JPH03193317A - Manufacture of laminated sheet - Google Patents

Manufacture of laminated sheet

Info

Publication number
JPH03193317A
JPH03193317A JP33119589A JP33119589A JPH03193317A JP H03193317 A JPH03193317 A JP H03193317A JP 33119589 A JP33119589 A JP 33119589A JP 33119589 A JP33119589 A JP 33119589A JP H03193317 A JPH03193317 A JP H03193317A
Authority
JP
Japan
Prior art keywords
mirror plate
prepreg
larger
size
cushioning material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33119589A
Other languages
Japanese (ja)
Inventor
Kunio Iketani
池谷 国夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP33119589A priority Critical patent/JPH03193317A/en
Publication of JPH03193317A publication Critical patent/JPH03193317A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To realize a certain fixed sheet thickness distribution and prevent door heat resistance and inferior surface roughness from developing by a method wherein the size of cushioning material, which is to be arranged between hot plate and mirror plate, is made to be equal to or smaller than the size of the mirror plate and, at the same time, larger than the size of the end product of laminated sheet and, in addition, the size of prepreg is made to be larger than that of the mirror plate and larger than that of the cushioning material by 5mm or more. CONSTITUTION:The size of cushioning material 12, which is to be arranged between hot platen 1 and mirror plate 13, is made to be smaller (preferably by 5 - 15mm) than or equal to the size of the mirror plate 13 and, at the same time, larger than the size of laminated sheet in the form of end product, which is obtained by cutting off ends after forming. Further, the sizes of prepreg 14 and of copper foil 15, which is placed on the prepreg 14, when necessary, are made to be larger than that of the mirror plate 15 and larger than that of the cushioning material 12 by extending each end of the prepreg and the copper foil by 5mm or more beyond each side of the mirror plate. At forming, the pressing force applied to the prepreg does not abruptly become zero at the position changing from the end of the mirror plate to its outside and decreases gradually at a certain falling rate. Accordingly, the efflux of resin in the prepregs is small and no thinning of the sheet thickness at the end of the prepreg occurs, resulting in developing almost no lowering of characteristics.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、板厚精度の良好な印刷回路用積層板の製造方
法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for manufacturing a printed circuit laminate with good thickness accuracy.

〈従来の技術〉 従来、印刷回路用積層板の板厚精度を改良するためには
プリプレグの樹脂流れ特性を低くすることによるか、あ
るいは得られる最終製品の大きさよりかなり大きめの原
材料・資材を使用する方法によっていたが、これらの方
法では、処方が限定されたり、原料の無駄の発生が多い
といったような欠点があった。
<Prior art> Conventionally, the thickness accuracy of printed circuit laminates has been improved by lowering the resin flow characteristics of the prepreg, or by using raw materials that are considerably larger than the size of the final product. However, these methods have drawbacks such as limited formulations and frequent waste of raw materials.

〈発明が解決しようとする課題〉 本発明者は、積層板の板厚精度を向上させるべく、種々
検討した結果、クッション材、鏡面板及びプリプレグの
大きさの関係が板厚精度に影響していることを見出し、
本発明を完成するに至った。
<Problems to be Solved by the Invention> As a result of various studies in order to improve the thickness accuracy of laminates, the inventor found that the relationship between the sizes of the cushioning material, mirror plate, and prepreg affects the thickness accuracy. I found out that there is
The present invention has now been completed.

本発明の目的とするところは、細線回路等のファインパ
ターンに必要な板厚分布が一定で、かつ樹脂分の低い部
分による耐熱不良や表面粗さの悪いものが発生しない積
層板を提供するにある。
An object of the present invention is to provide a laminate that has a constant thickness distribution necessary for fine patterns such as thin wire circuits, and that does not suffer from poor heat resistance or poor surface roughness due to areas with low resin content. be.

