JPH03176972A - Terminal connection structure for flexible board - Google Patents
Terminal connection structure for flexible boardInfo
- Publication number
- JPH03176972A JPH03176972A JP1317052A JP31705289A JPH03176972A JP H03176972 A JPH03176972 A JP H03176972A JP 1317052 A JP1317052 A JP 1317052A JP 31705289 A JP31705289 A JP 31705289A JP H03176972 A JPH03176972 A JP H03176972A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- substrate
- patterns
- substrates
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000006850 spacer group Chemical group 0.000 claims abstract description 46
- 239000000853 adhesive Substances 0.000 claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims description 112
- 229920005992 thermoplastic resin Polymers 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000003973 paint Substances 0.000 abstract description 8
- 239000012943 hotmelt Substances 0.000 abstract description 6
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 abstract description 4
- 238000007650 screen-printing Methods 0.000 abstract description 4
- 238000002207 thermal evaporation Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 239000012528 membrane Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 2
- RRKGBEPNZRCDAP-UHFFFAOYSA-N [C].[Ag] Chemical compound [C].[Ag] RRKGBEPNZRCDAP-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003049 inorganic solvent Substances 0.000 description 1
- 229910001867 inorganic solvent Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、少なくとも一方をフレキシブル基板で構成し
た2枚の基板上のパターン間を接続するフレキシブル基
板の端子接続構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a terminal connection structure for flexible substrates that connects patterns on two substrates, at least one of which is made of a flexible substrate.
従来、可撓性のシート上に回路パターンを形戒したフレ
キシブル基板が実用化されている。2. Description of the Related Art Conventionally, flexible substrates in which a circuit pattern is formed on a flexible sheet have been put into practical use.
ところで、この種のフレキシブル基板上に形成した回路
パターンと、他のフレキシブル基板や硬質基板上に形成
した回路パターン間を接続する場合には、従来は内基板
の回路パターンの一部として形成された端子パターン同
士を機械的に圧接することによって行なっていた。By the way, when connecting a circuit pattern formed on this type of flexible substrate to a circuit pattern formed on another flexible substrate or a rigid substrate, conventionally, a circuit pattern formed on an inner substrate is formed as a part of the circuit pattern. This was done by mechanically pressing the terminal patterns together.
第10図はこの種の従来のフレキシブル基板の端子接続
構造を示す要部側断面図である。FIG. 10 is a sectional side view of a main part showing a terminal connection structure of a conventional flexible board of this type.
同図に示すようにこの従来例にあっては、上側ケース8
01と下側ケース803の間に、第1のフレキシブル基
板809と第2のフレキシブル基板805をスペーサ8
13を介在させて重ね合わせている。そして第1のフレ
キシブル基板809に設けた端子パターン811と第2
のフレキシブル基板805に設けた端子パターン807
とをスペーサ813に設けた六815を介して対向せし
めた後、端子パターン811を上側ケース801に取り
付けたゴム製の押圧部材817によって端子パターン8
07に押し付け、これによって両端−
子パターン807,811間を接続していた。As shown in the figure, in this conventional example, the upper case 8
A first flexible substrate 809 and a second flexible substrate 805 are placed between the spacer 801 and the lower case 803.
They are overlapped with 13 interposed therebetween. Then, the terminal pattern 811 provided on the first flexible substrate 809 and the second
Terminal pattern 807 provided on the flexible substrate 805 of
After the terminal pattern 811 is made to face each other via the six 815 provided on the spacer 813, the terminal pattern 811 is pressed against the terminal pattern 8 by a rubber pressing member 817 attached to the upper case 801.
07, thereby connecting the terminal patterns 807 and 811 at both ends.
しかしながらこのような従来のフレキシブル基板の端子
接続構造にあっては、両端子パターン807.811間
が機械的な接続であるため、その接続が確実でないばか
りか、その接続部分の抵抗値が大きくなり、またその接
続作業に手間がかかるという問題点があった。However, in such a conventional terminal connection structure of a flexible board, since the connection between both terminal patterns 807 and 811 is mechanical, not only is the connection not reliable, but the resistance value of the connection part becomes large. There was also the problem that the connection work was time-consuming.
またこのような従来のフレキシブル基板の端子接続構造
にあっては、スペーサ813や押圧部材817が必要で
あり、その部品点数が増加するという問題点もあった。Further, in such a conventional terminal connection structure for a flexible board, a spacer 813 and a pressing member 817 are required, and there is also a problem that the number of parts increases.
本発明は上述の点に鑑みてなされたものであり、端子パ
ターン間の接続が確実で、その接続作業も容易で、部品
点数も削減できる、構造の簡単なフレキシブル基板の端
子接続構造を提供することにある。The present invention has been made in view of the above-mentioned points, and provides a terminal connection structure for a flexible board with a simple structure, which ensures reliable connection between terminal patterns, facilitates the connection work, and reduces the number of parts. There is a particular thing.
上記問題点を解決するため本発明はフレキシブル基板の
端子接続構造を、可撓性シートからなる=4
第1基板1と、可撓性シート或いは硬質板からなる第2
基板2とを具備し、該内基板1,2のそれぞれに端子パ
ターン5,6を有する回路パターンを形成するとともに
該端子パターン5,6上に導電性接着剤7,7を塗布し
、内基板1.2の少なくとも端子パターン5,6の周囲
を囲む部分に熱可塑性の樹脂を塗布してスペーサM3,
4を形成し、両端子パターン5,6が対向するように内
基板を重ね合わせて両スペーサ層3,4を接触させて該
接触面を熱溶着するとともに、前記端子パターン5,6
間を導電性接着剤7で接続して構成した。In order to solve the above-mentioned problems, the present invention provides a terminal connection structure for a flexible substrate with a first substrate 1 made of a flexible sheet and a second substrate 1 made of a flexible sheet or a hard plate.
