JPH03178200A - Method for mounting parts of electronic parts mounting device - Google Patents
Method for mounting parts of electronic parts mounting deviceInfo
- Publication number
- JPH03178200A JPH03178200A JP1317002A JP31700289A JPH03178200A JP H03178200 A JPH03178200 A JP H03178200A JP 1317002 A JP1317002 A JP 1317002A JP 31700289 A JP31700289 A JP 31700289A JP H03178200 A JPH03178200 A JP H03178200A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- electronic component
- component
- electronic
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 14
- 230000002265 prevention Effects 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 7
- 230000005764 inhibitory process Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 208000037805 labour Diseases 0.000 abstract 2
- 230000037430 deletion Effects 0.000 abstract 1
- 238000012217 deletion Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 238000000605 extraction Methods 0.000 description 2
- RRLHMJHRFMHVNM-BQVXCWBNSA-N [(2s,3r,6r)-6-[5-[5-hydroxy-3-(4-hydroxyphenyl)-4-oxochromen-7-yl]oxypentoxy]-2-methyl-3,6-dihydro-2h-pyran-3-yl] acetate Chemical compound C1=C[C@@H](OC(C)=O)[C@H](C)O[C@H]1OCCCCCOC1=CC(O)=C2C(=O)C(C=3C=CC(O)=CC=3)=COC2=C1 RRLHMJHRFMHVNM-BQVXCWBNSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、電子部品装着装置において、特定の電子部品
を除外して縮少運転する際に効果的な電子部品装着方法
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an electronic component mounting method that is effective in performing reduced operation by excluding specific electronic components in an electronic component mounting apparatus.
[従来の技術]
部品供給テーブル上に、夫々異なる種類の電子部品を収
容した複数の電子部品フィーダ(但し一つの電子部品フ
ィーダには一種類の電子部品が収容されている)を並置
し1部品供給テーブルを移動させて所定の電子部品フィ
ーダを部品取出位置に逐次持ち来たし、この部品取出位
置に持ち来たされた電子部品フィーダから電子部品移載
装置の吸着ノズルで電子部品を取り出し、この取出され
た電子部品を、XY移動テーブルで位置決めされる回路
基板(以下、単に基板という)上の所定位置に装着する
様にした電子部品装着装置は公知である。この様な電子
部品装着装置における上記の動作は電子部品装着プログ
ラムに従って制御装置で制御される。[Prior Art] A plurality of electronic component feeders each housing a different type of electronic component (however, one type of electronic component is stored in one electronic component feeder) are arranged side by side on a component supply table to supply one component. The supply table is moved to sequentially bring the predetermined electronic component feeders to the component extraction position, and the electronic components are taken out from the electronic component feeders brought to the component extraction position using the suction nozzle of the electronic component transfer device. An electronic component mounting apparatus is known in which electronic components are mounted at predetermined positions on a circuit board (hereinafter simply referred to as a board) positioned by an XY moving table. The above operations in such an electronic component mounting apparatus are controlled by a control device according to an electronic component mounting program.
従来の電子部品装着装置で使用する電子部品装着プログ
ラムは、電子部品を取り出すべき部品供給テーブル上の
特定の電子部品フィーダを指定するデータと、取り出し
た電子部品を被装着物である基板上のどの位置に装着す
るかを指示するデータを基本とする一群のデータ(以下
、これらのデータをステップデータという)を複数並べ
たものであり、1つのステップデータは1個の電子部品
に対応している。この電子部品装着プログラムに従って
基板上に電子部品装着が行われるので、電子部品装着プ
ログラム内のステップデータ数と基板上の電子部品点数
は一致している。The electronic component placement program used in conventional electronic component placement equipment requires data that specifies a specific electronic component feeder on the component supply table from which the electronic component is to be taken out, and where on the board that is the object to be placed the electronic component that has been taken out. It is a set of multiple data (hereinafter referred to as step data) that is basically data that instructs where to attach the electronic component, and one step data corresponds to one electronic component. . Since electronic components are mounted on the board according to this electronic component mounting program, the number of step data in the electronic component mounting program matches the number of electronic components on the board.
