JPH0685422A - Connection structure for printed wiring board - Google Patents
Connection structure for printed wiring boardInfo
- Publication number
- JPH0685422A JPH0685422A JP4259038A JP25903892A JPH0685422A JP H0685422 A JPH0685422 A JP H0685422A JP 4259038 A JP4259038 A JP 4259038A JP 25903892 A JP25903892 A JP 25903892A JP H0685422 A JPH0685422 A JP H0685422A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- wiring patterns
- connection
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板同士を
接続する構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for connecting printed wiring boards.
【０００２】[0002]
【従来の技術】従来、プリント配線板同士の接続には、
例えば特開昭６２−１２６６９２号公報に開示されてい
るような構造が知られている。この接続構造は、第５図
に示すように、重ね合わされるプリント配線板１の相対
向して接続される配線パターン２間に異方性導電接着樹
脂５を塗布し、熱圧着したものである。2. Description of the Related Art Conventionally, for connecting printed wiring boards to each other,
For example, a structure disclosed in Japanese Patent Laid-Open No. 62-126692 is known. In this connection structure, as shown in FIG. 5, the anisotropic conductive adhesive resin 5 is applied between the wiring patterns 2 of the printed wiring boards 1 to be overlapped and connected to face each other, and thermocompression bonding is performed. .
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来の接続構造では、接続部の隣り合う配線パターン２間
には金属粒子が存在しているために、異方性導電接着樹
脂５の金属粒子の含有数および分布により接続ピッチが
制限され、微小ピッチになる程、隣り合う配線パターン
２間は絶縁信頼性が悪くなるという問題点を有してい
た。However, in the above-mentioned conventional connection structure, since the metal particles are present between the adjacent wiring patterns 2 of the connection portion, the metal particles of the anisotropic conductive adhesive resin 5 are The connection pitch is limited by the number and distribution of the contained elements, and there is a problem that as the pitch becomes smaller, the insulation reliability between the adjacent wiring patterns 2 becomes worse.
【０００４】本発明は、かかる従来の問題点に鑑みてな
されたもので、プリント配線板同士の接続において、接
続材料に関係なく微小ピッチな配線パターンの接続がで
き、また隣り合う配線パターン間の絶縁信頼性の高い、
プリント配線板の接続構造を提供することを目的とす
る。The present invention has been made in view of the above conventional problems. When connecting printed wiring boards to each other, wiring patterns having a fine pitch can be connected regardless of a connecting material, and between adjacent wiring patterns. High insulation reliability,
An object is to provide a connection structure for a printed wiring board.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、本発明は、プリント配線板同士を樹脂にて固定し、
上記プリント配線板に設けられた配線パターン同士を電
気的に接続するプリント配線板の接続構造において、少
なくともどちらか一方のプリント配線板の配線パターン
表面に微細な凹凸パターンを形成して配線パターン同士
を電気的に接続することとした。In order to solve the above problems, the present invention is to fix printed wiring boards to each other with resin,
In the connection structure of the printed wiring board for electrically connecting the wiring patterns provided on the printed wiring board, a fine uneven pattern is formed on the surface of the wiring pattern of at least one of the printed wiring boards to form the wiring patterns. It was decided to connect electrically.
【０００６】すなわち、例えば本発明は、プリント配線
板の対向する配線パターン同士を、電気的かつ機械的に
接続するにあたり、配線パターンの接続部が、無数の微
細な突起状に表面処理されているプリント配線板を用
い、このようなプリント配線板同士の接続は、接続する
配線パターン間に絶縁性熱硬化樹脂を介在させ、加圧お
よび加熱することにより行う。このようにして接続され
たプリント配線板の接続部は、絶縁性熱硬化樹脂の硬化
により機械的に接続され、また対向する配線パターン表
面の突起同士の接続により電気的に接続されている。That is, for example, according to the present invention, when electrically connecting the opposing wiring patterns of the printed wiring board electrically and mechanically, the connection portions of the wiring patterns are surface-treated into innumerable fine projections. Printed wiring boards are used, and such printed wiring boards are connected to each other by interposing an insulating thermosetting resin between the wiring patterns to be connected, and applying pressure and heating. The connection portion of the printed wiring board thus connected is mechanically connected by the curing of the insulating thermosetting resin, and is electrically connected by the connection of the protrusions on the surface of the wiring pattern facing each other.