A circuit pattern having terminal patterns 5 and 6 is formed on each of the inner substrates 1 and 2, and conductive adhesives 7 and 7 are applied on the terminal patterns 5 and 6, and the inner substrate 1. Apply thermoplastic resin to at least the portion surrounding the terminal patterns 5 and 6 of 2 to form the spacer M3,
4, the inner substrates are stacked so that both terminal patterns 5, 6 face each other, both spacer layers 3, 4 are brought into contact, and the contact surfaces are thermally welded, and the terminal patterns 5, 6 are
A conductive adhesive 7 is used to connect between the two.
また本発明はフレキシブル基板の端子接続構造を、可撓
性シートからなる第1基板1と、金属板からなりその上
面に熱可塑性の樹脂を塗布して絶縁層92を形成した第
2基板9とを具備し、該内基板1,9のそれぞれに端子
パターン5,6を有する回路パターンを形成するととも
に該端子パターン5,6の内の少なくともいずれか一方
の端子パターン上に導電性接着剤7,7を塗布し、第1
基板1の少なくとも端子パターン5の周囲を囲む部分に
熱可塑性の樹脂を塗布してスペーサ層3を形成し、両端
子パターン5.6が対向するように内基板1,2を重ね
合わせてスペーサ層3と絶縁層92を接触させて該接触
面を熱溶着するとともに、前記対向する端子パターン5
,6間を導電性接着剤7で接続して構成した。Further, the present invention provides a terminal connection structure for a flexible board, which includes a first board 1 made of a flexible sheet, and a second board 9 made of a metal plate, on which an insulating layer 92 is formed by coating a thermoplastic resin on the top surface. A circuit pattern having terminal patterns 5 and 6 is formed on each of the inner substrates 1 and 9, and a conductive adhesive 7, is formed on at least one of the terminal patterns 5 and 6. 7 and apply the first
A spacer layer 3 is formed by coating at least a portion of the substrate 1 surrounding the terminal pattern 5 with a thermoplastic resin, and the inner substrates 1 and 2 are stacked so that both terminal patterns 5 and 6 face each other to form a spacer layer. 3 and the insulating layer 92 and thermally weld the contact surfaces, and the opposing terminal pattern 5
, 6 are connected with a conductive adhesive 7.
上記の如く、端子パターン5,6間は導電性接着剤7,
7で強固に接続され、また第1基板のスペーサ層3と第
2基板のスペーサ層4(又は絶縁層92)とは熱溶着に
よって強固に固定されるので、フレキシブル基板の端子
パターン間の接続は確実となる。As mentioned above, the conductive adhesive 7,
7, and the spacer layer 3 of the first substrate and the spacer layer 4 (or insulating layer 92) of the second substrate are firmly fixed by thermal welding, so the connection between the terminal patterns of the flexible substrate is Become certain.
以下、本発明の実施例を図面に基づいて詳細に説明する
。Embodiments of the present invention will be described in detail below with reference to the drawings.
第1図は本発明にかかるフレキシブル基板の端子接続構
造の基本構造を示す図であり、同図(a)は側断面図、
同図(b)は同図(a)に示す端子パターン5,6部分
を、90°回転した方向から切断した状態を示す側断面
図である。FIG. 1 is a diagram showing the basic structure of the terminal connection structure of a flexible board according to the present invention, and FIG. 1(a) is a side sectional view;
FIG. 5B is a side cross-sectional view showing the terminal patterns 5 and 6 shown in FIG.
同図に示すように、このフレキシブル基板の端子接続構
造は、可撓性シートからなる第1基板1と、可撓性シー
トからなる第2基板2とを具備し、該両基板1,2にそ
れぞれ設けた回路パターン5a、6aの一部をなす端子
パターン5.6の周囲に形成したスペーサ層3,4間を
熱溶着し、さらに前記両基板の端子パターン間を導電性
接着剤7で接続して構成されている。As shown in the figure, this flexible board terminal connection structure includes a first board 1 made of a flexible sheet and a second board 2 made of a flexible sheet. The spacer layers 3 and 4 formed around the terminal patterns 5 and 6, which form part of the circuit patterns 5a and 6a provided respectively, are thermally welded, and the terminal patterns on both substrates are further connected with a conductive adhesive 7. It is configured as follows.
以下各構成部品とこの端子接続構造の作成方法とを説明
する。Each component and the method for creating this terminal connection structure will be explained below.
第2図は第1図に示す端子接続構造に用いた2枚の基板
1,2を示す斜視図であり、第3図はこの2枚の基板1
,2の端子パターン間を接続して第1図に示す端子接続
構造を作成する方法を示す側断面図である。FIG. 2 is a perspective view showing two boards 1 and 2 used in the terminal connection structure shown in FIG. 1, and FIG.
, 2 is a sectional side view showing a method of creating the terminal connection structure shown in FIG. 1 by connecting the terminal patterns of FIG.