一方、最近では、特開昭61−76231号公報に記載
のように、−本の部品装着プログラムの各ステップデー
タにそれを実行するか否かを指示するデータを付加する
ことによって、同一パターンを有する基板に順次異なる
実装パターンで部品装着を行っていく部品装着方法も考
案されている。この場合は、必ずしも1部品装着プログ
ラム内のステップデータ数と基板上の電子部品点数は一
致していない。On the other hand, recently, as described in Japanese Unexamined Patent Publication No. 61-76231, the same pattern can be created by adding data to each step data of the component mounting program in the book to instruct whether or not to execute it. A component mounting method has also been devised in which components are sequentially mounted on a board having different mounting patterns. In this case, the number of step data in one component mounting program does not necessarily match the number of electronic components on the board.
[発明が解決しようとする課題]
ところで、前記の如き電子部品装着装置において、特定
の電子部品フィーダからの電子部品については、これを
基板上に装着せず(これを装着抑止という)、その他の
電子部品フィーダからの電子部品のみを基板上に装着す
ることが望まれる場合がある。この様な場の例としては
、例えば、特定の電子部品の在庫切れ等によって、本来
装着すべき電子部品が全て揃っていなくても、揃ってい
る電子部品だけで装着を行い、このようにして作った基
板に、後に、未装着の電子部品を装着して完全な基板に
仕上げる場合などが挙げられる。[Problems to be Solved by the Invention] By the way, in the above-mentioned electronic component mounting apparatus, electronic components from a specific electronic component feeder are not mounted on the board (this is called mounting prevention), and other electronic components are not mounted on the board. It may be desirable to mount only electronic components from an electronic component feeder onto a board. An example of such a situation is, for example, even if all the electronic parts that should be installed are not available due to a particular electronic component being out of stock, the installation is performed using only the electronic parts that are available. An example of this is when a completed board is later attached with unattached electronic components to create a complete board.
しかるに、前記従来技術では、このように、特定の電子
部品フィーダからの電子部品の装着を抑止しながら、そ
の他の電子部品フィーダからの電子部品のみを基板上に
装着して、効果的に基板生産を繰返し行うことについて
考慮されておらず。However, in the above-mentioned conventional technology, in this way, mounting of electronic components from a specific electronic component feeder is suppressed, and only electronic components from other electronic component feeders are mounted on the board, thereby effectively achieving board production. No consideration was given to repeating the process.
このような基板生産を行う場合には5部品装着プログラ
ム自体を変更することが必要であった。即ち、電子部品
装着プログラム内のステップデータのうち、装着抑止し
たい電子部品の電子部品フィーダを指定しているステッ
プデータを全て削除することが必要であり、装置利用者
の多大な労力を必要するという問題があった。When producing such boards, it was necessary to change the five-component mounting program itself. In other words, it is necessary to delete all the step data in the electronic component mounting program that specifies the electronic component feeder of the electronic component to be suppressed, which requires a great deal of effort from the device user. There was a problem.
本発明は、部品装着プログラムを変更することなしに、
特定の電子部品フィーダからの電子部品を装着抑止して
基板生産できるようにし、装置利用者の労力を低減する
ことを目的としている。The present invention enables
The purpose of this system is to suppress the mounting of electronic components from a specific electronic component feeder so that circuit boards can be produced, thereby reducing the labor of the device user.
[B題を解決するための手段]
本発明は、上記目的の達成のため、特許請求の範囲に記
載した電子部品装着装置の部品装着方法を提供する。[Means for Solving Problem B] In order to achieve the above object, the present invention provides a component mounting method for an electronic component mounting apparatus as set forth in the claims.
[作 用]
制御手段は、装着抑止部品データによって指示された電
子部品を認識し、部品装着プログラム内のステップデー
タにそれと同一の電子部品(つまり電子部品フィーダ)
が指定されていれば、当該ステップデータに対応する電
子部品の装着を抑止するように働く。[Operation] The control means recognizes the electronic component specified by the installation prevention component data, and adds the same electronic component (that is, electronic component feeder) to the step data in the component installation program.
If specified, it works to inhibit the mounting of the electronic component corresponding to the step data.