【０００７】[0007]
【作用】上記のように、本発明のプリント配線板の接続
構造においては、加圧することにより対向する配線パタ
ーン表面の微細な突起同士が接触して、電気的接続が行
われ、また同時に加熱することにより接続する配線パタ
ーン同士が、絶縁性熱硬化樹脂の硬化により機械的に接
続される。したがって、接続部の隣り合う配線パターン
間には、従来のように金属粒子が存在せず、接続する配
線パターンのピッチに関係なく接続でき、また隣り合う
配線パターン間の絶縁信頼性が高くなる。As described above, in the printed wiring board connection structure of the present invention, by applying pressure, the fine projections on the surface of the opposing wiring pattern come into contact with each other for electrical connection and heating at the same time. Thus, the wiring patterns to be connected are mechanically connected to each other by curing the insulating thermosetting resin. Therefore, unlike the conventional case, metal particles do not exist between the adjacent wiring patterns of the connection portion, the wiring patterns can be connected regardless of the pitch of the wiring patterns to be connected, and the insulation reliability between the adjacent wiring patterns becomes high.
【０００８】[0008]
【実施例】（構成）図１、図２および図３は、それぞれ
プリント配線板を絶縁性熱硬化樹脂を介在させて加圧、
加熱した接続後の要部拡大縦断面図、縦断面図および平
面図であり、図４は、一方のプリント配線板の縦断面図
である。EXAMPLES (Structure) FIGS. 1, 2 and 3 respectively show a printed wiring board which is pressed by an insulating thermosetting resin.
FIG. 4 is an enlarged vertical cross-sectional view, a vertical cross-sectional view and a plan view after heating and connection, and FIG. 4 is a vertical cross-sectional view of one printed wiring board.
【０００９】プリント配線板１はプリント配線基板上に
接続用の配線パターン２を有し、その配線パターン２
は、表面処理により無数の微細な突起３を有している。
２つのプリント配線板１の接続は、配線パターン２同士
が対向するような状態となり、間に絶縁性熱硬化樹脂４
を介在させ、加圧、加熱することにより固定される。ま
た、固定後は、対向する配線パターン２の突起３同士が
接触することにより電気的接続がなされ、絶縁性熱硬化
樹脂４の硬化により機械的接続（固定）がなされてい
る。The printed wiring board 1 has a wiring pattern 2 for connection on a printed wiring board.
Has an infinite number of fine projections 3 by surface treatment.
The connection between the two printed wiring boards 1 is such that the wiring patterns 2 face each other, and the insulating thermosetting resin 4 is interposed between them.
It is fixed by interposing, pressurizing and heating. After the fixing, the protrusions 3 of the wiring patterns 2 facing each other are brought into contact with each other to make an electrical connection, and the insulating thermosetting resin 4 is cured to make a mechanical connection (fixing).
【００１０】（作用）２つのプリント配線板１の接続用
の配線パターン２の間に、絶縁性熱硬化樹脂４を介在さ
せて、加圧することにより、対向する配線パターン２の
突起３同士が接触し、これにより電気的接続が行われ
る。また、同時に加熱することにより、絶縁性熱硬化樹
脂４が硬化し、対向する配線パターン２は機械的接続
（固定）が行われる。(Function) The insulating thermosetting resin 4 is interposed between the wiring patterns 2 for connection between the two printed wiring boards 1 and pressure is applied thereto, so that the protrusions 3 of the opposing wiring patterns 2 come into contact with each other. Then, the electrical connection is made. Further, by heating at the same time, the insulating thermosetting resin 4 is cured, and the opposing wiring patterns 2 are mechanically connected (fixed).
【００１１】（効果）本実施例によれば、接続部の隣り
合う配線パターン２間には、絶縁性熱効果樹脂４しか存
在しないため、微小ピッチの接続ができ、また接続する
配線パターン２間の絶縁信頼性の高いプリント配線板の
接続構造となる。(Effect) According to the present embodiment, since only the insulating thermal effect resin 4 exists between the wiring patterns 2 adjacent to each other in the connection portion, it is possible to make a fine pitch connection, and between the wiring patterns 2 to be connected. The insulation structure has a highly reliable printed wiring board connection structure.
【００１２】なお、本実施例では、微細な突起３を、接
続する２つのプリント配線板１の双方の配線パターン２
に設けたが、２つのプリント配線板１のうち、少なくと
もどちらか一方のプリント配線板１の配線パターン２に
微細な突起３を設けるだけでも本実施例と同様の効果を
得ることができる。In this embodiment, the wiring patterns 2 on both of the two printed wiring boards 1 for connecting the fine protrusions 3 are connected.
However, the same effect as that of the present embodiment can be obtained only by providing the fine protrusions 3 on the wiring pattern 2 of at least one of the two printed wiring boards 1.