第2図及び第3図(a)に示すように、第1基板1と第
2基板2は、可撓性を有するポリエステルフィルム(こ
の実施例においては厚み約100−7=
μmのものを用いた)からなるフレキシブル基板で構成
されている。As shown in FIGS. 2 and 3(a), the first substrate 1 and the second substrate 2 are flexible polyester films (in this embodiment, a film with a thickness of approximately 100-7 μm is used). It consists of a flexible substrate made of
そして第1基板1及び第2基板2上には第2図に示すよ
うに、回路パターン5a、6aが印刷され(この実施例
においては銀カーボンを用いた)、その端部には小円形
状の端子パターン5゜6が形成されている。As shown in FIG. 2, circuit patterns 5a and 6a are printed on the first substrate 1 and the second substrate 2 (silver carbon is used in this embodiment), and the edges thereof have small circular shapes. A terminal pattern 5°6 is formed.
次にこの端子パターン5と端子パターン6部分の上のみ
にホットメルトタイプの導電性接着剤7.7を例えばス
クリーン印刷によって塗布する(第3図(a)参照)。Next, a hot melt type conductive adhesive 7.7 is applied only onto the terminal pattern 5 and terminal pattern 6 portions by, for example, screen printing (see FIG. 3(a)).
次に第2図及び第3図(a)に示すように、第1基板1
と第2基板2の上に塩化ビニール系の塗料(この実施例
においては、原意化成製1スペーザレジストXB−80
3」を用いた)を印刷してスペーサ層3.4を形成する
。但し、第1基板1と第2基板2の端子パターン5,6
を形成した部分には塗料を塗布せず、該部分は円形の露
出部31.41とした。またこの実施例におけるスペー
サ層3,4の厚みはそれぞれ約50μmとした。Next, as shown in FIGS. 2 and 3(a), the first substrate 1
and a vinyl chloride-based paint (in this example, 1 spacer resist XB-80 manufactured by Genji Kasei Co., Ltd.)
3") to form a spacer layer 3.4. However, the terminal patterns 5 and 6 of the first board 1 and the second board 2
No paint was applied to the portion where the was formed, and the portion was left as a circular exposed portion 31.41. Further, the thicknesses of the spacer layers 3 and 4 in this example were each about 50 μm.
8
次に第2図に示すように、第1基板1と第2基板2を両
者の端子パターン5,6が対向するように重ね合わせて
固定するのであるが、その固定方法を第3図を用いて説
明する。8 Next, as shown in Fig. 2, the first board 1 and the second board 2 are overlapped and fixed so that the terminal patterns 5 and 6 of both are facing each other, but the fixing method is shown in Fig. 3. I will explain using
即ちまず第3図(a)に示すように、第2基板2を支持
台A上に載置し、次にこの第2基板2の上に第1基板1
を重ね合わせる。このとき第1基板1上の端子パターン
5と第2基板2上の端子パターン6が対向する。That is, first, as shown in FIG. 3(a), the second substrate 2 is placed on the support stand A, and then the first substrate 1 is placed on the second substrate 2.
Overlap. At this time, the terminal pattern 5 on the first substrate 1 and the terminal pattern 6 on the second substrate 2 face each other.
次にこの第1基板1の上から熱したホットプレスBを押
し付けて、同図(b)に示すように、第1基板1に印刷
したスペーサ層3と第2基板2に印刷したスペーサ層4
を熱しながら圧接する。なおこの実施例においては、こ
のホットプレスBを160°Cに熱した状態で、10k
g/c+n”の圧力で4秒間押圧した(なおこの実施例
においては、ホットプレスBに加える押圧圧力と熱は、
10〜20kg/cm” 、 140〜180℃の範
囲が特に好適である)。Next, a heated hot press B is pressed onto the first substrate 1 to form a spacer layer 3 printed on the first substrate 1 and a spacer layer 4 printed on the second substrate 2, as shown in FIG.
Press while heating. In this example, the hot press B was heated to 160°C and heated to 10k.
g/c+n'' for 4 seconds (in this example, the pressing pressure and heat applied to hot press B are:
10 to 20 kg/cm'' and 140 to 180° C.).
ここでスペーサ層3,4を構成する塩化ビニル系の塗料
は熱可塑性を有するので、これらを熱圧着すれば、両ス
ペーサ層3,4の接触面ば熱溶着されて強固に固定され
るのである。なおこの実施例における第1基板1と第2
基板2の接着強度(両者を剥がすに必要な力)は、約1
.[3kg/cmであった。Here, the vinyl chloride paint that constitutes the spacer layers 3 and 4 has thermoplasticity, so if these are bonded together by heat, the contact surfaces of both the spacer layers 3 and 4 will be thermally welded and firmly fixed. . Note that the first substrate 1 and the second substrate in this embodiment
The adhesive strength of the substrate 2 (the force required to peel them off) is approximately 1
.. [It was 3 kg/cm.
次に同図(C)に示すように、ホットプレスBを取り除
いた後に、前記端子パターン5を形成した部分の第1基
板1の上から小さな径の熱したホットプレスCを押圧し
てこの部分を加熱する。Next, as shown in the same figure (C), after removing the hot press B, a heated hot press C having a small diameter is pressed from above the first substrate 1 in the area where the terminal pattern 5 is formed. heat up.
これによって、前記端子パターン5,6上にそれぞれ印
刷した導電性接着剤7,7が溶融し、両者が一体となっ
て接着される。As a result, the conductive adhesives 7, 7 printed on the terminal patterns 5, 6, respectively, are melted and the two are bonded together.
これによって第1図に示すように、端子パターン5と端
子パターン6が接続されるのである。As a result, the terminal pattern 5 and the terminal pattern 6 are connected as shown in FIG.