それによって、部品装着プログラムを変更することなし
に、特定の電子部品フィーダからの電子部品の装着を抑
止したまま、基板生産することができる。Thereby, it is possible to produce boards while suppressing the mounting of electronic components from a specific electronic component feeder without changing the component mounting program.
[実 施 例] 以下、本発明の一実施例を図面に基づいて説明する。[Example] Hereinafter, one embodiment of the present invention will be described based on the drawings.
第6図は1本発明の電子部品装着方法の適用される電子
部品装着装置の一例の斜視図である。lは電子部品フィ
ーダ2を複数搭載し得る部品供給テーブル、3は吸着ノ
ズルを備え電子部品フィーダ2より電子部品を取り出し
、XY移動テーブル4上に置かれた基板5上に電子部品
を装着するための電子部品移載装置である。また、6は
制御部を収納した架台、7は操作盤である。FIG. 6 is a perspective view of an example of an electronic component mounting apparatus to which the electronic component mounting method of the present invention is applied. 1 is a component supply table on which a plurality of electronic component feeders 2 can be mounted; 3 is a suction nozzle for taking out electronic components from the electronic component feeder 2 and mounting the electronic components onto a substrate 5 placed on an XY moving table 4; This is an electronic component transfer device. Further, 6 is a pedestal housing a control unit, and 7 is an operation panel.
第1図、第2図、第3図は、本発明の電子部品装着方法
の説明図である。第1図は電子部品装着プログラムであ
り、電子部品を基板上のどの位置に装置するかを指示す
るX座標・Y座標データと、取り出す電子部品を電子部
品フィーダ番号で指示する部品データとより各々なる複
数のステップデータで構成されている。第2図は、装着
抑止したい電子部品のテーブルであり、装着抑止したい
電子部品を電子部品フィーダ番号で最大4種類まで登録
出来るようになっている。第3図は、制御プログラムの
フローチャートであり、基板−枚に電子部品を装着する
手順を示している。以下1本フローチャートを用いて本
例の動作を説明する。FIG. 1, FIG. 2, and FIG. 3 are explanatory diagrams of the electronic component mounting method of the present invention. Figure 1 shows an electronic component mounting program, which includes X-coordinate and Y-coordinate data that instructs where to place the electronic component on the board, and component data that instructs the electronic component to be taken out using the electronic component feeder number. It consists of multiple step data. FIG. 2 is a table of electronic components to be prevented from being mounted, and up to four types of electronic components to be prevented from being mounted can be registered by electronic component feeder number. FIG. 3 is a flowchart of the control program, showing the procedure for mounting electronic components on a board. The operation of this example will be explained below using one flowchart.
先ず、電子部品装着プログラムのステップ番号nを1に
設定する(第3図の■)0次に、ステップ番号nの部品
データPnと同じ値が装着抑止テーブルA1〜A、に登
録されているかどうかチエツクしく第3図の■〜■)、
同じ値が1つでもあれば■へ進み、同じ値が1つもない
場合に限り、ステップ番号nのステップデータで部品装
着を行う(第3図の■〜■)、なお、ステップnのステ
ップデータによる部品装着の実行(第3図■)は。First, step number n of the electronic component mounting program is set to 1 (■ in Fig. 3). Next, check whether the same value as the component data Pn of step number n is registered in the mounting inhibition tables A1 to A. Please check (■~■) in Figure 3.
If there is even one same value, proceed to ■, and only if there is no same value, parts are mounted using the step data of step number n (■ to ■ in Figure 3). Execution of parts mounting (Fig. 3 ■).
従来と同じ動作実行用の制御プログラムで行われるもの
である。This is performed using the same control program as the conventional one.
次にステップ番号nを更新しく第3図の■)。Next, update the step number n (■ in Figure 3).
ステップ番号nがステップデータ数mを超えていなけれ
ば■へ戻り、前述の処理を繰返し、nをmを超えていれ
ば処理を終了する(第3図の■)。If the step number n does not exceed the step data number m, the process returns to (2) and the above-described process is repeated, and if n exceeds m, the process ends (■ in FIG. 3).
