JPS60133682A - Method of producing heat fusible-bonding connecting cable - Google Patents
Method of producing heat fusible-bonding connecting cableInfo
- Publication number
- JPS60133682A JPS60133682A JP24119683A JP24119683A JPS60133682A JP S60133682 A JPS60133682 A JP S60133682A JP 24119683 A JP24119683 A JP 24119683A JP 24119683 A JP24119683 A JP 24119683A JP S60133682 A JPS60133682 A JP S60133682A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- heat
- connecting cable
- producing heat
- heat fusible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
く技術分野〉
この発明は、プリント基板間の接続のためなどに用いら
れる、いわゆる接続ケーブルに関するもので、さらに詳
しくは、押圧して加熱することにより接続と導通をとり
うる熱融着型接続ケーブルの製造方法に関するものであ
る。[Detailed Description of the Invention] Technical Field> The present invention relates to a so-called connection cable used for connection between printed circuit boards, and more specifically, to a connection cable that achieves connection and conduction by pressing and heating. The present invention relates to a method of manufacturing a heat-sealable connection cable.
〈従来技術〉
従来の熱融着型接続ケーブルは４１〜６図示のような構
成をしている。すなわちポリエステル等の絶縁シート１
ｖｃ＠、アルミなどにより導（性パターン２が形成され
、その上に熱融蕾用位（脂にカーボン粉末を混入してな
る導電性塗料６・が負相されている。そして隣接する導
電性パターン２がゴミや他の電線が触れてショートする
ことを防止するため、接続すべき部分を除いて全面にわ
たり絶縁性塗料４を塗布している。４１！造（であたっ
ては、絶毬シート１上に導電材料を設けて、これをエツ
チングにより導電性パターン２全形成し、この上に導電
性塗料６を位置合せして塗布し、さらにその上に接続す
べき部分を除いて絶縁性塗料４を塗布する。このように
導屯パターン２の上に２ｆ重類の樹脂を位置合せをして
塗布しなけれはならないので製造が複雑で手間がかかる
という欠点があった。<Prior Art> Conventional heat-sealing type connection cables have configurations as shown in figures 41-6. In other words, an insulating sheet 1 made of polyester, etc.
A conductive pattern 2 is formed of vc@, aluminum, etc., and a conductive paint 6 made of carbon powder mixed with fat is applied as a negative phase on top of the conductive pattern 2. In order to prevent pattern 2 from shorting due to contact with dust or other wires, insulating paint 4 is applied to the entire surface except for the areas where it should be connected. A conductive material is provided on the conductive material 1, a conductive pattern 2 is formed on the entire conductive pattern 2 by etching, a conductive paint 6 is applied in alignment, and an insulating paint is applied on top of the conductive material 6 except for the parts to be connected. 4. In this way, the 2F resin must be aligned and coated on the guide pattern 2, which has the disadvantage that manufacturing is complicated and time-consuming.
〈目 的〉
この発明はこうした従来例における欠点全解決するもの
で、導電材料の上に塗布子る樹脂をエツチングの、＠の
レジストとして用いることにより、樹脂の塗布にち之っ
で位置仕せなどの手間が不要となり（ｒｐ 鴫に型費で
きる製置方法を提供するものである。<Purpose> The purpose of this invention is to overcome all of the drawbacks of the conventional methods.By using a resin coated on a conductive material as a resist for etching, it is possible to position the conductive material after the resin is applied. The present invention provides a manufacturing method that eliminates the need for such labor and costs.
くミ都１イ１ｆぐり〉
第４図において、ポリエステルなどよりなる絶縁シート
５−Ｅｖｃ銅、アルミニウムなどの導電材によって導戒
傅６が１８府、あるいは蒸着など適宜の手没で形ｌｙ、
される。つぎに、この導α層６の上に、導電性粒子（Ｃ
，Ｃ１ｘ、ＡＬ、Ｎｉ等）ｉ５０ｖｏｌチ未満（好十し
くは５〜１０係）混入した熱噛着用１（ｒＩ＋１旨７を
パターン印刷する（第５図）−この熱融青用樹脂７とし
ては、エチレンコポリマー系。In Figure 4, an insulating sheet 5 made of polyester or the like is formed with a conductive material such as copper or aluminum, or by an appropriate manual process such as vapor deposition.
be done. Next, conductive particles (C
, C1x, AL, Ni, etc.) i less than 50 vol. , ethylene copolymer system.
ポリエステル系ま化はポリアミド系などの熱１丁塑性樹
脂または、熱硬化変成ナイロン系、エポキシ系などの未
反１．シ熱硬化性樹脂をベースにし、これに枯袴付与削
１０１塑剤、酸化防止剤等を混合添加した接着剤が用い
られ、る。次にこの熱融層用樹脂７ｆ、レジストとして
上記導電１碕６をエツチングして導１ｉ パターン８を
形成して、さらに洗浄、乾燥して熱融着型接続ケーブル
９が完成す／）（第６゜７図）。エツチングに用いる薬
品は導電層６の材料により異なるが、熱融青用樹脂７は
この薬品と反応しないものを用いる。熱融青用樹脂７は
この状態では全方向絶縁性であるが、回路基板等に加圧
状態で加熱融着させて硬化した状態では、１！４み方向
のみ導電性となり必要な導通をとることができる４、シ
たがって＠６．７図示の状、態からさら（（絶様層を設
ける必４はない。Polyester resins are thermoplastic resins such as polyamides, or uncured resins such as thermosetting modified nylon and epoxy resins. An adhesive is used that is based on a thermosetting resin and is mixed with a 101 plasticizer, an antioxidant, etc. Next, the conductor 1i pattern 8 is formed by etching the conductive layer 6 as a resist using this heat-fusible layer resin 7f, and is further washed and dried to complete the heat-fusible connection cable 9. 6°7). The chemicals used for etching vary depending on the material of the conductive layer 6, but the heat-melting blue resin 7 is one that does not react with these chemicals. The heat-melting blue resin 7 is insulating in all directions in this state, but when it is heated and fused to a circuit board, etc. under pressure and cured, it becomes conductive only in the 1!4 direction, providing necessary continuity. Therefore, it is not necessary to provide a transparent layer from the state shown in @6.7.