以上の端子接続構造によれば、スペーサ層3゜4によっ
て第1基板1と第2基板2が強固に固定された上で端子
パターン5,6間が導電性接着剤7で接続されるので、
端子パターン5,6間の接続が確実となる。According to the above terminal connection structure, the first substrate 1 and the second substrate 2 are firmly fixed by the spacer layer 3.4, and the terminal patterns 5 and 6 are connected by the conductive adhesive 7.
The connection between the terminal patterns 5 and 6 is ensured.
またこの実施例のように端子パターン5,6の周囲全体
にスベーザH3,4を形成すれば、端子パターン5,6
部分の周囲の空間(n山部31゜41によって構成され
る)は外部から密封される。従ってこの部分は防水され
ることとなる。なおこの端子パターン5,6部分の周囲
の空間を密封した場合、この部分が高温となったような
場合は内部の空気が膨張し、この接続部を破壊する恐れ
がある。このような場合はスペーサ層3或いはスペーサ
層4に空気抜き用の溝を設け、この溝によって外気と導
通させるようにすればよい(具体例は第8図(a)の溝
31d)。Furthermore, if the smoothing surfaces H3, 4 are formed all around the terminal patterns 5, 6 as in this embodiment, the terminal patterns 5, 6
The space around the part (formed by the n-peak portions 31.degree. 41) is sealed from the outside. Therefore, this part will be waterproofed. Note that when the space around the terminal patterns 5 and 6 is sealed, if this area becomes hot, the air inside may expand and destroy this connection. In such a case, a groove for venting air may be provided in the spacer layer 3 or 4, and the groove may be used to establish electrical conduction with the outside air (a specific example is the groove 31d in FIG. 8(a)).
第4図は本発明にかかる端子接続構造の他の実施例を示
す図であり、同図(a)は側断面図、同図(b)は平面
図である。FIG. 4 is a diagram showing another embodiment of the terminal connection structure according to the present invention, in which FIG. 4(a) is a side sectional view and FIG. 4(b) is a plan view.
同図に示すようにこの端子接続構造にあっては、第1基
板1の端子パターン5を形成した部分の周囲に切れ込み
8を形成している。As shown in the figure, in this terminal connection structure, a notch 8 is formed around the portion of the first substrate 1 where the terminal pattern 5 is formed.
これは第1図(b)に示ずようにホラ1−プレスCによ
って第1基板1を第2基板2に押圧したとI
きに、第1基板1に印刷した回路パターン5aの内、端
子パターン5に接続される部分5a−1が若干伸びる。As shown in FIG. 1(b), when the first substrate 1 is pressed against the second substrate 2 by the press C, the terminals of the circuit pattern 5a printed on the first substrate 1 are The portion 5a-1 connected to the pattern 5 is slightly elongated.
そしてこの伸びた部分5a−1が切断されてしまうこと
がある。しかしながら上記第4図に示すように予め第I
基板1に切れ込み8を設けておけば、この第1基板1の
上からホットプレスCを押圧したときに該切れ込み8部
分の隙間が広がるので、回路パターン5aが切断される
恐れはないのである。This extended portion 5a-1 may be cut off. However, as shown in FIG.
If the notches 8 are provided in the substrate 1, the gap between the notches 8 will widen when the hot press C is pressed from above the first substrate 1, so there is no risk of the circuit pattern 5a being cut.
なお上記実施例においては第1基板1と第2基板2のい
ずれもフレキシブル基板を用いた例を示したが、本発明
はこれに限られず、第2基板2は硬質絶縁板或いは金属
板の上に絶縁層を形成した板で構成してもよい。In the above embodiment, both the first substrate 1 and the second substrate 2 are made of flexible substrates, but the present invention is not limited to this, and the second substrate 2 is made of a hard insulating plate or a metal plate. It may also be constructed from a plate on which an insulating layer is formed.
第5図は本発明にかかる端子接続構造のさらに他の実施
例を示す側断面図である。FIG. 5 is a side sectional view showing still another embodiment of the terminal connection structure according to the present invention.
同図に示すようにこの実施例にあっては、第1図に示す
第2基板2とスペーサ層4の代わりに金属板91と絶縁
N92を用いている。As shown in the figure, in this embodiment, a metal plate 91 and an insulator N92 are used in place of the second substrate 2 and spacer layer 4 shown in FIG.
即ちこの実施例にかかる端子接続構造を作成す2
るには、まず可撓性シートからなる第1基板1と、金属
板91の上面に熱可塑性の樹脂を塗布して絶縁層92を
形成した第2基板9とを具備し、該両基板1,9のそれ
ぞれに端子パターン5.6を有する回路パターンを形成
する。That is, to create the terminal connection structure according to this embodiment, first, a first substrate 1 made of a flexible sheet and a thermoplastic resin were applied to the upper surface of a metal plate 91 to form an insulating layer 92. A circuit pattern having terminal patterns 5 and 6 is formed on each of the substrates 1 and 9.
次に前記第3図に示すと同様の方法によって、両基板1
,9の端子パターン5,6上にホットメルトタイプの導
電性接着剤7,7を塗布し、第1基板1の端子パターン
5の周囲を囲むスペーサ層3を熱可塑性の樹脂で形成し
た後、両基板1.9を重ね合わせ、第1基板1のスペー
サ層3と第2基板9の絶縁層92の接触面を熱溶着し、
さらに前記端子パターン5.6上の導電性接着剤7,7
同士を熱溶着した。Next, by the same method as shown in FIG.
