JPH03214783A - Laminated sensor - Google Patents

Abstract

PURPOSE:To obtain a laminated sensor, whose packaging process is simple and which is uniform in characteristics, by a method wherein two substrates are laminated to each other in such a way that the sides, on which sensor elements are respectively arranged, of both substrates are made to oppose to each other. CONSTITUTION:First sensor elements 2 are formed and arranged on one surface 1a of a first substrate 1 of a plate thickness of (t) and second sensor elements 5 are formed on one surface 4a of a second substrate 4, which has a dimension identical with that of the substrate 1 and consists of a material identical with that of the substrate 1. In this case, the substrates 1 and 4 are laminated to each other with a bonding agent 7, such as an epoxy resin or the like, in such a way that the surfaces 1a and 4a, on which the elements 2 and 5 are respectively arranged, are made to oppose to each other, but, at this time, the end part, which is electrically connected with both elements 2 and 5, of a lead frame 8 is arranged between both substrates 1 and 4 and is electrically connected with both substrates with a conductive bonding agent or a solder 9. Thereby, the characteristics of the sensor elements to be laminated are easy to make uniform and a laminated sensor, whose packaging process is simple, can be obtained.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a stacked sensor.

[Conventional technology]

In order to improve the performance or downsize a sensor, it is known to arrange a first sensor element on a substrate and laminate a second sensor element thereon with an insulating layer interposed therebetween to form a multilayer sensor. (For example, Japanese Patent Application Laid-Open No. 61-266
Publication No. 479 or Unexamined Japanese Patent Publication No. 1988-62-2897
2 See Publication No. 2).

[Problem to be solved by the invention]

In the conventional technology described above, when a thin film magnetoresistive element is used as the sensor element 1 and the first and second sensor elements are electrically connected to form opposite sides of a resistive bridge connection, It is necessary to make the characteristics of the first and second sensor elements the same, but the surface condition and thermal expansion coefficient of the substrate, for example, glass, on which the first sensor element 1 is disposed, and the insulating layer, on which the second sensor element is disposed. Due to the difference in the sensor element formed on the surface]・
There was a problem that it was difficult to match the characteristics of the two.

Further, the above-mentioned conventional technology requires a packaging process such as molding or potting after forming the laminated structure, which requires a large number of man-hours.

Such problems are not limited to magnetic sensors such as thin-film magnetoresistive elements, but also apply to temperature sensors.

In view of the above, it is an object of the present invention to propose a stacked sensor in which the characteristics of stacked sensor elements are easy to match and the packaging process is simple.

[Means for Solving the Problems] In order to achieve the above object, the laminated sensor of the present invention has the following features:
A first substrate (1) with first sensor elements 1 and (2) arranged on one surface (1a), and a second substrate (1) on one surface (4a) thereof.
a second substrate (4) on which a sensor element (5) is arranged;
and each surface (1a) of both substrates (1) and (4).
It is characterized by having a laminated structure in which both substrates (1) and (4) are bonded together with the substrates (4a) facing each other.

[Operation] Since the first and second sensor elements are arranged on the respective surfaces (1a) and (4a) of the first and second substrates,
Both elements are formed on a substrate, making it easy to match the characteristics of both elements. Furthermore, since both substrates bonded together act as a package, no packaging process is required.

〔Example〕

In FIG. 1, ``■'' is a thick first substrate, and a first sensor element 2 is formed and arranged on one surface 1a of the first substrate. 3 is a protective film covering sensor element 1-2. A second substrate 4 has the same dimensions and the same material as the first substrate 1, and a second sensor element 5 is formed on one surface 4a thereof. 6 is a protective film that covers the sensor elements 1 and 5. The first and second substrates 1 and 4 are bonded together with an adhesive 7 such as epoxy resin with surfaces 1a and 48 on which the elements 1, 2 and 5 of the sensor 4 are arranged facing each other. ELECTRICAL CONNECTION WITH ELEMENT 2.5 The end of sliding frame 8 is placed between both substrates 1 and 4 and electrically connected by conductive adhesive or solder 9.

In the embodiment shown in FIG. 1, the lead frame 8 is used as a lead wire, but a flexible printed wiring board may be used instead of the lead frame.

In the embodiment shown in FIG. 2, a flexible printed wiring board 1 and a wiring board 10 are used as lead wires, and an anisotropic conductive film 11 is used for electrical connection between the flexible printed wiring board 10 and sensor elements 2 and 5. The structure of the other parts is the same as that of the embodiment shown in FIG. 1, so the explanation thereof will be omitted.

〔Effect of the invention〕

In the multilayer sensor of the present invention, since both the first and second sensor elements are formed on the substrate, their characteristics are uniform, and a multilayer sensor with excellent performance can be obtained. Furthermore, since the structure is vertically symmetrical with the adhesive as a boundary, the warpage of both substrates due to thermal expansion is canceled out, making them less susceptible to the adverse effects of temperature changes.

Furthermore, since both substrates are bonded together with the sides on which the sensor elements are placed facing each other, the two substrates form a package and are sealed with adhesive, eliminating the need for a special packaging process. .

In particular, it is possible to eliminate the molding and botting steps as packaging steps, which are required in the prior art. Furthermore, a stacked sensor can be manufactured through simple steps without using the conventionally complicated and technically difficult stacking technology.

[Brief explanation of drawings]

1 and 2 are longitudinal sectional views of different embodiments of the invention. ■, 4 ・Substrate, 1a 4a・・One side, 2 5 Sensor element, 7 ・Adhesion rule patent 1 person Aichi Watch Electric Co., Ltd.

Claims (1)

[Claims] A first substrate (1) with a first sensor element (2) arranged on its one surface (1a), and a second substrate (4) with a second sensor element (5) arranged on its one surface (4a). and each surface (1a) (4) of both substrates (1) (4).
A laminated sensor characterized by having a laminated structure in which both substrates (1) and (4) are bonded together with the substrates (1) and (4) facing each other.