JPH03196001A - Multilayered film type interference filter with no substrate and production thereof - Google Patents
Multilayered film type interference filter with no substrate and production thereofInfo
- Publication number
- JPH03196001A JPH03196001A JP33514589A JP33514589A JPH03196001A JP H03196001 A JPH03196001 A JP H03196001A JP 33514589 A JP33514589 A JP 33514589A JP 33514589 A JP33514589 A JP 33514589A JP H03196001 A JPH03196001 A JP H03196001A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- interference filter
- film
- filter
- interference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000005530 etching Methods 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 24
- 238000000926 separation method Methods 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 2
- 239000005357 flat glass Substances 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 238000010849 ion bombardment Methods 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 102220043690 rs1049562 Human genes 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Landscapes
- Optical Filters (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は干渉フィルター、特に基板のない多層膜干渉
フィルターに関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to an interference filter, and in particular to a multilayer interference filter without a substrate.
(従来技術)
周知のように、光学部材として、干渉フィルターは現在
広く利用されている。しかし、蒸着加工法によって製作
されるのが一般であり、普通には透明なガラス板を基板
とし、その上に蒸着される。(Prior Art) As is well known, interference filters are currently widely used as optical members. However, it is generally manufactured by a vapor deposition process, and usually a transparent glass plate is used as a substrate, and vapor deposition is performed on the substrate.
そのため、基板が不可欠と考えられており、基板の材質
や形状によって干渉フィルターの製作や利用が制限され
るという問題も生じている。For this reason, the substrate is considered essential, and the problem arises that the manufacture and use of interference filters are restricted depending on the material and shape of the substrate.
(この発明が解決しようとする問題点)この発明は、凹
凸のある基板や、干渉フィルターの従来法による加工条
件に耐えることの出来ない基板上に干渉フィルターを付
加したり、また。(Problems to be Solved by the Invention) This invention can be used to add an interference filter to a substrate that has irregularities or which cannot withstand the processing conditions of conventional interference filter methods.
光ファイバー等の微小な光学部材に干渉フィルターの機
能を付加することを可能とし、干渉フィルターから基板
による影響を排除しようとするものである。This makes it possible to add the function of an interference filter to a minute optical member such as an optical fiber, and attempts to eliminate the influence of the substrate from the interference filter.
(問題を解決するための手段)
この発明の基板のない多層膜干渉フィルターの製造方法
は、基板上にエツチング可能な分離層を形成する第1工
程、該分離層上に多層膜を形成する第2工程、次いで分
離層をエツチングし基板と多層膜とを分離する第3工程
からなることを特徴とする。(Means for Solving the Problem) The method for manufacturing a multilayer interference filter without a substrate of the present invention includes a first step of forming an etched separation layer on a substrate, and a step of forming a multilayer film on the separation layer. It is characterized by comprising two steps, and then a third step of etching the separation layer to separate the substrate and the multilayer film.
より具体的には、平らなガラス基板上に上記分離層とし
てアルミニウム薄膜を常法によって形成する第1工程、
イオン衝撃装置(例えば特開昭61−37962号公報
参照)を用いて製作することが望ましい所望の特性を有
する多層干渉フィルターを形成する第2工程、形成され
た基板を有する多層干渉フィルターを適当な大きさに切
断する第3工程、切断した干渉フィルターをアルミニウ
ムのエツチングによって多層干渉フィルターと基板とに
分離する第4工程からなっている。More specifically, a first step of forming an aluminum thin film as the separation layer on a flat glass substrate by a conventional method;
The second step is to form a multilayer interference filter having desired characteristics, which is preferably manufactured using an ion bombardment device (for example, see Japanese Patent Application Laid-Open No. 61-37962). The third step is cutting to size, and the fourth step is separating the cut interference filter into a multilayer interference filter and a substrate by etching aluminum.
また、アルミニウム層は展延性に富むので、干渉フィル
ター形成時にその中に応力が蓄積されることがなく、基
板との分離後に干渉フィルターに変形がないという特性
を有する。Furthermore, since the aluminum layer is highly malleable, no stress is accumulated therein during formation of the interference filter, and the interference filter does not deform after separation from the substrate.
このようにして製作された干渉フィルターは、多層膜の
みによって構成され、基板を持たないという画期的な構
造の干渉フィルターとなる。The interference filter manufactured in this way has an innovative structure, consisting only of multilayer films and no substrate.
(実施例) 以下、この発明を実施例によって詳細に説明する。(Example) Hereinafter, this invention will be explained in detail by way of examples.