〈課題を解決するための手段〉 本発明は、樹脂ワニスを含浸して得たプリプレグを1枚
もしくは複数枚重ね合わせ、これを金属鏡面板の間に挟
み加熱加圧成形する積層板の製造方法において、熱板と
鏡面板の間に配置されるクッション材は鏡面板と同等な
いしそれより小さく、かつ最終積層板製品の大きさより
は大きく、更にプリプレグは鏡面板よりも大きく、クッ
ション材より5m以上大きいことを特徴とする積層板の
製造方法である。
<Means for Solving the Problems> The present invention provides a method for manufacturing a laminate in which one or more prepregs impregnated with a resin varnish are stacked, sandwiched between metal mirror plates, and then heated and pressure-molded. The cushioning material placed between the hot plate and the mirrored plate is equal to or smaller than the mirrored plate, and larger than the final laminate product, and the prepreg is larger than the mirrored plate and at least 5 m larger than the cushioning material. This is a method for manufacturing a laminate.

本発明を図面を用いて説明する。第1図は従来法の構成
及び積層成形状態を示し、第2図は本発明の場合を示す
The present invention will be explained using the drawings. FIG. 1 shows the configuration and laminated molding state of the conventional method, and FIG. 2 shows the case of the present invention.

第1図(a)において、クッション材(2)は鏡面板(
3)と大略同じ大きさであり、プリプレグ(4)の大き
さは鏡面板(3)と大略同じ大きさである。銅箔(5)
が載置される場合は通常プリプレグ(4)より大きくす
る。
In Fig. 1(a), the cushion material (2) is a mirror plate (
3), and the prepreg (4) has approximately the same size as the mirror plate (3). Copper foil (5)
When the prepreg (4) is placed, it is usually larger than the prepreg (4).

! この場合、上下から加熱加圧されると第妾図(b)のよ
うに、プリプレグ(4)の樹脂が溶融してその端部から
外へ流れだす、加圧力は鏡面板の端部では所定圧力であ
り、その外側では急激に零になるので、この樹脂の流出
は、かなりの量となり、その結果得られる積層板の端部
は、厚さが薄くなり、圧力が十分にかからないため種々
の特性の低下をきたすこととなる。従って、その部分は
切断して取り除く必要があり、使用可能な部分は小さく
なってしまう。
! In this case, when heated and pressurized from above and below, the resin of the prepreg (4) melts and flows out from its ends, as shown in Figure (b). As the pressure drops sharply to zero on the outside, the outflow of this resin is considerable, and the resulting laminate edges are thinner and have various effects due to insufficient pressure. This will result in deterioration of characteristics. Therefore, it is necessary to cut and remove that part, and the usable part becomes smaller.

本発明はこのような欠点をなくするための方法である。The present invention is a method to eliminate these drawbacks.

第2図(a)において、熱盤(1)と鏡面板03)の間
にクッション材021は鏡面板0湯の大きさより小さい
か同じ大きさであり、かつ成形後端部を切断して最終製
品とされた積層板の大きさより大きい形状であり、更に
、プリプレグa4及び必要により載置されるw4箔00
は鏡面板Cつよりも大きく、クッション材021より各
端面で各辺5m以上大きくする。銅箔051は通常プリ
プレグ(ロ)より大きくする。
In FIG. 2(a), the cushioning material 021 is placed between the heating plate (1) and the mirror plate 03), and the size of the cushion material 021 is smaller than or the same as that of the mirror plate 0, and the rear end of the molding is cut to make the final product. It has a shape larger than the size of the laminate made into a product, and furthermore, prepreg A4 and W4 foil 00 placed on it if necessary.
is larger than the mirror plate C, and larger than the cushion material 021 by 5 m or more on each side at each end surface. The copper foil 051 is usually made larger than the prepreg (b).

