JPH03174797A - Substrate clamping apparatus - Google Patents

Abstract

PURPOSE:To maintain the turning force of a clamping plate by providing an elastic material for energizing the clamping plate in the direction for opening the lower part of the clamping plate between the upper part of the clamping plate, which is supported with a back plate provided at the lower part of a supporting plate so that the clamping plate can be turned, and the supporting plate. CONSTITUTION:This apparatus comprises a recess-shaped back plate 4 which is provided at the lower part of a supporting plate 3, a clamping plate 2 which is supported with the back plate 4 so that the clamping plate can be turned and a wedge 5 which is inserted between the back surface of the clamping plate 2 and the supporting plate 3. An elastic material 1 for energizing the clamping plate in the direction for opening a lower end contact part 21 of the clamping plate 2 is provided between the upper part of the clamping plate 2 and the supporting plate 3. The elastic material 1 comprises a semi-bow shaped leaf spring. The upper end part is fixed to the supporting plate 3, and the lower end part is brought into contact with the clamping plate 2. The clamping plate is energized in the direction for opening the lower-end contact part 21. Thus, the turning force of the clamping plate can be maintained without decreasing the energizing force of the elastic material.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a board clamping device for clamping and soldering a board such as a printed wiring board.

[Prior Art] Generally, when soldering a printed wiring board, a pretreatment process is first performed in which a flux or the like is applied to the part of the board to be soldered. after that.

The substrate is immersed in a solder bath. As a result, the solder adheres to the portion to be soldered, and the soldering work is completed.

By the way, when the above-mentioned board is immersed in a flux tank or a solder bath, use a gripping means such as a clamp.

It is necessary to grasp the board.

Conventionally, soldering is performed by sandwiching a board 6 between a clamp plate 2 and a back plate 4, as shown in FIGS. 8 to 11. This is done using a clamp device.

The clamp device is inserted between a back plate 4 provided below the support plate 3, a clamp plate 2 rotatably supported by the back plate 4, and the back surface of the clamp plate 2 and the support plate 3. It becomes wedge 5.

Also, on the left side of FIG. 8, the back plate 4 is attached to the support plate 3.
．． Clamp plate 2. A wedge 5 is provided.

The substrate 6 is sandwiched between the pair of back plates and the like provided on one support plate 3.

The clamp plate 2 is rotated using the biasing force of the spring 9. Here, the spring 9
7 As shown in FIGS. 8 and 10, the lower end contact portion 21 of the clamp plate 2 is biased by torsional rotational force so as to open in the F direction.

As shown in FIG. 10, by inserting the fitting part 51 of the wedge 5 from the direction G between the back surface of the clamp plate 2 and the support plate 3 using an air cylinder (not shown), the clamp plate The lower end abutting portion 21 of is pushed in the direction of the tip receiving portion 41 of the back plate 41.

Therefore, as shown in FIG.
is pinched by a force acting from the L direction.

That is, the fitting portion 51 of the wedge 5 is inserted into the upper end portion 23 of the clamp plate 2, and a force is applied to the clamp plate 2 to push it outward. As a result, a force acts on the lower end contact portion 21 in a direction that presses the substrate 6.

Then, with the substrate 6 sandwiched between them, as shown in FIG. 11, the entire structure is lowered and the substrate 6 is immersed in molten solder to perform soldering.

On the other hand, after soldering is finished, the whole thing is raised up.

As shown in FIG. 10, the wedge 5 is raised upward in the H direction. As a result, the clamp plate 2 is rotated by the biasing force of the spring 9 using the rotation wheel portion 20 as a fulcrum, and the lower end contact portion 21 is pushed forward in the F direction. Therefore, the space between the lower end abutting portion 21 and the tip receiving portion 41 is opened, and the substrates become removable.

(Issue to be solved) However, the above-mentioned conventional technology has a first-order problem.

That is, the soldering operation is carried out by dipping the board 6, which is clamped by a clamping device, into molten solder 8 in a solder bath, as shown in FIG.

However, when the substrate 6 is immersed, the solution 8 of the molten solder 8 scatters and adheres to the spring 9. Further, the smearing of the melting rate Ell18 is particularly noticeable when compressed air is blown onto the surface of the substrate 6 in order to remove excess molten solder 8 after the substrate 6 is lifted out of the solder bath. Therefore.

The spring 9 loses its biasing force due to the adhesion of solder.
The rotation of the clamp plate 2 becomes insufficient.

