JPH0320068B2 - - Google Patents

Info

Publication number
JPH0320068B2
JPH0320068B2 JP60001927A JP192785A JPH0320068B2 JP H0320068 B2 JPH0320068 B2 JP H0320068B2 JP 60001927 A JP60001927 A JP 60001927A JP 192785 A JP192785 A JP 192785A JP H0320068 B2 JPH0320068 B2 JP H0320068B2
Authority
JP
Japan
Prior art keywords
epoxy resin
semiconductor device
powder
curing agent
organosilicon powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60001927A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61160955A (ja
Inventor
Toku Nagasawa
Kazuyuki Kuwata
Hideto Kimura
Kazuo Iko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP60001927A priority Critical patent/JPS61160955A/ja
Publication of JPS61160955A publication Critical patent/JPS61160955A/ja
Publication of JPH0320068B2 publication Critical patent/JPH0320068B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60001927A 1985-01-09 1985-01-09 半導体装置 Granted JPS61160955A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60001927A JPS61160955A (ja) 1985-01-09 1985-01-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60001927A JPS61160955A (ja) 1985-01-09 1985-01-09 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4584794A Division JPH0770408A (ja) 1994-03-16 1994-03-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS61160955A JPS61160955A (ja) 1986-07-21
JPH0320068B2 true JPH0320068B2 (enExample) 1991-03-18

Family

ID=11515232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60001927A Granted JPS61160955A (ja) 1985-01-09 1985-01-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS61160955A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2585384B2 (ja) * 1988-07-28 1997-02-26 東芝シリコーン株式会社 封止用樹脂組成物
KR20230110777A (ko) 2020-11-27 2023-07-25 신에쓰 가가꾸 고교 가부시끼가이샤 열경화성 수지 조성물

Also Published As

Publication number Publication date
JPS61160955A (ja) 1986-07-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term