, 9 are coated with hot melt type conductive adhesives 7, 7 on the terminal patterns 5, 6, and a spacer layer 3 surrounding the terminal patterns 5 of the first substrate 1 is formed of thermoplastic resin. The two substrates 1.9 are superimposed, and the contact surfaces of the spacer layer 3 of the first substrate 1 and the insulating layer 92 of the second substrate 9 are thermally welded,
Further, conductive adhesives 7, 7 on the terminal pattern 5.6
They were heat welded together.
このように金属板91上に設ける絶縁層92を熱可塑性
の樹脂で構成すれば、この絶縁層92に第1図に示すス
ペーサ層4と同等の機能を持たせることができ、有効で
ある。If the insulating layer 92 provided on the metal plate 91 is made of thermoplastic resin in this manner, it is effective because the insulating layer 92 can have the same function as the spacer layer 4 shown in FIG. 1.
なお上記各実施例においては、スペーサ層3゜4用或い
は絶R層92用の塗料として塩化ビニル系の塗料を用い
たが、本発明はこれに限られず、熱可塑性を有する樹脂
性の塗料であればどのような塗料でもよい。但し上記実
施例においてスペーサ層の材料として、原意化成製「ス
ペーサレジストX13−8034を用いたのは、この材
料が他のレジスト材料や接着剤とはその性質が異なり、
本発明を適用するのに好適だからである。以下その理由
を述べる。In each of the above embodiments, a vinyl chloride paint was used as the paint for the spacer layer 3゜4 or the absolute R layer 92, but the present invention is not limited thereto, and a thermoplastic resin paint may be used. Any kind of paint will do. However, in the above example, "Spacer Resist
This is because it is suitable for applying the present invention. The reason is explained below.
即ち一般のレジスト層は、エポキシ系、ポリエステル系
樹脂に、印刷性をだす為に無機フィラー(Si等)及び
溶剤が配合されている。これに対してXB−803は塩
ビペーストレジンで、無機フィラー及び溶剤を含んでお
らず、硬化塗膜はフレキシブル性を有する。また無機フ
ィラーを含んでいないため、熱圧着後の接着力を低下さ
せない。That is, a typical resist layer is made of an epoxy or polyester resin mixed with an inorganic filler (such as Si) and a solvent to improve printability. On the other hand, XB-803 is a PVC paste resin that does not contain inorganic fillers or solvents, and the cured coating film has flexibility. Furthermore, since it does not contain inorganic filler, it does not reduce the adhesive strength after thermocompression bonding.
また一般の接着剤(印刷のり)は、印刷硬化後の塗膜表
面に粘着力を有するため、この表面に予めセパレーター
をはっておく作業が必要となる。Furthermore, since general adhesives (printing glue) have adhesive strength on the surface of the coating film after printing and hardening, it is necessary to apply a separator to this surface in advance.
これに対してXB−803は常温では硬化塗膜表面に粘
着力がなく、従ってこの表面に予めセパレーターをはる
必要がなく作業性が良い。また−般の接着剤は粘着状の
ため規定の厚みを設けるには不適当である。On the other hand, XB-803 has no adhesive force on the surface of the cured coating film at room temperature, so there is no need to apply a separator to this surface in advance, and workability is good. Further, since common adhesives are sticky, they are not suitable for providing a specified thickness.
次に上記各実施例において用いたフレキシブル基板は可
撓性を有するポリエステルフィルムで構成したが、本発
明はこれに限られず、可撓性を有するシートであればど
のような材料のものでもよい。Next, although the flexible substrate used in each of the above embodiments is made of a flexible polyester film, the present invention is not limited to this, and any material may be used as long as it is a flexible sheet.
第6図は導電性接着剤として異方性ホットメルトタイプ
の導電性接着剤7′を用いた場合の実施例を示す図であ
る。FIG. 6 is a diagram showing an embodiment in which an anisotropic hot-melt type conductive adhesive 7' is used as the conductive adhesive.
同図(b)に示すようにこの実施例においては、第1基
板1と第2基板2のそれぞれに3つの端子パターン5−
1.5−2.5−3と端子パターン6−1.6−2.6
−3を設け、端子パターン5−1.5−2.5−3全体
にわたるように導電性接着剤7′を塗布し、また端子パ
ターン6−1.6−2.6−3全体にわたるように導電
性接着剤7′を塗布する。As shown in FIG. 2(b), in this embodiment, three terminal patterns 5-
1.5-2.5-3 and terminal pattern 6-1.6-2.6
-3, and apply conductive adhesive 7' over the entire terminal pattern 5-1.5-2.5-3, and apply the conductive adhesive 7' over the entire terminal pattern 6-1.6-2.6-3. Apply conductive adhesive 7'.
5
次に端子パターン5−1.5−2.5−3の周囲を囲む
ように第1基板1上にスペーサ層3を印刷し、また端子
パターン6−1 、6−2 、6−3を囲むように第2
基板2上にスペーサ層4を印刷する。そして第3図(a
)、(b)に示すと同様の方法によってスペーサ層4上
にスペーサ層3を熱溶着する。5 Next, a spacer layer 3 is printed on the first substrate 1 so as to surround the terminal patterns 5-1.5-2.5-3, and terminal patterns 6-1, 6-2, and 6-3 are printed. 2nd one surrounding
A spacer layer 4 is printed on the substrate 2. And Figure 3 (a
) and (b), the spacer layer 3 is thermally welded onto the spacer layer 4 by the same method.
