JP3047597B2 - Component mounting method - Google Patents

Component mounting method

Info

Publication number
JP3047597B2
JP3047597B2 JP4040829A JP4082992A JP3047597B2 JP 3047597 B2 JP3047597 B2 JP 3047597B2 JP 4040829 A JP4040829 A JP 4040829A JP 4082992 A JP4082992 A JP 4082992A JP 3047597 B2 JP3047597 B2 JP 3047597B2
Authority
JP
Japan
Prior art keywords
mounting
component
point
components
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4040829A
Other languages
Japanese (ja)
Other versions
JPH05243790A (en
Inventor
博 岡村
正行 梶山
聡 野中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP4040829A priority Critical patent/JP3047597B2/en
Publication of JPH05243790A publication Critical patent/JPH05243790A/en
Application granted granted Critical
Publication of JP3047597B2 publication Critical patent/JP3047597B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、部品実装機のXYテー
ブルの上に載置された回路基板へ部品を実装する部品実
装方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method for mounting components on a circuit board mounted on an XY table of a component mounting machine.

【0002】[0002]

【従来の技術】近年、回路基板上に実装する部品の小型
化、回路基板上配線の高密度化および部品点数の増加と
いう状況の中で、XYテーブルおよび部品供給部の移動
時の時間損失が少ない効率的な実装手順を決定し、部品
装着時間を短縮することが求められている。
2. Description of the Related Art In recent years, in a situation where components mounted on a circuit board are downsized, wiring density on the circuit board is increased, and the number of components is increased, time loss when moving the XY table and the component supply unit is reduced. It is required to determine a less efficient mounting procedure and to shorten the component mounting time.

【0003】以下に従来の部品実装方法について説明す
る。図3は従来の部品実装方法を説明するための図であ
る。図3に示すように、部品供給部1は供給される部品
がパーツカセットz1〜z100内に一直線に配列されてお
り、矢印が示すように1次元方向にのみ自由度がある。
部品装着ヘッド2が部品を吸着できるように部品供給部
1を移動させ、部品装着ヘッド2は部品を吸着した後回
路基板4上へ移動して部品を実装する。この場合回路基
板4へ部品を実装するために必要な時間を短縮するため
には、部品供給部1およびXYテーブル3の移動を極力
小さくする必要がある。
Hereinafter, a conventional component mounting method will be described. FIG. 3 is a diagram for explaining a conventional component mounting method. As shown in FIG. 3, the component supply unit 1 component supplied are arranged in a straight line in the parts cassette z 1 to z 100, there is a degree of freedom only in a one-dimensional direction as indicated by the arrow.
The component supply unit 1 is moved so that the component mounting head 2 can pick up the component, and the component mounting head 2 picks up the component and then moves onto the circuit board 4 to mount the component. In this case, in order to reduce the time required for mounting the components on the circuit board 4, it is necessary to minimize the movement of the component supply unit 1 and the XY table 3.

【0004】図4は従来の部品実装方法における部品実
装順序を決定するフローチャートである。まず回路基板
4の上に最初の部品を実装する第1実装点を決めた後、
ステップ41(以下ステップをSTと略する)で部品供給部
1のパーツカセットおよびXYテーブル3が部品装着ヘ
ッド2が待ち状態にならない1サイクル内(以後タクト
内という)で移動できる範囲で回路基板4の上に次の実
装点が有るかどうかを判定し、有ればST42でその実装点
を第2実装点とし、もし無ければST43でパーツカセット
またはXYテーブル3の移動が最短である実装点が有れ
ばST44でそれを第2実装点とする。このような動作を未
実装の全実装点について検索しながら行い、順次実装点
を決定する。
FIG. 4 is a flowchart for determining a component mounting order in a conventional component mounting method. First, after determining the first mounting point for mounting the first component on the circuit board 4,
In step 41 (hereinafter, step is abbreviated as ST), the circuit board 4 is moved within a range in which the parts cassette and the XY table 3 of the parts supply unit 1 can move within one cycle (hereinafter referred to as tact) in which the parts mounting head 2 does not wait. It is determined whether or not there is a next mounting point above, and if so, the mounting point is set as the second mounting point in ST42, and if not, the mounting point in which movement of the parts cassette or the XY table 3 is the shortest is determined in ST43. If there is, it is set as a second mounting point in ST44. Such an operation is performed while searching for all the unmounted mounting points, and the mounting points are sequentially determined.