本発明において、成形の際、クッション材が鏡面板の大
きさより小さいか同じであり、プリプレグの大きさより
小さいので、プリプレグにかかる加圧力は、鏡面板の端
部からその外側へ、急激に零になることはなく、ある勾
配をもって減少する。
In the present invention, during molding, since the cushioning material is smaller than or equal to the size of the mirror plate and smaller than the size of the prepreg, the pressure applied to the prepreg suddenly decreases to zero from the end of the mirror plate to the outside. It never decreases, but decreases with a certain slope.

特にクッション材が鏡面板より小さい(好ましくは各辺
で5〜15■)場合、この加圧力の減少勾配はゆるやか
である。
Particularly when the cushioning material is smaller than the mirror plate (preferably 5 to 15 cm on each side), the decreasing gradient of this pressing force is gradual.

従って、・プリプレグ中の樹脂の流出が小さく、プリプ
レグ端部の板厚も薄くならず、特性の低下も殆どない。
Therefore, the outflow of the resin in the prepreg is small, the plate thickness at the end of the prepreg does not become thinner, and there is almost no deterioration in properties.

〈実施例〉 以下、実施例及び比較例により本発明を説明する。クッ
ション材、鏡面板、銅箔及びエポキシ樹脂含浸ガラスク
ロスプリプレグを使用し、その大きさを第1表に示した
。熱盤間に4組の銅張積層板を成形すべくこれらの素材
をセットし、熱盤温度180℃、50kg/cj、90
分間加熱加圧成形して、厚さ1.2腫の両面銅張積層板
を得た。クッション材の厚さは形成後3■となるように
した。
<Examples> The present invention will be described below with reference to Examples and Comparative Examples. Cushioning material, mirror plate, copper foil, and epoxy resin-impregnated glass cloth prepreg were used, and their sizes are shown in Table 1. These materials were set between the hot plates to form four sets of copper-clad laminates, and the hot plate temperature was 180°C, 50 kg/cj, 90
A double-sided copper-clad laminate with a thickness of 1.2 mm was obtained by heating and press molding for 1 minute. The thickness of the cushion material was set to 3 mm after being formed.

得られた積層板を510m角の正方形に切出し、第2表
に示す特性を得た。
The obtained laminate was cut into a 510 m square, and the properties shown in Table 2 were obtained.

(測定方法) 板厚精度:積層板に一本の中心線を引き、両端部から各
10謡内部の点の間を8等分し、得られた9つの等分点
の板厚を測定し、次式で求めた。
(Measurement method) Plate thickness accuracy: Draw a center line on the laminate, divide it into 8 equal parts between each of the 10 points from both ends, and measure the plate thickness at the resulting 9 equally divided points. , was calculated using the following formula.

発明の場合における積層成形を示す概略断面図であり、
(a)は素材の構成を示し、(ロ)は成形状態を示す。
It is a schematic cross-sectional view showing lamination molding in the case of the invention,
(a) shows the structure of the material, and (b) shows the molded state.

表面平滑性:上記9点付近において、表面粗さ計にて測
定し、最大値を求めた。
Surface smoothness: Measured using a surface roughness meter near the above 9 points, and the maximum value was determined.

成形性:積層板の端部付近の外観により、成形性の良否
を判定した。
Formability: The quality of formability was determined based on the appearance near the end of the laminate.

○:良好、Δニガラスクロスの浮出しがみられる。○: Good, embossed Δ Nigarasu cloth is observed.

×ニガラスクロスの浮出しが大きい。×The embossed Nigarasu cloth is large.

〈発明の効果〉 本発明の方法に従うと、積層板の板厚精度が良好である
上に、端部まで成形可能範囲を広くすることができる0
表面平滑性もすぐれているのでファインパターンの作成
に好適な積層板を得るための優れた方法である。
<Effects of the Invention> According to the method of the present invention, not only the thickness accuracy of the laminate is good, but also the moldable range up to the edges can be widened.
Since the surface smoothness is also excellent, it is an excellent method for obtaining a laminate suitable for creating fine patterns.