次に第3図(c)に示すと同様に、端子パターン5−1
.5−2.5−3の上部から熱したホットプレスCr
、Cz 、Caを押し付け、上下両導電性接着剤7
′を熱溶着する。Next, as shown in FIG. 3(c), the terminal pattern 5-1
.. 5-2. Hot press Cr heated from the top of 5-3
, Cz, Ca, and conductive adhesive 7 on both upper and lower sides.
′ is heat welded.
これによって同図(a)に示すような端子接続構造が完
成する。As a result, a terminal connection structure as shown in FIG. 3(a) is completed.
ここで、この異方性ホットメルトタイプの導電性接着剤
7′は、該導電性接着剤7′に対して加圧した方向のみ
に導通する性質を有している。Here, this anisotropic hot melt type conductive adhesive 7' has a property of conducting only in the direction in which pressure is applied to the conductive adhesive 7'.
従って端子パターン5−1.6−1間、端子パターン5
−2.6−2間、端子パターン5−3゜6−3間のみが
それぞれ導通することとなる。Therefore, between terminal pattern 5-1 and 6-1, terminal pattern 5
-2, 6-2, terminal patterns 5-3 and 6-3 are electrically connected.
以上、本発明にかかるフレキシブル基板の端子6
接続構造を詳細に説明したが、次にこの端子接続構造を
利用した電子部品の応用例を説明する。The terminal 6 connection structure of the flexible substrate according to the present invention has been described in detail above, and next, an application example of an electronic component using this terminal connection structure will be described.
第7図は本発明をメンブレンスイッチの端子接続構造に
適用した例を示す図であり、同図(a)は第1基板1の
平面図、同図(b)は第2基板2の平面図である。FIG. 7 is a diagram showing an example in which the present invention is applied to a terminal connection structure of a membrane switch. FIG. 7(a) is a plan view of the first substrate 1, and FIG. 7(b) is a plan view of the second substrate 2. It is.
ここで第1基板1はフレキシブル基板上に所望の回路パ
ターン5aをスクリーン印刷して構成されている。この
回路パターン5aの所定部分には、端子パターン5とメ
ンブレンスイッチの接点パターン5bと外部導出用端子
パターン5cが設けられている。Here, the first substrate 1 is constructed by screen-printing a desired circuit pattern 5a on a flexible substrate. A terminal pattern 5, a membrane switch contact pattern 5b, and an external lead-out terminal pattern 5c are provided in a predetermined portion of the circuit pattern 5a.
一方第2基板2はフレキシブル基板上に所望の回路パタ
ーン6aをスクリーン印刷して構成されている。この回
路パターン6aの所定部分には、端子パターン6とメン
ブレンスイッチの接点パターン6bとが設けられている
。またこの第2基板2には前記外部導出用端子パターン
5cを外部に露出させるための六6cが形成されている
。On the other hand, the second substrate 2 is constructed by screen-printing a desired circuit pattern 6a on a flexible substrate. A terminal pattern 6 and a contact pattern 6b of a membrane switch are provided in a predetermined portion of this circuit pattern 6a. Further, a six 6c is formed on the second substrate 2 to expose the external lead terminal pattern 5c to the outside.
次にこれら端子パターン5,6の上にそれぞれ第3図(
a)に示すように導電性接着剤7を塗布する。Next, place the terminal patterns 5 and 6 on top of each other as shown in FIG.
Apply conductive adhesive 7 as shown in a).
次にこれら第1基板1と第2基板2の上にスペーサ層3
,4を印刷するがその印刷状態を第8図に示す。Next, a spacer layer 3 is placed on these first substrate 1 and second substrate 2.
, 4 are printed, and the printing state is shown in FIG.
同図に示すように、スペーサ層3,4は第1基板1と第
2基板2の略全面に印刷されるが、端子パターン5と接
点パターン5bと外部導出用端子パターン5cと端子パ
ターン6と回路パターン6aの部分の周囲は露出部31
+ 3 l b + 31 c r41.41bとす
る。またスペーサ層3には各露出部31.31b、31
c間をつなぐスペーサ層3を設けない溝31dが設けら
れている。この溝31dは端子パターン5,6部分や接
点パターン5b、6bの周囲の空間を密閉することなく
、外気と導通するために設けられている(この実施例の
場合は溝31dが露出部31cと接続した部分が外気に
開口することとなる)。As shown in the figure, the spacer layers 3 and 4 are printed on almost the entire surface of the first substrate 1 and the second substrate 2, but the terminal pattern 5, the contact pattern 5b, the external lead-out terminal pattern 5c, and the terminal pattern 6 The area around the circuit pattern 6a is an exposed portion 31.
+ 3 l b + 31 cr r41.41b. In addition, the spacer layer 3 has each exposed portion 31, 31b, 31
A groove 31d without the spacer layer 3 is provided to connect between the grooves c. This groove 31d is provided in order to communicate with the outside air without sealing the space around the terminal patterns 5 and 6 and the contact patterns 5b and 6b (in the case of this embodiment, the groove 31d is connected to the exposed portion 31c). (The connected part will be open to the outside air).
次にこの第1基板1の上に第2基板2を重ね合わせる。Next, a second substrate 2 is placed on top of the first substrate 1.
このとき端子パターン5,6が対向し、また接点パター
ン5b、6bが対向するようにする。At this time, the terminal patterns 5 and 6 face each other, and the contact patterns 5b and 6b face each other.
