JPS61153374U - - Google Patents
Info
- Publication number
- JPS61153374U JPS61153374U JP1985036431U JP3643185U JPS61153374U JP S61153374 U JPS61153374 U JP S61153374U JP 1985036431 U JP1985036431 U JP 1985036431U JP 3643185 U JP3643185 U JP 3643185U JP S61153374 U JPS61153374 U JP S61153374U
- Authority
- JP
- Japan
- Prior art keywords
- flip
- mounting
- chip semiconductor
- electrode
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985036431U JPS61153374U (fr) | 1985-03-14 | 1985-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985036431U JPS61153374U (fr) | 1985-03-14 | 1985-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61153374U true JPS61153374U (fr) | 1986-09-22 |
Family
ID=30541603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985036431U Pending JPS61153374U (fr) | 1985-03-14 | 1985-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61153374U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0272642A (ja) * | 1988-09-07 | 1990-03-12 | Nec Corp | 基板の接続構造および接続方法 |
-
1985
- 1985-03-14 JP JP1985036431U patent/JPS61153374U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0272642A (ja) * | 1988-09-07 | 1990-03-12 | Nec Corp | 基板の接続構造および接続方法 |