第1図は、前記のイオン衝撃装置の一例を示し、真空槽
中の回転基盤保持装置に保持された基盤1には、補助電
極3及びマツチングボックス4を介して、電源5から高
周波電力が供給される。蒸発源2からの構成物質は、高
周波によるプラズマ中でイオン化され、プラズマによっ
て発生したバイアス電場によって加速され、基盤1表面
に衝突、堆積する。このイオン衝撃装置によって製作さ
れた干渉フィルターの膜質は、従来の真空蒸着法で製作
された干渉フィルターの膜質と比べて塊状物質に近い高
い密度を持ち、干渉フィルターを構成する物質が緻密に
詰まっているので、基板を取り除いてもその形状を維持
しやすいという特性を有するので、この発明には特に適
している。FIG. 1 shows an example of the above-mentioned ion bombardment device. A substrate 1 held by a rotating substrate holding device in a vacuum chamber is supplied with high-frequency power from a power source 5 via an auxiliary electrode 3 and a matching box 4. Supplied. The constituent substances from the evaporation source 2 are ionized in plasma by high frequency waves, accelerated by a bias electric field generated by the plasma, and collide with and deposit on the surface of the substrate 1. The film quality of the interference filter manufactured using this ion bombardment device has a high density similar to that of a block substance compared to the film quality of the interference filter manufactured using the conventional vacuum evaporation method, and the materials that make up the interference filter are densely packed. It is particularly suitable for this invention because it has the characteristic that it can easily maintain its shape even if the substrate is removed.
この発明においては、基盤1として、予め膜厚5000
人のアルミニウムが蒸着されたガラス基盤を用いる。第
2図に、このようにして製作された多層膜干渉フィルタ
ーの断面図を示す0図中、12はガラス基板、11はア
ルミニウム膜であり、9.10はそれぞれTiO2膜、
Sin、膜を示す。In this invention, the substrate 1 has a film thickness of 5000
It uses a glass base on which aluminum is vapor-deposited. FIG. 2 shows a cross-sectional view of the multilayer interference filter manufactured in this way, in which 12 is a glass substrate, 11 is an aluminum film, 9 and 10 are a TiO2 film,
Sin, indicates a membrane.
下記の表はこの発明の干渉フィルターの製法の実用性を
確かめるための試作に用いた。干渉フィルターを構成す
る物質とその膜厚を示す。The table below was used in a trial production to confirm the practicality of the interference filter manufacturing method of the present invention. The materials that make up the interference filter and their film thicknesses are shown.
この干渉フィルターの透過損失特性の理論値を第3図に
示す。The theoretical values of the transmission loss characteristics of this interference filter are shown in FIG.
次いでこのフィルターは、第4図に示すように、適宜の
大きさに基板12ごと切断され、エツチングによって基
板からフィルター層が分離される。Next, as shown in FIG. 4, this filter is cut into appropriate sizes along with the substrate 12, and the filter layer is separated from the substrate by etching.
実施例にお、いては、H,PO4: HNO,: CH
,C00H:H20=16 : 1 : 2 : 1の
組成を持つA1エツチング液により・80℃でAl膜の
除去を行ない、損傷のない、干渉フィルター膜を得るこ
とができた。In the examples, H, PO4: HNO,: CH
, C00H:H20=16:1:2:1 The Al film was removed at 80°C using an A1 etching solution having a composition of 16:1:2:1, and an interference filter film without damage could be obtained.
次いでこの干渉膜を洗浄し、第5図に示すように、接着
剤で光ファイバーの接合部に接着した。The interference film was then cleaned and bonded to the joint of the optical fiber with an adhesive, as shown in FIG.
図中、6は光ファイバー 7は干渉膜、8は光学用接着
剤を示す。そして、接着された多層膜干渉フィルターは
、略設計値通りの性能を持つことが確認された。In the figure, 6 is an optical fiber, 7 is an interference film, and 8 is an optical adhesive. It was confirmed that the bonded multilayer interference filter had performance approximately in accordance with the designed value.
この実施例では、干渉膜を分離後接着したが、基板ごと
膜面を接着し、その後基板を分離する等、適宜の変更が
可能である。In this embodiment, the interference film was separated and then bonded; however, appropriate changes may be made, such as bonding the film surface together with the substrate and then separating the substrate.
(発明の効果)
以上述べたように、この発明は、従来常識とされていた
光学干渉フィルターの基板を取り除き、純粋に干渉膜だ
けを単体のフィルターとして取り出すことができ、干渉
フィルターの応用範囲を広め、光学部材の製作の自由度
を高めるという顕著な効果を奏するものである。(Effects of the Invention) As described above, the present invention removes the substrate of an optical interference filter, which was conventionally considered common knowledge, and makes it possible to take out only the interference film as a single filter, expanding the range of applications of interference filters. This has the remarkable effect of increasing the degree of freedom in manufacturing optical members.