そして第3図(b)に示すように、スペーサ層3.4を
熱溶着し、次に同図(c)に示すように、端子パターン
5,6部分の導電性接着剤7を熱溶着すれば、本発明に
かかる端子接続構造は完成する。なおこのとき接点パタ
ーン5b、6b部分は第9図に示すようになり、スペー
サ層3,4がスペーサとなってメンブレンスイッチが構
成される。Then, as shown in FIG. 3(b), the spacer layer 3.4 is heat welded, and then, as shown in FIG. 3(c), the conductive adhesive 7 on the terminal patterns 5 and 6 is heat welded. For example, the terminal connection structure according to the present invention is completed. At this time, the contact patterns 5b and 6b become as shown in FIG. 9, and the spacer layers 3 and 4 serve as spacers to form a membrane switch.
なおまた第1基板1上に形成した外部導出用端子パター
ン5cに本発明を適用してこの外部導出用端子パターン
5cを他の基板の端子パターンに接続してもよい。Furthermore, the present invention may be applied to the external lead-out terminal pattern 5c formed on the first substrate 1, and this external lead-out terminal pattern 5c may be connected to a terminal pattern on another board.
以上本発明に係るフレキシブル基板の端子接続構造を詳
細に説明したが、本発明はこれに限られず、例えば、1
枚のフレキシブル基板を折り畳み、その上下の各基板を
第1基板1.第2基板2としてもよいことは言うまでも
ない。Although the terminal connection structure of the flexible board according to the present invention has been described in detail above, the present invention is not limited to this.
Fold the flexible substrates, and separate the upper and lower substrates into the first substrate 1. It goes without saying that the second substrate 2 may also be used.
9
また上記各実施例及び応用例においては、第1基板と第
2基板に設けた対向する端子パターンの両方に導電性接
着剤を塗布した例を示しているが、本発明はこれに限ら
れず、この導電性接着剤は対向するいずれか一方の端子
パターン上のみに塗布してもよい。9 Furthermore, in each of the above embodiments and application examples, an example is shown in which a conductive adhesive is applied to both opposing terminal patterns provided on the first substrate and the second substrate, but the present invention is not limited to this. , this conductive adhesive may be applied only on one of the opposing terminal patterns.
また上記各実施例及び応用例においては、導電性接着剤
としてホットメルトタイプのものを用いたが、本発明は
これに限定されず、他の種類の導電性接着剤を用いても
よい。Further, in each of the above embodiments and application examples, a hot melt type conductive adhesive was used as the conductive adhesive, but the present invention is not limited thereto, and other types of conductive adhesives may be used.
以上詳細に説明したように本発明に係るフレキシブル基
板の端子接続構造によれば、以下のような優れた効果を
有する。As described above in detail, the terminal connection structure for a flexible substrate according to the present invention has the following excellent effects.
(1)端子パターン間は導電性接着剤で確実に固定でき
、しかも2枚の基板間はスペーサ層によって確実に固定
できるので、端子パターン間の接続が確実となるばかり
か、接続部分の抵抗値が低く、またその接続作業も容易
である。(1) Since the terminal patterns can be securely fixed using conductive adhesive, and the spacer layer can be used between the two boards, not only is the connection between the terminal patterns reliable, but also the resistance value of the connection part is low, and the connection work is easy.
(2)また、従来のスペーサや押圧部材等の部品は不要
となり、部品点数が減少する。(2) Furthermore, conventional parts such as spacers and pressing members are no longer necessary, and the number of parts is reduced.
第1図は本発明にかかるフレキシブル基板の端子接続構
造の基本構造を示す図、第2図は基板1.2を示す斜視
図、第3図は基板1,2の端子パターン間を接続して第
1図に示す端子接続構造を作成する方法を示す側断面図
、第4図、第5図、第6図は本発明にかかる端子接続構
造の他の実施例を示す図、第7図は本発明をメンブレン
スイッチの端子接続構造に適用した例を示す図、第8図
は第1基板1と第2基板2の上にスペーサ層3.4を印
刷した状態を示す図、第9図はメンブレンスイッチ部分
を示す図、第10図は従来のフレキシブル基板の端子接
続構造を示す要部側断面図である。
図中、1・・・第1基板、2,9・・・第2基板、3゜
4・・・スペーサ層、5,6・・・端子パターン、7,
7・・・導電性接着剤、5a、6a・・・回路パターン
、92・・・絶縁層、である。
(a)
特開平3
176972 (7)
(b)
(a)
8
特開平
176972 (8)
第4
図Fig. 1 is a diagram showing the basic structure of the terminal connection structure of a flexible board according to the present invention, Fig. 2 is a perspective view showing the board 1.2, and Fig. 3 is a diagram showing the connection between the terminal patterns of the boards 1 and 2. FIG. 1 is a side sectional view showing a method of creating the terminal connection structure shown in FIG. 1, FIGS. 4, 5, and 6 are views showing other embodiments of the terminal connection structure according to the present invention, and FIG. A diagram showing an example in which the present invention is applied to a terminal connection structure of a membrane switch, FIG. 8 is a diagram showing a state in which a spacer layer 3.4 is printed on the first substrate 1 and the second substrate 2, and FIG. FIG. 10, a diagram showing a membrane switch portion, is a side sectional view of a main part showing a terminal connection structure of a conventional flexible board. In the figure, 1... first substrate, 2, 9... second substrate, 3° 4... spacer layer, 5, 6... terminal pattern, 7,
7... Conductive adhesive, 5a, 6a... Circuit pattern, 92... Insulating layer. (a) Unexamined Japanese Patent Publication No. 3 176972 (7) (b) (a) 8 Unexamined Japanese Patent Publication No. 176972 (8) Fig. 4
Claims (2)
或いは硬質板からなる第2基板とを具備し、該両基板の
それぞれに端子パターンを有する回路パターンを形成す
るとともに該両基板の端子パターンの内の少なくともい
ずれか一方の端子パターン上に導電性接着剤を塗布し、
両基板の少なくとも端子パターンの周囲を囲む部分に熱
可塑性の樹脂を塗布してスペーサ層を形成し、両基板の
端子パターンが対向するように両基板を重ね合わせて両
基板のスペーサ層を接触させて該接触面を熱溶着すると
ともに、前記両基板の対向する端子パターン間を導電性
接着剤で接続したことを特徴とするフレキシブル基板の
端子接続構造。(1) A first substrate made of a flexible sheet and a second substrate made of a flexible sheet or a hard plate, a circuit pattern having a terminal pattern is formed on each of the two substrates, and a circuit pattern is formed on each of the two substrates. Applying a conductive adhesive on at least one of the terminal patterns,
A spacer layer is formed by applying a thermoplastic resin to at least a portion surrounding the terminal pattern of both substrates, and the spacer layers of both substrates are brought into contact by overlapping the substrates so that the terminal patterns of both substrates face each other. A terminal connection structure for a flexible substrate, characterized in that the contact surfaces are thermally welded together, and the opposing terminal patterns of both substrates are connected using a conductive adhesive.
