JPH0321094B2 - - Google Patents

Info

Publication number
JPH0321094B2
JPH0321094B2 JP60059653A JP5965385A JPH0321094B2 JP H0321094 B2 JPH0321094 B2 JP H0321094B2 JP 60059653 A JP60059653 A JP 60059653A JP 5965385 A JP5965385 A JP 5965385A JP H0321094 B2 JPH0321094 B2 JP H0321094B2
Authority
JP
Japan
Prior art keywords
bellows
cooling
semiconductor module
housing
cooling structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60059653A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61220359A (ja
Inventor
Ryoichi Kajiwara
Takao Funamoto
Mitsuo Kato
Tomohiko Shida
Kyo Matsuzaka
Hiroshi Wachi
Kazuya Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60059653A priority Critical patent/JPS61220359A/ja
Priority to DE8686104059T priority patent/DE3682797D1/de
Priority to US06/843,623 priority patent/US4740866A/en
Priority to EP86104059A priority patent/EP0196054B1/en
Publication of JPS61220359A publication Critical patent/JPS61220359A/ja
Publication of JPH0321094B2 publication Critical patent/JPH0321094B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/776—Arrangements for jet impingement, e.g. for spraying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/772—Bellows
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP60059653A 1985-03-26 1985-03-26 半導体モジユ−ル冷却構造体 Granted JPS61220359A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60059653A JPS61220359A (ja) 1985-03-26 1985-03-26 半導体モジユ−ル冷却構造体
DE8686104059T DE3682797D1 (de) 1985-03-26 1986-03-25 Kuehlungsstruktur fuer halbleitermodul.
US06/843,623 US4740866A (en) 1985-03-26 1986-03-25 Sealed-type liquid cooling device with expandable bellow for semiconductor chips
EP86104059A EP0196054B1 (en) 1985-03-26 1986-03-25 Semiconductor module cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60059653A JPS61220359A (ja) 1985-03-26 1985-03-26 半導体モジユ−ル冷却構造体

Publications (2)

Publication Number Publication Date
JPS61220359A JPS61220359A (ja) 1986-09-30
JPH0321094B2 true JPH0321094B2 (https=) 1991-03-20

Family

ID=13119374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60059653A Granted JPS61220359A (ja) 1985-03-26 1985-03-26 半導体モジユ−ル冷却構造体

Country Status (4)

