JPH0317621B2 - - Google Patents

Info

Publication number
JPH0317621B2
JPH0317621B2 JP55150110A JP15011080A JPH0317621B2 JP H0317621 B2 JPH0317621 B2 JP H0317621B2 JP 55150110 A JP55150110 A JP 55150110A JP 15011080 A JP15011080 A JP 15011080A JP H0317621 B2 JPH0317621 B2 JP H0317621B2
Authority
JP
Japan
Prior art keywords
temperature
surface plate
cooling water
detection element
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP55150110A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5775776A (en
Inventor
Hatsuyuki Arai
Seiichi Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam Corp
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Corp filed Critical Speedfam Corp
Priority to JP55150110A priority Critical patent/JPS5775776A/ja
Publication of JPS5775776A publication Critical patent/JPS5775776A/ja
Publication of JPH0317621B2 publication Critical patent/JPH0317621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP55150110A 1980-10-28 1980-10-28 Temperature detector and controller of polishing machine Granted JPS5775776A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55150110A JPS5775776A (en) 1980-10-28 1980-10-28 Temperature detector and controller of polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55150110A JPS5775776A (en) 1980-10-28 1980-10-28 Temperature detector and controller of polishing machine

Publications (2)

Publication Number Publication Date
JPS5775776A JPS5775776A (en) 1982-05-12
JPH0317621B2 true JPH0317621B2 (cg-RX-API-DMAC7.html) 1991-03-08

Family

ID=15489700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55150110A Granted JPS5775776A (en) 1980-10-28 1980-10-28 Temperature detector and controller of polishing machine

Country Status (1)

Country Link
JP (1) JPS5775776A (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840265A (ja) * 1981-08-28 1983-03-09 Toshiba Corp 両面ポリシング装置
JPS6056460U (ja) * 1983-09-27 1985-04-19 株式会社東芝 研磨装置
JPH0659624B2 (ja) * 1985-05-17 1994-08-10 株式会社日立製作所 研磨装置
JP2810489B2 (ja) * 1990-05-30 1998-10-15 株式会社ノリタケカンパニーリミテド 砥石車
JP4890697B2 (ja) * 2001-09-05 2012-03-07 株式会社ディスコ 研磨装置
IT201900000777A1 (it) * 2019-01-18 2020-07-18 S I A P I Soc Importazione Approvvigionamenti Prodotti Industriali S R L Mola per la lavorazione superficiale di pezzi e apparecchiatura utensile utilizzante detta mola

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131181A (cg-RX-API-DMAC7.html) * 1973-04-20 1974-12-16
JPS5454390A (en) * 1977-10-08 1979-04-28 Shibayama Kikai Kk Cooling water temperature control system for polishing table

Also Published As

Publication number Publication date
JPS5775776A (en) 1982-05-12

Similar Documents

Publication Publication Date Title
US6776692B1 (en) Closed-loop control of wafer polishing in a chemical mechanical polishing system
US9999956B2 (en) Polishing device and polishing method
US7101258B2 (en) Double sided polishing machine
US5486129A (en) System and method for real-time control of semiconductor a wafer polishing, and a polishing head
US6464560B2 (en) System for real-time control of semiconductor wafer polishing
US5762537A (en) System for real-time control of semiconductor wafer polishing including heater
US5643048A (en) Endpoint regulator and method for regulating a change in wafer thickness in chemical-mechanical planarization of semiconductor wafers
KR970077291A (ko) 연동기능을 구비한 폴리싱 장치
US6402589B1 (en) Wafer grinder and method of detecting grinding amount
JP2530958B2 (ja) リング、特にロ―ラベアリングレ―スの精密研磨方法及び装置
JPH0317621B2 (cg-RX-API-DMAC7.html)
US7040955B1 (en) Chemical-mechanical planarization tool force calibration method and system
JP3045232B2 (ja) ウェーハ研磨装置及び研磨量検出方法
JPH0659623B2 (ja) ウェハのメカノケミカルポリシング加工方法および装置
KR101972868B1 (ko) 다중 센서를 구비한 양면 랩그라인딩 장치의 연마량 제어 장치
JP2002307303A (ja) 薄板円板状ワークの両面研削方法および装置
JPH08330259A (ja) 半導体ウェハの研磨方法
US3945297A (en) Machine tool spindle calibration method and apparatus
JP2000006002A (ja) ポリッシング装置
JPH09193003A (ja) 研磨装置
US3827293A (en) Machine tool spindle calibration method and apparatus
KR20240152977A (ko) 화학적 기계적 연마 보정 툴
JPH0398761A (ja) 研削盤の研削寸法制御方法およびその装置
CN110948378A (zh) 研磨装置及研磨方法
JPH1148135A (ja) 研磨装置および研磨方法