【００１３】また、本実施例では、プリント配線板１同
士を固定するのに絶縁性熱効果樹脂４を用いたが、本発
明はかかる実施例に限定されるものではなく、絶縁性を
有し、かつプリント配線板１同士を確実に固定するとと
もに、一方のプリント配線板１の配線パターン２に設け
られた突起３を、他方のプリント配線板１の配線パター
ン２または配線パターン２に設けられた突起３と接触さ
せて互いを電気的に接続させることができるものであれ
ば、いずれの樹脂を用いてもよい。Further, in this embodiment, the insulating heat-effect resin 4 is used to fix the printed wiring boards 1 to each other, but the present invention is not limited to such an embodiment and has an insulating property. Further, the printed wiring boards 1 are securely fixed to each other, and the protrusions 3 provided on the wiring pattern 2 of the one printed wiring board 1 are provided on the wiring pattern 2 or the wiring pattern 2 of the other printed wiring board 1. Any resin may be used as long as it can be brought into contact with the protrusions 3 and electrically connected to each other.
【００１４】[0014]
【発明の効果】以上のように、本発明のプリント配線板
の接続構造によれば、接続部の隣り合う配線パターン間
には従来のように金属粒子が存在しないため、微小ピッ
チの接続ができ、また接続する配線パターン間の絶縁信
頼性が高くなる。As described above, according to the printed wiring board connection structure of the present invention, since there is no metal particle between the adjacent wiring patterns of the connection portion as in the conventional case, fine pitch connection can be achieved. In addition, the insulation reliability between the connected wiring patterns is increased.
【図１】本発明の実施例においてプリント配線板を絶縁
性熱硬化樹脂を介在させて加圧、加熱した接続後の要部
拡大縦断面図である。FIG. 1 is an enlarged vertical cross-sectional view of a main part after connection of a printed wiring board, which is pressurized and heated with an insulating thermosetting resin interposed, in an example of the present invention.
【図２】同実施例においてプリント配線板を絶縁性熱硬
化樹脂を介在させて加圧、加熱した接続後の縦断面図で
ある。FIG. 2 is a vertical cross-sectional view after connection in which a printed wiring board is pressed and heated with an insulating thermosetting resin interposed in the same example.
【図３】同実施例においてプリント配線板を絶縁性熱硬
化樹脂を介在させて加圧、加熱した接続後の平面図であ
る。FIG. 3 is a plan view after connection in which the printed wiring board is pressurized and heated with an insulating thermosetting resin interposed in the same example.
【図４】同実施例の一方のプリント配線板の縦断面図で
ある。FIG. 4 is a vertical cross-sectional view of one printed wiring board of the example.
【図５】従来のプリント配線板の接続構造を示す縦断面
図である。FIG. 5 is a vertical cross-sectional view showing a conventional printed wiring board connection structure.
１ プリント配線板 ２ 配線パターン ３ 突起 ４ 絶縁性熱硬化樹脂 1 Printed wiring board 2 Wiring pattern 3 Protrusion 4 Insulating thermosetting resin
Claims (1)
上記プリント配線板に設けられた配線パターン同士を電
気的に接続するプリント配線板の接続構造において、少
なくともどちらか一方のプリント配線板の配線パターン
表面に微細な凹凸パターンを形成して配線パターン同士
を電気的に接続したことを特徴とするプリント配線板の
接続構造。1. A printed wiring board is fixed to each other with resin,
In the connection structure of the printed wiring board for electrically connecting the wiring patterns provided on the printed wiring board, a fine uneven pattern is formed on the surface of the wiring pattern of at least one of the printed wiring boards to form the wiring patterns. A printed wiring board connection structure characterized by being electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25903892A JP3255723B2 (en) | 1992-09-02 | 1992-09-02 | Connection structure of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25903892A JP3255723B2 (en) | 1992-09-02 | 1992-09-02 | Connection structure of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0685422A true JPH0685422A (en) | 1994-03-25 |
| JP3255723B2 JP3255723B2 (en) | 2002-02-12 |
Family
ID=17328475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25903892A Expired - Fee Related JP3255723B2 (en) | 1992-09-02 | 1992-09-02 | Connection structure of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3255723B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036647A (en) * | 1998-07-21 | 2000-02-02 | Hitachi Chem Co Ltd | Printed wiring board, its manufacture and manufacture of assembled body using the same |
| US20120257343A1 (en) * | 2011-04-08 | 2012-10-11 | Endicott Interconnect Technologies, Inc. | Conductive metal micro-pillars for enhanced electrical interconnection |
-
1992
- 1992-09-02 JP JP25903892A patent/JP3255723B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036647A (en) * | 1998-07-21 | 2000-02-02 | Hitachi Chem Co Ltd | Printed wiring board, its manufacture and manufacture of assembled body using the same |
| US20120257343A1 (en) * | 2011-04-08 | 2012-10-11 | Endicott Interconnect Technologies, Inc. | Conductive metal micro-pillars for enhanced electrical interconnection |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3255723B2 (en) | 2002-02-12 |
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