【0005】[0005]

【発明が解決しようとする課題】しかしながら上記の従
来の構成では、計算機のソフトにより部品実装順序を決
定しようとしてもかなりの処理時間を必要とし、今後回
路基板1枚あたりの実装部品点数が増加することを考え
るとますます不利になるという課題を有していた。
However, in the above-mentioned conventional configuration, a considerable processing time is required even if the component mounting order is determined by software of a computer, and the number of mounted components per circuit board will increase in the future. Given this, there was a problem that it became more and more disadvantageous.

【0006】本発明は上記の従来の課題を解決するもの
で、部品実装順序を最適化するための処理時間を短縮
し、実装機の効率を向上できる部品実装方法を提供する
ことを目的とする。
An object of the present invention is to solve the above-mentioned conventional problems and to provide a component mounting method capable of shortening a processing time for optimizing a component mounting order and improving the efficiency of a mounting machine. .

【0007】[0007]

【課題を解決するための手段】この目的を達成するため
に本発明の部品実装方法は、部品供給部の同一パーツカ
セット内の部品を連続して実装するかまたはタクト内に
部品供給部が移動できるパーツカセットの数の範囲内の
部品を連続して実装するかを決定するグルーピング工程
と、このグルーピング工程で決定されたグループ内でX
Yテーブルがタクト内に移動可能な次の実装点を順次決
定するソーティング工程と、これらのグルーピング工程
とソーティング工程により決定された手順に従って部品
を回路基板に装着する工程とを有する。
In order to achieve this object, a component mounting method according to the present invention is to mount components in the same part cassette of a component supply unit continuously or move the component supply unit within a tact. A grouping step for determining whether components within the range of the number of possible part cassettes are to be continuously mounted, and X in the group determined in the grouping step.
It has a sorting step of sequentially determining the next mounting point at which the Y table can move within the tact, and a step of mounting components on the circuit board according to the procedures determined by the grouping step and the sorting step.

【0008】[0008]

【作用】この構成によって、部品実装順序の決定の際に
次の実装点を検索する範囲は同一パーツカセットかまた
は多くてもタクト内で移動できるパーツカセットの数の
範囲に限られることになり、回路基板上での次の実装点
の検索時間が短縮でき、部品実装順序の決定のための処
理時間が格段に短縮でき、かつ効率のよい部品実装がで
きる。
With this configuration, the range for searching for the next mounting point when determining the component mounting order is limited to the range of the same part cassette or at most the number of part cassettes that can be moved within a tact. The search time for the next mounting point on the circuit board can be reduced, the processing time for determining the component mounting order can be significantly reduced, and efficient component mounting can be performed.

【0009】[0009]

【実施例】以下に本発明の一実施例について、図面を参
照しながら説明する。図1は本発明の一実施例における
部品実装方法を説明する図、図2は同部品実装方法にお
ける部品実装順序を決定するフローチャートである。ま
ず図1に沿って、部品実装方法の概略の動作について説
明する。部品供給部5はz1〜zn+3・・・・からなるパーツ
カセットを有している。本実施例は、タクト内にパーツ
カセット1個分のみ移動可能な実装機の例であり、2個
1組のグループ6に分けられている。したがって、部品
供給部5の移動は、(z1,z2)→(z3,z4)→・・・・→
(zn,zn+1)→(zn+2,zn+3)→・・・・のグループ順と
なる。また7はXYテーブル上に載置された回路基板、
8は第1実装点、9は第2実装点、10は第3実装点で
ある。
An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram for explaining a component mounting method according to an embodiment of the present invention, and FIG. 2 is a flowchart for determining a component mounting order in the component mounting method. First, the schematic operation of the component mounting method will be described with reference to FIG. The parts supply section 5 has a parts cassette composed of z 1 to z n + 3 . The present embodiment is an example of a mounting machine that can move only one part cassette within a tact, and is divided into a group 6 of two. Therefore, the movement of the component supply unit 5 is (z 1 , z 2 ) → (z 3 , z 4 ) →.
(Z n , z n + 1 ) → (z n + 2 , z n + 3 ) →... 7 is a circuit board mounted on an XY table,
8 is a first mounting point, 9 is a second mounting point, and 10 is a third mounting point.