Country Link
US (1) US4740866A (https=)
EP (1) EP0196054B1 (https=)
JP (1) JPS61220359A (https=)
DE (1) DE3682797D1 (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0217676B1 (en) * 1985-10-04 1993-09-01 Fujitsu Limited Cooling system for electronic circuit device
US4759403A (en) * 1986-04-30 1988-07-26 International Business Machines Corp. Hydraulic manifold for water cooling of multi-chip electric modules
JPH065700B2 (ja) * 1987-07-22 1994-01-19 株式会社日立製作所 電子回路デバイスの冷却装置
US4996589A (en) * 1987-10-21 1991-02-26 Hitachi, Ltd. Semiconductor module and cooling device of the same
JP2786193B2 (ja) * 1987-10-26 1998-08-13 株式会社日立製作所 半導体冷却装置
US4938279A (en) * 1988-02-05 1990-07-03 Hughes Aircraft Company Flexible membrane heat sink
FR2631433B1 (fr) * 1988-05-10 1990-08-24 Sagem Perfectionnements apportes aux dispositifs permettant d'ajuster la temperature d'un element par soufflage d'un gaz a la temperature appropriee
WO1989012319A1 (fr) * 1988-06-06 1989-12-14 Hitachi, Ltd. Module de boitier de semi-conducteurs et structure de bloc thermoconducteur utilisee a cet effet
US4871015A (en) * 1988-07-13 1989-10-03 United Technologies Cooling arrangement
CA2002213C (en) * 1988-11-10 1999-03-30 Iwona Turlik High performance integrated circuit chip package and method of making same
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors
US4910642A (en) * 1988-12-05 1990-03-20 Sundstrand Corporation Coolant activated contact compact high intensity cooler
JPH02206152A (ja) * 1989-02-06 1990-08-15 Fujitsu Ltd 集積回路素子用冷却ヘッド
US5063476A (en) * 1989-12-05 1991-11-05 Digital Equipment Corporation Apparatus for controlled air-impingement module cooling
US5006924A (en) * 1989-12-29 1991-04-09 International Business Machines Corporation Heat sink for utilization with high density integrated circuit substrates
JPH04196395A (ja) * 1990-11-28 1992-07-16 Hitachi Ltd 冷却装置を備えた電子計算機
US5070936A (en) * 1991-02-15 1991-12-10 United States Of America As Represented By The Secretary Of The Air Force High intensity heat exchanger system
US5294830A (en) * 1991-05-21 1994-03-15 International Business Machines Corporation Apparatus for indirect impingement cooling of integrated circuit chips
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
US5228502A (en) * 1991-09-04 1993-07-20 International Business Machines Corporation Cooling by use of multiple parallel convective surfaces
US5241131A (en) * 1992-04-14 1993-08-31 International Business Machines Corporation Erosion/corrosion resistant diaphragm
US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
US6173760B1 (en) * 1998-08-04 2001-01-16 International Business Machines Corporation Co-axial bellows liquid heatsink for high power module test
RU2164188C2 (ru) * 1999-02-04 2001-03-20 Открытое акционерное общество НПО Энергомаш им.акад. В.П. Глушко Способ изготовления многослойных тонкостенных сильфонов
US7385821B1 (en) * 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
US7100389B1 (en) 2002-07-16 2006-09-05 Delta Design, Inc. Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
DE10243026B3 (de) * 2002-09-13 2004-06-03 Oliver Laing Vorrichtung zur lokalen Kühlung oder Erwärmung eines Gegenstandes
US7013955B2 (en) * 2003-07-28 2006-03-21 Thermal Corp. Flexible loop thermosyphon
US20060169438A1 (en) * 2005-01-28 2006-08-03 Malone Christopher G Thermally conductive cover directly attached to heat producing component
JP2006245356A (ja) * 2005-03-04 2006-09-14 Hitachi Ltd 電子デバイスの冷却装置
US7255153B2 (en) * 2005-05-25 2007-08-14 International Business Machines Corporation High performance integrated MLC cooling device for high power density ICS and method for manufacturing
JP5137379B2 (ja) * 2005-11-14 2013-02-06 インターナショナル・ビジネス・マシーンズ・コーポレーション 衝突冷却器
US7656025B2 (en) * 2006-11-21 2010-02-02 The Boeing Company Direct semiconductor contact ebullient cooling package
US8145327B2 (en) * 2009-03-13 2012-03-27 Susan Banks Method and apparatus for implementing a consumer-configurable modular electrical system
US8363413B2 (en) * 2010-09-13 2013-01-29 Raytheon Company Assembly to provide thermal cooling
US8152341B2 (en) 2011-02-04 2012-04-10 Switch Bulb Company, Inc. Expandable liquid volume in an LED bulb
US8686623B2 (en) 2012-02-01 2014-04-01 Switch Bulb Company, Inc. Omni-directional channeling of liquids for passive convection in LED bulbs
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
US10070558B2 (en) 2016-04-07 2018-09-04 Hamilton Sundstrand Corporation Immersion cooled electronic assemblies
US11125429B2 (en) * 2016-07-11 2021-09-21 Signify Holding B.V. Folded sheet metal heat sink

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653690A (en) * 1970-09-14 1972-04-04 Standard Safety Equipment Co Safety garment joint and method of making same
US3796103A (en) * 1972-05-01 1974-03-12 Rodgard Mfg Co Inc Polished rod protector
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
US4484772A (en) * 1982-03-24 1984-11-27 Ross Sr Victor H Rotatable bellows-like cover

Also Published As

Publication number Publication date
EP0196054A2 (en) 1986-10-01
EP0196054B1 (en) 1991-12-11
JPS61220359A (ja) 1986-09-30
US4740866A (en) 1988-04-26
EP0196054A3 (en) 1987-04-01
DE3682797D1 (de) 1992-01-23

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