このような本発明の部品装着方法を用いて電子部品装着
を行う具体例について第4図〜第7図を用いて以下説明
する。A specific example of mounting electronic components using the component mounting method of the present invention will be described below with reference to FIGS. 4 to 7.
第4図は電子部品装着プログラムの一例であり。FIG. 4 shows an example of an electronic component mounting program.
本来、第5図の如くに基板5に部品12部品2゜部品3
9部品4という4種類の電子部品を装着する目的で作成
されたものであり、この第4図の電子部品装着プログラ
ムは従来の通常の電子部品装着プログラムと同じである
。Originally, parts 12, parts 2, and parts 3 were placed on the board 5 as shown in Figure 5.
It was created for the purpose of mounting four types of electronic components, 9 parts 4, and the electronic component mounting program shown in FIG. 4 is the same as a conventional conventional electronic component mounting program.
次に、第5図と同様の基板5に、何らかの要因によって
、例えば、電子部品フィーダ番号2と4の電子部品(即
ち部品2と部品4)を除いて、その他の電子部品フィー
ダ1と3の電子部品(即ち部品lと部品3)を装着する
必要が生じたとすると、第6図の如くに装着抑止部品テ
ーブルに2と4を登録する。そうすれば、前述したよう
に、第4図と同一の電子部品装着プログラムを用いて、
しかも、第7図の如く電子部品フィーダ番号2と4の電
子部品(部品2と部品4)を除いて電子部品フィーダ1
と3の電子部品(部品1と部品3)を基板に装着するこ
とができる。Next, for some reason, for example, except for the electronic components of electronic component feeder numbers 2 and 4 (i.e., components 2 and 4), other electronic component feeders 1 and 3 are placed on the same board 5 as shown in FIG. If it becomes necessary to mount electronic components (ie, components 1 and 3), 2 and 4 are registered in the mounting prevention component table as shown in FIG. Then, as mentioned above, using the same electronic component mounting program as shown in Fig. 4,
Moreover, as shown in FIG. 7, electronic component feeder 1 is
and 3 electronic components (component 1 and component 3) can be mounted on the board.
第9図は上記の制御を行う制御部6のブロック図の一部
であり、装着抑止部品テーブルは電子部品装着プログラ
ムと同様にRAM5中に記憶させる。さらに、操作盤7
のキーボード9を通して、装着抑止部品テーブルへの番
号登録および削除を行えるように構成する。RAM8に
記憶されたこれらデータに基づき、CPU10はROM
II中の制御プログラムによって前記第3図の様に制御
動作を行わせる。FIG. 9 is a part of a block diagram of the control unit 6 that performs the above control, and the mounting prevention component table is stored in the RAM 5 similarly to the electronic component mounting program. Furthermore, the operation panel 7
The configuration is such that numbers can be registered and deleted from the mounting prevention parts table through the keyboard 9. Based on these data stored in the RAM 8, the CPU 10
The control program in II causes control operations to be performed as shown in FIG.
[発明の効果]
本発明によれば、電子部品装着プログラムを変更するこ
となしに、装着抑止部品テーブルを追加するだけで、該
装着抑止部品テーブルに登録された特定の電子部品フィ
ーダからの電子部品を除外して部品装着したり、さらに
−魔除外したものを再度復帰したりすることが容易に出
来るので、従来のように、部品装着プログラム自体を変
更していた場合に比べ、電子部品装着装置利用者の労力
を大幅に低減することができる。[Effects of the Invention] According to the present invention, by simply adding a mounting prevention component table without changing the electronic component mounting program, electronic components from a specific electronic component feeder registered in the mounting prevention component table can be added. Since it is easy to exclude parts and mount parts, and furthermore, to restore those that have been excluded, electronic component mounting equipment The user's effort can be significantly reduced.