なお熱＠着用樹脂に混入する導電性粒子として導′亀層
６と同じ材料金円いた場合、エツチングに際し、不都合
が生じることが考えられるが、実際には薬品で溶かされ
る導電性粒子は表面に出たものだけであり、何らさしつ
かえ−ない。Note that if the same material as the conductive layer 6 is used as the conductive particles mixed in the heat-wearing resin, problems may occur during etching. It's just what came out, so there's nothing wrong with that.
〈効 果〉
本発明によれば、樹脂の塗布が１回ですみ、しかも熱融
着用樹脂がそのままエツチング用のレジストとしても用
いられるので、レジスト塗布工程が省け、また、導電パ
ターンとその上の熱融着用樹脂膜とがセルフアラインメ
ントとなり位置合せの手間が不要となる。<Effects> According to the present invention, the resin needs to be applied only once, and the heat-sealing resin can also be used as an etching resist as it is, so the resist application process can be omitted, and the conductive pattern and its top Self-alignment with the heat-sealing resin film eliminates the need for alignment.
第１図は従来の接続ケーブルの平面図、第２図は第１図
ｎ−ｎ線断面図、第６図は第１図１−ｎｌ線断面図であ
り、・■４〜第６図は本発明の実施例の製造工程順に示
す断面説明図、第７図は第６図のモ百図である。
５・・・・・絶縁シート
６ ・・・導電層
７・・・・・熱融着用樹脂
８・・・・導電パターン
９・・・・・・熱Ｍ着型接続テーブル
以 上
出願人 株式会社 精 工 舎
代理人 弁理士最上 務
第１図
■Ｌ ■Ｌ
第２図 第３図
第４図
第７ｙ！Ｉ９
ノFig. 1 is a plan view of a conventional connection cable, Fig. 2 is a sectional view taken along line nn in Fig. 1, and Fig. 6 is a sectional view taken along line 1-nl in Fig. 1. FIG. 7 is a cross-sectional explanatory diagram showing the order of manufacturing steps of the embodiment of the present invention, and is a cross-sectional diagram of FIG. 6. 5... Insulating sheet 6... Conductive layer 7... Heat sealing resin 8... Conductive pattern 9... Thermal M bonding type connection table and above Applicant: Co., Ltd. Seikosha Agent Patent Attorney Mogami Affairs Figure 1 ■L ■L Figure 2 Figure 3 Figure 4 Figure 7y! I9 ノ
Claims (1)
加圧状態で熱融涜すると厚さ方向にのみ導電性となる熱
融着用樹脂でパターン印刷し、上記熱融着用樹脂をレジ
ストとして上記導電層をエツチングして導電パターンを
形成することを特徴とする熱融着型接続ケーブルの製造
方法。A conductive layer is formed on the insulating sheet 17. A pattern is printed on the conductive layer with a heat sealing resin that becomes conductive only in the thickness direction when heat melted under pressure, and the heat sealing resin is applied to a resist. A method for manufacturing a heat-sealable connection cable, characterized in that a conductive pattern is formed by etching the conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24119683A JPS60133682A (en) | 1983-12-21 | 1983-12-21 | Method of producing heat fusible-bonding connecting cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24119683A JPS60133682A (en) | 1983-12-21 | 1983-12-21 | Method of producing heat fusible-bonding connecting cable |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60133682A true JPS60133682A (en) | 1985-07-16 |
| JPS6348156B2 JPS6348156B2 (en) | 1988-09-27 |
Family
ID=17070634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24119683A Granted JPS60133682A (en) | 1983-12-21 | 1983-12-21 | Method of producing heat fusible-bonding connecting cable |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60133682A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60140685A (en) * | 1983-12-28 | 1985-07-25 | 日本写真印刷株式会社 | Filmlike electrode connector and method of producing same |
| JPH06181075A (en) * | 1991-12-26 | 1994-06-28 | Shin Etsu Polymer Co Ltd | Heat seal connector and connecting structure of this and electric circuit board |
-
1983
- 1983-12-21 JP JP24119683A patent/JPS60133682A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60140685A (en) * | 1983-12-28 | 1985-07-25 | 日本写真印刷株式会社 | Filmlike electrode connector and method of producing same |
| JPH0253911B2 (en) * | 1983-12-28 | 1990-11-20 | Nippon Shashin Insatsu Kk | |
| JPH06181075A (en) * | 1991-12-26 | 1994-06-28 | Shin Etsu Polymer Co Ltd | Heat seal connector and connecting structure of this and electric circuit board |
| JPH0793155B2 (en) * | 1991-12-26 | 1995-10-09 | 信越ポリマー株式会社 | Heat seal connector and connection structure of this and electric circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6348156B2 (en) | 1988-09-27 |
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