【0010】以上のような関係において、図2に示すフ
ローチャートが実行される。まず第1ステップに示すよ
うに、ST11で第1実装点8(以下(a)点とする)を回
路基板7の上のXY原点の最近傍に設定し、そこに実装
する部品を部品供給部5のz1 に配置する。
With the above relationship, the flowchart shown in FIG. 2 is executed. First, as shown in the first step, in ST11, the first mounting point 8 (hereinafter referred to as point (a)) is set to be closest to the XY origin on the circuit board 7, and the components to be mounted there are placed in the component supply unit. 5 arranged in z 1 of.

【0011】第2ステップはzn,zn+1の部品グループ
で(a)点まで実装済みの状態で第2実装点9(以下
(b)点とする)を決定するためのアルゴリズムを示
す。ST21で(a)点からXYテーブルがタクト内に移動
可能なznまたはzn+1の部品の実装点があるかどうかを
判定してあればST22でそれを(b)点9とする。なけれ
ばST23で(a)点から最近傍のznまたはzn+1の部品の
実装点があるかどうかを判定し、あればST24でそれを
(b)点とする。それもなければzn,zn+1の部品グル
ープは全部実装済みなので、ST25で未配置の部品で
(a)点からタクト内に移動可能な点または最近傍点が
あるかどうかを判定し、あればST26でそれを(b)点と
してその部品をzn+2へ配置し、第3ステップへ進んで
次の実装点(c)(以下(c)点とする)の決定を行
う。またST25でなければ、ST27で(a)点最近傍の未配
置部品の実装点があるかどうかを判定し、あればST28で
それを(b)点としてその部品をzn+2へ配置し、第3
ステップへ進んで次の実装点(c)(以下(c)点とす
る)の決定を行う。またST27でなければ終了する。
The second step shows an algorithm for determining a second mounting point 9 (hereinafter referred to as a point (b)) in a state where the component group of z n and z n + 1 has been mounted up to the point (a). . If it is determined in ST21 whether or not there is a mounting point of a component of z n or z n + 1 that can move the XY table in the tact from the point (a), it is determined as a point (b) in ST22. If not, it is determined in ST23 whether or not there is a mounting point of the component of the nearest z n or z n + 1 from the point (a), and if it is, it is determined as a point (b) in ST24. Otherwise, since all the component groups of z n and z n + 1 have already been mounted, it is determined in ST25 whether or not there is a point that can be moved from the point (a) to the tact or the nearest point in the unplaced component. If there is, in ST26, the component is placed on z n + 2 using that as the point (b), and the process proceeds to the third step to determine the next mounting point (c) (hereinafter, point (c)). If it is not ST25, it is determined in ST27 whether or not there is a mounting point of the unplaced component closest to the point (a), and if so, in ST28, it is set as the point (b) and the part is placed in z n + 2 . , Third
Proceeding to the step, the next mounting point (c) (hereinafter referred to as point (c)) is determined. If not ST27, the process ends.

【0012】第3ステップは(c)点を決めるためのア
ルゴリズムを示す。ST31でzn+2の部品か未配置部品で
(b)点からタクト内に移動可能な点または最近傍点が
あるかどうかを判定し、あればST32でそれを(c)点と
し、第4ステップへ進んで次の実装点の決定を行う。ま
たなければ、ST27で(a)点最近傍の未配置部品の実装
点があるかどうかを判定し、あればST28で未配置部品を
n+3へ配置する。ST28でなければ、終了する。
The third step shows an algorithm for determining the point (c). In ST31, it is determined whether there is a point that can be moved from the point (b) in the tact or the nearest point in the part of z n + 2 or the unplaced part. Proceed to step to determine the next mounting point. In addition there, to determine whether there is (a) point recent implementation point beside unplaced parts in ST27, placing unplaced components to z n + 3 in ST28, if any. If not ST28, end.

【0013】同様にして、第4ステップでzn+2,zn+3
グループの部品の中で次の実装点を検索し、決定してゆ
く。このようにして最後の部品グループまで繰り返して
実装の順序を決定し、終了する。以上のようにして、決
定された部品の実装順序に従って実際の基板に部品が搭
載されていくことになる。
Similarly, in the fourth step, z n + 2 , z n + 3
The next mounting point is searched for and determined from the parts in the group. In this way, the order of mounting is repeatedly determined up to the last component group, and the process ends. As described above, the components are mounted on the actual board in accordance with the determined mounting order of the components.