第1図は部品装着プログラムを示す図、第2図は装着抑
止部品テーブルを示す図、第3図は装着抑止部品テーブ
ルで指定した部品の装着抑止をしながら他の部品を装着
するフローチャート、第4図は部品装着プログラムの具
体例を示す図、第5図は第4図の部品装着プログラムを
用いて部品装着をした場合の装着状態を示す図、第6図
は装着抑止テーブルの具体例を示す図、第7図は第4図
の部品装着プログラムと第6図の装着抑止部品テーブル
を用いて部品装着した場合の装着状態を示す図、第8図
は本発明の部品装着方法を適用できる電子部品装着装置
の一例の斜視図、第9図は制御部のブロック図の一部を
示す図である。
1・・・部品供給テーブル
2・・・電子部品フィーダ 3・・・電子部品移載装
置4・・・XYテーブル 5・・・基板6・・・
制御部を収納した架台
7・・・操作部 8・・・RAM9・・・
キーボード 10・・・CPU11・・・RO
M
12・・・キーボードコントローラ
13・・・データバス
(化1名)
第
図
第
図
第
図
第
図
第
図
第
6
図
第
図
第
図
第
図Figure 1 is a diagram showing the component installation program, Figure 2 is a diagram showing the installation prevention parts table, Figure 3 is a flowchart for installing other parts while suppressing the installation of parts specified in the installation prevention parts table, FIG. 4 shows a specific example of a component mounting program, FIG. 5 shows a mounting state when components are mounted using the component mounting program shown in FIG. 4, and FIG. 6 shows a specific example of a mounting suppression table. FIG. 7 is a diagram showing a mounting state when components are mounted using the component mounting program shown in FIG. 4 and the mounting prevention component table shown in FIG. 6, and FIG. FIG. 9, which is a perspective view of an example of an electronic component mounting apparatus, is a diagram showing a part of a block diagram of a control section. 1... Component supply table 2... Electronic component feeder 3... Electronic component transfer device 4... XY table 5... Board 6...
Frame 7 housing the control unit...Operation unit 8...RAM9...
Keyboard 10...CPU11...RO
M 12...Keyboard controller 13...Data bus (1 name)
Claims (1)
フィーダから成る部品供給部より電子部品移載装置にて
電子部品を順次取り出し、該電子部品を被装着物に装着
するように制御手段により制御される電子部品装着装置
の部品装着方法において、前記部品装着プログラムとは
別に、装着を抑止したい電子部品を指定する装着抑止部
品データを制御手段に入力記憶させ、該制御手段は前記
部品装着プログラム内のステップデータと上記装着抑止
部品データとを照合し、該装着抑止部品データで指定さ
れた電子部品と同じ電子部品が該ステップデータに指定
されているならば、その電子部品については電子部品フ
ィーダからの取出し及び被装着部品への装着動作を行わ
せないようにすることを特徴とする電子部品装着装置の
部品装着方法。1. Controlled by a control means to sequentially take out electronic components from a component supply section consisting of a plurality of electronic component feeders using an electronic component transfer device and mount the electronic components onto an object in accordance with the instructions of a component mounting program. In the component mounting method of the electronic component mounting apparatus, separately from the component mounting program, mounting inhibition component data specifying electronic components to be inhibited from being mounted is input and stored in a control means, and the control means executes steps in the component mounting program. The data is compared with the above installation prevention component data, and if the same electronic component as the electronic component specified in the installation prevention component data is specified in the step data, that electronic component is removed from the electronic component feeder. and a component mounting method for an electronic component mounting device, characterized in that the mounting operation is not performed on the component to be mounted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1317002A JP2647215B2 (en) | 1989-12-06 | 1989-12-06 | Component mounting method of electronic component mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1317002A JP2647215B2 (en) | 1989-12-06 | 1989-12-06 | Component mounting method of electronic component mounting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03178200A true JPH03178200A (en) | 1991-08-02 |
JP2647215B2 JP2647215B2 (en) | 1997-08-27 |
Family
ID=18083320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1317002A Expired - Lifetime JP2647215B2 (en) | 1989-12-06 | 1989-12-06 | Component mounting method of electronic component mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2647215B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5584118A (en) * | 1991-05-24 | 1996-12-17 | Fujitsu Limited | Production control with centralized physical distribution control between storage and production cells |
-
1989
- 1989-12-06 JP JP1317002A patent/JP2647215B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5584118A (en) * | 1991-05-24 | 1996-12-17 | Fujitsu Limited | Production control with centralized physical distribution control between storage and production cells |
Also Published As
Publication number | Publication date |
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JP2647215B2 (en) | 1997-08-27 |
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