JPS5752073A - Method of producing display unit - Google Patents

Method of producing display unit

Info

Publication number
JPS5752073A
JPS5752073A JP12718180A JP12718180A JPS5752073A JP S5752073 A JPS5752073 A JP S5752073A JP 12718180 A JP12718180 A JP 12718180A JP 12718180 A JP12718180 A JP 12718180A JP S5752073 A JPS5752073 A JP S5752073A
Authority
JP
Japan
Prior art keywords
display unit
producing display
producing
unit
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12718180A
Other languages
Japanese (ja)
Inventor
Tetsuo Sadamasa
Osamu Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP12718180A priority Critical patent/JPS5752073A/en
Publication of JPS5752073A publication Critical patent/JPS5752073A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP12718180A 1980-09-16 1980-09-16 Method of producing display unit Pending JPS5752073A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12718180A JPS5752073A (en) 1980-09-16 1980-09-16 Method of producing display unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12718180A JPS5752073A (en) 1980-09-16 1980-09-16 Method of producing display unit

Publications (1)

Publication Number Publication Date
JPS5752073A true JPS5752073A (en) 1982-03-27

Family

ID=14953672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12718180A Pending JPS5752073A (en) 1980-09-16 1980-09-16 Method of producing display unit

Country Status (1)

Country Link
JP (1) JPS5752073A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0317656U (en) * 1989-06-30 1991-02-21
JPH04111768U (en) * 1991-03-14 1992-09-29 株式会社小糸製作所 Mold structure of modular type LED
WO2002073706A1 (en) * 2001-03-09 2002-09-19 Sony Corporation Display apparatus and its manufacturing method
US6734030B2 (en) 2001-03-06 2004-05-11 Sony Corporation Semiconductor light emitting device and method of fabricating semiconductor light emitting device
US6828591B2 (en) 2000-12-15 2004-12-07 Sony Corporation Semiconductor light emitting device and fabrication method thereof
US6831300B2 (en) 2001-02-21 2004-12-14 Sony Corporation Semiconductor light emitting device, manufacturing method of a semiconductor light emitting device and connection structure of an electrode layer
US6830946B2 (en) 2001-02-01 2004-12-14 Sony Corporation Device transfer method and panel
US6870190B2 (en) 2001-03-06 2005-03-22 Sony Corporation Display unit and semiconductor light emitting device
US6924500B2 (en) 2000-07-18 2005-08-02 Sony Corporation Semiconductor light-emitting device and process for producing the same
US7250320B2 (en) 2003-03-20 2007-07-31 Sony Corporation Semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, image display device, manufacturing method thereof, illuminating device and manufacturing method thereof
JP2018528601A (en) * 2015-06-24 2018-09-27 イーラックス・インコーポレイテッドｅＬｕｘ Ｉｎｃ． Light emitting device and fluid production thereof

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0317656U (en) * 1989-06-30 1991-02-21
JPH04111768U (en) * 1991-03-14 1992-09-29 株式会社小糸製作所 Mold structure of modular type LED
US7221001B2 (en) 2000-07-18 2007-05-22 Sony Corporation Semiconductor light-emitting device and process for producing the same
US6924500B2 (en) 2000-07-18 2005-08-02 Sony Corporation Semiconductor light-emitting device and process for producing the same
US6828591B2 (en) 2000-12-15 2004-12-07 Sony Corporation Semiconductor light emitting device and fabrication method thereof
US6830946B2 (en) 2001-02-01 2004-12-14 Sony Corporation Device transfer method and panel
US6921675B2 (en) 2001-02-01 2005-07-26 Sony Corporation Device transfer method and panel
US7233030B2 (en) 2001-02-01 2007-06-19 Sony Corporation Device transfer method and panel
US6831300B2 (en) 2001-02-21 2004-12-14 Sony Corporation Semiconductor light emitting device, manufacturing method of a semiconductor light emitting device and connection structure of an electrode layer
US6734030B2 (en) 2001-03-06 2004-05-11 Sony Corporation Semiconductor light emitting device and method of fabricating semiconductor light emitting device
US6870190B2 (en) 2001-03-06 2005-03-22 Sony Corporation Display unit and semiconductor light emitting device
US6773943B2 (en) * 2001-03-09 2004-08-10 Sony Corporation Display unit and method of fabricating the same
JP2002270898A (en) * 2001-03-09 2002-09-20 Sony Corp Display device and its manufacturing method
WO2002073706A1 (en) * 2001-03-09 2002-09-19 Sony Corporation Display apparatus and its manufacturing method
CN100358153C (en) * 2001-03-09 2007-12-26 索尼公司 Display device and its manufacturing method
US7250320B2 (en) 2003-03-20 2007-07-31 Sony Corporation Semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, image display device, manufacturing method thereof, illuminating device and manufacturing method thereof
JP2018528601A (en) * 2015-06-24 2018-09-27 イーラックス・インコーポレイテッドｅＬｕｘ Ｉｎｃ． Light emitting device and fluid production thereof

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