip area.

[Brief explanation of drawings]

FIG. 1 is a diagram of the arrangement of an input/output interface cell including a pad portion, which is a semiconductor device of the present invention, in an IC chip;
FIG. 2 is a circuit diagram of FIG. 1. 01 102 ・ 03 04 105 ・ 106 ・ 107 ・ 108 ・ 09 10 Pad section / Input circuit section Wiring / Output circuit Drain section Output circuit section P-channel side Gate section / Output port IIa section Source section Output circuit section P-channel side VDD wiring output circuit section N-channel side SS wiring/output circuit section N-channel side gate section output circuit control circuit section/input circuit section 11...Introduction wiring between internal circuit and input circuit section 12...Output control signal Input section 13...Introduction wiring between output circuit and internal circuit section 14...Wiring for variable drive capacity 15...Pad section 16 adjacent to 101...Connection contact of aluminum and polysilicon for wiring 117...Different layer wiring More than connection contact between aluminum

Claims (1)

[Claims] A semiconductor device that has an input/output interface cell as a master in advance for interfacing with the outside, and has two input/output interface cells.
1. A semiconductor device comprising two pads and two output cells whose drive capability can be adjusted.