第1図はこの発明のフィルターの製作に使用されるイオ
ン衝撃装置の一例の構成概念図、第2図はこの発明のフ
ィルターの製作過程におけるフィルターの構成を示す断
面図、第3図は干渉フィルターの透過損失特性の理論値
の1例、第4図はこの発明のフィルターの製作過程にお
けるフィルターの切断状況の1例を示す平面図、第5図
はこの発明の多層膜干渉フィルターの利用法の1例を示
す断面図である1図中の符号は
1:基盤 2:蒸発源
4:マツチングボックス
6:光ファイバー
8:光学用接着剤
10:SiO,膜
12ニガラス基板
3:補助電極
5:ffi源
7:干渉膜
9:TiO,膜
11ニアルミニウム膜
を示す。
第
図
第
図
1αυ 1[+ 120013(D 14(D 150
016(D 1711X) 18C019002CI
刀波長Fig. 1 is a conceptual diagram of the configuration of an example of an ion bombardment device used in manufacturing the filter of this invention, Fig. 2 is a sectional view showing the configuration of the filter in the manufacturing process of the filter of this invention, and Fig. 3 is an interference filter. FIG. 4 is a plan view showing an example of how the filter is cut during the manufacturing process of the filter of the present invention, and FIG. 5 is a method of using the multilayer interference filter of the present invention. The symbols in Figure 1, which is a cross-sectional view showing one example, are 1: Substrate 2: Evaporation source 4: Matching box 6: Optical fiber 8: Optical adhesive 10: SiO, film 12, Glass substrate 3: Auxiliary electrode 5: ffi Source 7: interference film 9: TiO, film 11: Nialuminum film. Figure Figure 1 αυ 1 [+ 120013 (D 14 (D 150
016(D 1711X) 18C019002CI
sword wavelength
Claims (1)
該分離層上に多層膜を形成する工程、次いで分離層をエ
ッチングし基板と多層膜とを分離する工程からなること
を特徴とする基板のない多層膜干渉フィルターの製造方
法 2)上記分離層がアルミニウム薄膜であることを特徴と
する請求項1の基板のない多層膜干渉フィルターの製造
方法 3)多層膜を形成後、基板から分離されたことを特徴と
する基板のない多層膜干渉フィルター[Claims] 1) forming an etchable separation layer on a substrate;
2) A method for producing a multilayer film interference filter without a substrate, comprising the steps of forming a multilayer film on the separation layer, and then etching the separation layer to separate the substrate and the multilayer film. 2) The separation layer is 3) A method for manufacturing a multilayer interference filter without a substrate according to claim 1, wherein the multilayer interference filter is made of an aluminum thin film. 3) The multilayer interference filter without a substrate is separated from the substrate after forming the multilayer film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33514589A JPH03196001A (en) | 1989-12-26 | 1989-12-26 | Multilayered film type interference filter with no substrate and production thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33514589A JPH03196001A (en) | 1989-12-26 | 1989-12-26 | Multilayered film type interference filter with no substrate and production thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03196001A true JPH03196001A (en) | 1991-08-27 |
Family
ID=18285268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33514589A Pending JPH03196001A (en) | 1989-12-26 | 1989-12-26 | Multilayered film type interference filter with no substrate and production thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03196001A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH047505A (en) * | 1990-04-25 | 1992-01-10 | Copal Co Ltd | Production of optical multilayered-film filter element |
EP1262803A1 (en) * | 2001-05-21 | 2002-12-04 | JDS Uniphase Inc. | Stress free thermally stabilized dielectric optical filter |
US7544392B2 (en) | 2003-06-26 | 2009-06-09 | Nikon Corporation | Method for producing multilayer optical device |
CN101915951A (en) * | 2010-07-27 | 2010-12-15 | 平湖中天合波通信科技有限公司 | Method for manufacturing non-substrate optical filter |
-
1989
- 1989-12-26 JP JP33514589A patent/JPH03196001A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH047505A (en) * | 1990-04-25 | 1992-01-10 | Copal Co Ltd | Production of optical multilayered-film filter element |
EP1262803A1 (en) * | 2001-05-21 | 2002-12-04 | JDS Uniphase Inc. | Stress free thermally stabilized dielectric optical filter |
US7544392B2 (en) | 2003-06-26 | 2009-06-09 | Nikon Corporation | Method for producing multilayer optical device |
CN101915951A (en) * | 2010-07-27 | 2010-12-15 | 平湖中天合波通信科技有限公司 | Method for manufacturing non-substrate optical filter |
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