Claims (1)

【特許請求の範囲】[Claims] (1)樹脂ワニスを含浸して得たプリプレグを1枚もし
くは複数枚重ね合わせ、これを金属鏡面板の間に挟み加
熱加圧成形する積層板の製造方法において、熱板と鏡面
板の間に配置されるクッション材は鏡面板と同等ないし
それより小さく、かつ最終積層板製品の大きさよりは大
きく、更にプリプレグは鏡面板よりも大きく、クッショ
ン材より5mm以上大きいことを特徴とする積層板の製
造方法。
(1) A cushion placed between a hot plate and a mirror plate in a laminate production method in which one or more prepregs impregnated with resin varnish are stacked, sandwiched between metal mirror plates, and then heated and pressed. A method for manufacturing a laminate, characterized in that the material is equal to or smaller than the mirror plate and larger than the final laminate product, and the prepreg is larger than the mirror plate and 5 mm or more larger than the cushion material.
JP33119589A 1989-12-22 1989-12-22 Manufacture of laminated sheet Pending JPH03193317A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33119589A JPH03193317A (en) 1989-12-22 1989-12-22 Manufacture of laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33119589A JPH03193317A (en) 1989-12-22 1989-12-22 Manufacture of laminated sheet

Publications (1)

Publication Number Publication Date
JPH03193317A true JPH03193317A (en) 1991-08-23

Family

ID=18240953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33119589A Pending JPH03193317A (en) 1989-12-22 1989-12-22 Manufacture of laminated sheet

Country Status (1)

Country Link
JP (1) JPH03193317A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100847632B1 (en) * 2005-04-26 2008-07-21 티디케이가부시기가이샤 Method of manufacturing laminated substrate
CN101772267A (en) * 2008-12-30 2010-07-07 深圳玛斯兰电路科技实业发展有限公司 Improvement method for wrinkled copper foil in compacting process of high-rise plates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100847632B1 (en) * 2005-04-26 2008-07-21 티디케이가부시기가이샤 Method of manufacturing laminated substrate
US7563342B2 (en) 2005-04-26 2009-07-21 Tdk Corporation Method of manufacturing laminated substrate
CN101772267A (en) * 2008-12-30 2010-07-07 深圳玛斯兰电路科技实业发展有限公司 Improvement method for wrinkled copper foil in compacting process of high-rise plates

Similar Documents

Publication Publication Date Title
JPH03193317A (en) Manufacture of laminated sheet
JP2001246635A5 (en)
CN207939841U (en) A kind of laminated mould of aluminum-based copper-clad plate
JPH0343061B2 (en)
JP3611506B2 (en) Laminate manufacturing method
JPH03236918A (en) Manufacture of laminated sheet
JP2003211602A (en) Release multilayered film and cover-lay molding method
JPH05124155A (en) Shaping sheet and continuous production of decorative panel using the same
JPH03112656A (en) Manufacture of one side copper-spread laminated board and manufacture of one side printed-wiring board employing laminated board thereof
JPH05147054A (en) Cushioning material for press and production thereof
JPH06218730A (en) Prepreg and production of laminate made of this prepreg
JPS61143122A (en) Manufacture of laminated sheet
JP4715017B2 (en) Multilayer laminate manufacturing method
JPH0760772A (en) Manufacture of laminated sheet for multilayer printed wiring board
JPH04263911A (en) Manufacture of laminated board
JPH03126547A (en) Manufacture of laminated board
JP3095288B2 (en) Manufacturing method of laminated board
JPS6025714A (en) Manufacture of laminate
JP2500398B2 (en) Metal foil-clad laminate and method for manufacturing the same
JPH1128733A (en) Carrier plate for manufacturing laminate
JPH0478466B2 (en)
JPH0557751B2 (en)
JPH04201311A (en) Manufacture of laminated sheet
JPH08142265A (en) Mirror surface panel for producing copper clad laminated sheet and production of copper clad laminated sheet
JPH0259337A (en) Manufacture of thin copper foil plated circuit substrate