【0014】[0014]

【発明の効果】以上のように本発明によれば、実装時間
は従来の実装順序決定による方法とほぼ同じであるが、
実装順序を決定する処理時間は500実装点についての
パソコン上でのシュミレーションによれば従来20分か
かっていたものが1分以内でできた。今後実装点数が増
大するにつれて一層その効果は増すものと考えられる。
As described above, according to the present invention, the mounting time is almost the same as the conventional method of determining the mounting order.
According to a simulation on a personal computer for 500 mounting points, the processing time for determining the mounting order can be reduced from less than 20 minutes to one minute in the past. The effect is expected to increase further as the number of mounting points increases in the future.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例における部品実装方法を説明
する図
FIG. 1 is a diagram illustrating a component mounting method according to an embodiment of the present invention.

【図2】同部品実装方法における部品実装順序を決定す
るフローチャート
FIG. 2 is a flowchart for determining a component mounting order in the component mounting method.

【図3】従来の部品実装方法を説明するための図FIG. 3 is a diagram for explaining a conventional component mounting method.

【図4】同部品実装方法における部品実装順序を決定す
るフローチャート
FIG. 4 is a flowchart for determining a component mounting order in the component mounting method.

【符号の説明】[Explanation of symbols]

5 部品供給部 6 パーツカセット 7 回路基板 5 Parts supply section 6 Parts cassette 7 Circuit board

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平4−8437(JP,A) 特開 昭62−203731(JP,A) 特開 平1−128500(JP,A) 特開 平1−283604(JP,A) 特開 平2−100840(JP,A) 特開 平4−171999(JP,A) 特開 平4−348830(JP,A) 特開 平5−104364(JP,A) (58)調査した分野(Int.Cl.7,DB名) H05K 13/02 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-8437 (JP, A) JP-A-62-203731 (JP, A) JP-A-1-128500 (JP, A) JP-A-1- 283604 (JP, A) JP-A-2-100840 (JP, A) JP-A-4-171999 (JP, A) JP-A-4-348830 (JP, A) JP-A-5-104364 (JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) H05K 13/02

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 部品供給部の同一パーツカセット内の部
品を連続して実装するかまたは部品装着ヘッドが待ち状
態にならない1サイクル内に部品供給部が移動できるパ
ーツカセットの数の範囲内の部品を連続して実装するか
を決定するグルーピング工程と、前記グルーピング工程
で決定されたグループ内でXYテーブルが前記1サイク
ル内に移動可能な次の実装点を順次決定するソーティン
グ工程と、前記グルーピング工程と前記ソーティング工
程により決定された順序に従って部品供給部から部品を
取り出し回路基板に装着する工程とを有する部品実装方
法。
1. A component within a range of the number of parts cassettes in which a component supply unit can be moved in one cycle in which components in the same part cassette of the component supply unit are continuously mounted or a component mounting head does not enter a wait state. And a sorting step for sequentially determining the next mounting point at which the XY table can move within the one cycle in the group determined in the grouping step, and the grouping step. And a step of taking out components from a component supply unit in accordance with the order determined by the sorting step and mounting the components on a circuit board.
JP4040829A 1992-02-27 1992-02-27 Component mounting method Expired - Fee Related JP3047597B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4040829A JP3047597B2 (en) 1992-02-27 1992-02-27 Component mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4040829A JP3047597B2 (en) 1992-02-27 1992-02-27 Component mounting method

Publications (2)

Publication Number Publication Date
JPH05243790A JPH05243790A (en) 1993-09-21
JP3047597B2 true JP3047597B2 (en) 2000-05-29

Family

ID=12591546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4040829A Expired - Fee Related JP3047597B2 (en) 1992-02-27 1992-02-27 Component mounting method

Country Status (1)

Country Link
JP (1) JP3047597B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2778725C (en) 2009-10-28 2019-04-30 Alentic Microscience Inc. Microscopy imaging
WO2014205576A1 (en) 2013-06-26 2014-12-31 Alentic Microscience Inc. Sample processing improvements for microscopy

Also Published As

Publication number Publication date
JPH05243790A (en) 1993-09-21

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