りその上面に熱可塑性の樹脂を塗布して絶縁層を形成し
た第2基板とを具備し、該両基板のそれぞれに端子パタ
ーンを有する回路パターンを形成するとともに該両基板
の端子パターンの内の少なくともいずれか一方の端子パ
ターン上に導電性接着剤を塗布し、第1基板の少なくと
も端子パターンの周囲を囲む部分に熱可塑性の樹脂を塗
布してスペーサ層を形成し、両基板の端子パターンが対
向するように両基板を重ね合わせて第1基板のスペーサ
層と第2基板の絶縁層を接触させて該接触面を熱溶着す
るとともに、前記両基板の対向する端子パターン間を導
電性接着剤で接続したことを特徴とするフレキシブル基
板の端子接続構造。(2) A first substrate made of a flexible sheet and a second substrate made of a metal plate whose upper surface is coated with thermoplastic resin to form an insulating layer, and each of the two substrates has a terminal pattern. A conductive adhesive is formed on at least one of the terminal patterns of both substrates, and a thermoplastic adhesive is applied to at least a portion of the first substrate surrounding the terminal pattern. A spacer layer is formed by applying a resin, and the two substrates are overlapped so that the terminal patterns of both substrates face each other, and the spacer layer of the first substrate and the insulating layer of the second substrate are brought into contact and the contact surfaces are thermally welded. In addition, a terminal connection structure for a flexible substrate, characterized in that opposing terminal patterns of both substrates are connected with a conductive adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1317052A JPH0779185B2 (en) | 1989-12-05 | 1989-12-05 | Flexible board terminal connection structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1317052A JPH0779185B2 (en) | 1989-12-05 | 1989-12-05 | Flexible board terminal connection structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03176972A true JPH03176972A (en) | 1991-07-31 |
JPH0779185B2 JPH0779185B2 (en) | 1995-08-23 |
Family
ID=18083883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1317052A Expired - Fee Related JPH0779185B2 (en) | 1989-12-05 | 1989-12-05 | Flexible board terminal connection structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0779185B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007293800A (en) * | 2006-03-31 | 2007-11-08 | Toshiba Corp | Semiconductor device and memory card using the same |
WO2008120513A1 (en) * | 2007-03-29 | 2008-10-09 | Citizen Holdings Co., Ltd. | Electrode terminal connecting structure of multilayer substrate |
WO2011036996A1 (en) * | 2009-09-25 | 2011-03-31 | アルプス電気株式会社 | Coordinate-input device, and electronic equipment and display device provided with said coordinate-input device |
GB2527260B (en) * | 2013-03-18 | 2017-04-12 | Bikecityguide Apps Gmbh | Holding apparatus for a multimedia device, in particular a smartphone |
WO2019131647A1 (en) * | 2017-12-28 | 2019-07-04 | 株式会社村田製作所 | Substrate and substrate joining structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6169196A (en) * | 1984-09-12 | 1986-04-09 | 松下電器産業株式会社 | Method of connecting lead |
-
1989
- 1989-12-05 JP JP1317052A patent/JPH0779185B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6169196A (en) * | 1984-09-12 | 1986-04-09 | 松下電器産業株式会社 | Method of connecting lead |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007293800A (en) * | 2006-03-31 | 2007-11-08 | Toshiba Corp | Semiconductor device and memory card using the same |
WO2008120513A1 (en) * | 2007-03-29 | 2008-10-09 | Citizen Holdings Co., Ltd. | Electrode terminal connecting structure of multilayer substrate |
WO2011036996A1 (en) * | 2009-09-25 | 2011-03-31 | アルプス電気株式会社 | Coordinate-input device, and electronic equipment and display device provided with said coordinate-input device |
GB2527260B (en) * | 2013-03-18 | 2017-04-12 | Bikecityguide Apps Gmbh | Holding apparatus for a multimedia device, in particular a smartphone |
WO2019131647A1 (en) * | 2017-12-28 | 2019-07-04 | 株式会社村田製作所 | Substrate and substrate joining structure |
US10993329B2 (en) | 2017-12-28 | 2021-04-27 | Murata Manufacturing Co., Ltd. | Board joint structure |
Also Published As
Publication number | Publication date |
---|---|
JPH0779185B2 (en) | 1995-08-23 |
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