JPH0317656U - - Google Patents

Info

Publication number
JPH0317656U
JPH0317656U JP1989078044U JP7804489U JPH0317656U JP H0317656 U JPH0317656 U JP H0317656U JP 1989078044 U JP1989078044 U JP 1989078044U JP 7804489 U JP7804489 U JP 7804489U JP H0317656 U JPH0317656 U JP H0317656U
Authority
JP
Japan
Prior art keywords
led chip
chip array
conductive pattern
transparent
electrode film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989078044U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989078044U priority Critical patent/JPH0317656U/ja
Publication of JPH0317656U publication Critical patent/JPH0317656U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1989078044U 1989-06-30 1989-06-30 Pending JPH0317656U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989078044U JPH0317656U (fr) 1989-06-30 1989-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989078044U JPH0317656U (fr) 1989-06-30 1989-06-30

Publications (1)

Publication Number Publication Date
JPH0317656U true JPH0317656U (fr) 1991-02-21

Family

ID=31620975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989078044U Pending JPH0317656U (fr) 1989-06-30 1989-06-30

Country Status (1)

Country Link
JP (1) JPH0317656U (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078171A (ja) * 2001-09-03 2003-03-14 Sony Corp 配線及びその形成方法、接続孔及びその形成方法、配線形成体及びその形成方法、表示素子及びその形成方法、画像表示装置及びその製造方法
WO2004077578A2 (fr) * 2003-02-28 2004-09-10 Osram Opto Semiconductors Gmbh Module d'eclairage et procede de fabrication
JP2008515208A (ja) * 2004-09-30 2008-05-08 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ワイヤレス式のコンタクトを有するオプトエレクトロニクス素子
JP2015109331A (ja) * 2013-12-04 2015-06-11 シャープ株式会社 窒化物半導体発光装置
JP2016181502A (ja) * 2015-03-23 2016-10-13 ヒュンダイ・モービス・カンパニー・リミテッド 照明装置
KR101847447B1 (ko) * 2017-11-23 2018-04-10 류양석 버클
JP2021068920A (ja) * 2021-02-02 2021-04-30 富士ゼロックス株式会社 発光素子アレイ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5689780A (en) * 1979-12-22 1981-07-21 Fujitsu Ltd Production of lighttemittinggdiode display panel
JPS5752073A (en) * 1980-09-16 1982-03-27 Tokyo Shibaura Electric Co Method of producing display unit
JPS5850582A (ja) * 1981-09-22 1983-03-25 株式会社東芝 発光ダイオ−ドを用いたデイスプレイ装置
JPS58140782A (ja) * 1982-02-16 1983-08-20 株式会社東芝 発光表示装置
JPS63164482A (ja) * 1986-12-26 1988-07-07 Res Dev Corp Of Japan 発光ダイオ−ド装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5689780A (en) * 1979-12-22 1981-07-21 Fujitsu Ltd Production of lighttemittinggdiode display panel
JPS5752073A (en) * 1980-09-16 1982-03-27 Tokyo Shibaura Electric Co Method of producing display unit
JPS5850582A (ja) * 1981-09-22 1983-03-25 株式会社東芝 発光ダイオ−ドを用いたデイスプレイ装置
JPS58140782A (ja) * 1982-02-16 1983-08-20 株式会社東芝 発光表示装置
JPS63164482A (ja) * 1986-12-26 1988-07-07 Res Dev Corp Of Japan 発光ダイオ−ド装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078171A (ja) * 2001-09-03 2003-03-14 Sony Corp 配線及びその形成方法、接続孔及びその形成方法、配線形成体及びその形成方法、表示素子及びその形成方法、画像表示装置及びその製造方法
WO2004077578A2 (fr) * 2003-02-28 2004-09-10 Osram Opto Semiconductors Gmbh Module d'eclairage et procede de fabrication
WO2004077578A3 (fr) * 2003-02-28 2005-07-21 Osram Opto Semiconductors Gmbh Module d'eclairage et procede de fabrication
US7560741B2 (en) 2003-02-28 2009-07-14 Osram Opto Semiconductors Gmbh Lighting module and method for the production thereof
JP2008515208A (ja) * 2004-09-30 2008-05-08 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ワイヤレス式のコンタクトを有するオプトエレクトロニクス素子
JP2015109331A (ja) * 2013-12-04 2015-06-11 シャープ株式会社 窒化物半導体発光装置
JP2016181502A (ja) * 2015-03-23 2016-10-13 ヒュンダイ・モービス・カンパニー・リミテッド 照明装置
KR101847447B1 (ko) * 2017-11-23 2018-04-10 류양석 버클
JP2021068920A (ja) * 2021-02-02 2021-04-30 富士ゼロックス株式会社 発光素子アレイ

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