As a result, the force with which the clamp device holds the board 6 is reduced, and the clamp device cannot be used for soldering work.

The present invention has been made in view of such conventional problems, and allows the rotational force of the clamp plate to be maintained. The present invention aims to provide a two-plate clamping device.

(Means for solving problems) The present invention includes a concave back plate provided below a support plate.

It consists of a clamp plate rotatably supported by the back plate, and a wedge inserted between the clamp plate and the support plate, and a board such as a printed wiring board between the lower side of the clamp plate and the back plate. In the circuit board clamping device for clamping and soldering, an elastic member is provided between the upper part of the clamp plate and the support plate to bias the lower part of the clamp plate in the direction of opening. The main feature is the board clamping device.

The most noteworthy feature of the present invention is that an elastic member is provided between the upper part of the clamp plate and the support plate to bias the clamp plate in the direction of opening.

The above-mentioned "two sides" of the clamp plate means 1, for example, above the rotating shaft portion of the clamp plate.

Examples of the above-mentioned elastic materials include plate springs (see the first and second embodiments, FIGS. 1 and 4) and double springs (the third embodiment, see FIG. 7).

Examples of the substrate include a printed wiring board, a lead frame, and a chip carrier.

Further, the clamp plate is attached to the back plate so as to be rotatable about the rotation shaft. The back plate has a concave shape, and the substrate is clamped between the clamp plate and the back plate.

[Action and effect]

In the substrate clamping device according to the present invention.

An elastic member is provided between the upper part of the clamp plate and the support plate to bias the clamp plate in the direction of opening.

Therefore, even if the lower part of the clamp plate and the substrate are immersed in the molten solder bath, the molten solder solution will not scatter and land on the bullet hole. Further, even when excess molten solder on the substrate is removed by compressed air, the molten solder does not fly to the above-mentioned elastic material.

In addition, even if solder adheres to the above-mentioned bullet material and the biasing force decreases due to long-term use, the second bullet material can be easily replaced, and the second bullet material can be easily cleaned and restored. can.

However, since a spring is conventionally provided on the rotating shaft portion of the clamp plate, the above-mentioned replacement and cleaning are not easy.

Therefore, according to the present invention, the rotational force of the clamp plate can be maintained without reducing the biasing force of the second projectile. A device for clamping a substrate can be provided.

〔Example〕

First Embodiment A clamping device according to this embodiment will be explained with reference to FIGS. 1 to 3.

That is, as shown in FIG. 1, the two clamp devices include a concave back plate 4 provided below a support plate 3, and a clamp plate 2 rotatably supported by the back plate 4.

It consists of a wedge 5 inserted between the back surface of the clamp plate 2 and the support plate 3.

A resilient member 1 is provided between the upper part of the clamp plate 2 and the support plate 3 for biasing the lower end contact portion 21 of the clamp plate 2 in the opening direction.

As shown in FIGS. 1 and 2, the elastic material 1 is made of a semi-arched leaf spring. The elastic material 1 is attached to the support plate 3 by screws 10 at its upper end. The attachment is fixed.As shown in FIG. to energize.

The clamp plate 2 is made of a substantially rectangular titanium plate. The clamp plate 2 has a rotating shaft portion 2 at the center.
has 0.

The support plate 3 is a substantially rectangular plate-shaped stainless steel plate (S
US304). The support plate 3 is.

As shown in FIG. 1, it has a locking plate 31 at the upper center for hanging it on the robot. Further, the support plate 3 has a substantially concave-shaped back plate 4 (not shown in FIG. 3) below.

As shown in FIG. 3, the back plate 4 is made of a titanium plate and has a pair of locking plates 40 at both ends.

The locking plate 40 has a locking hole 401 into which the rotating shaft portion 20 of the clamp plate 2 is fitted. Further, the back plate 4 has a tip receiving portion 41 at the lower part.

Further, the support plate 3 has an aluminum wedge 5 that moves up and down approximately in the center. The wedge 5 has a fitting part 51 made of stainless steel at its tip.

The fitting portion 5I has a substantially triangular shape and has a sharp tip portion 511 inserted between the back surface of the clamp plate 2 and the support plate 3. The wedge 5 has a vertically movable connecting portion 52 connected to an air cylinder (not shown) on the upper side.

Next, each action and effect will be explained.

First, before the substrates are clamped, as shown in FIG.
is urged in the direction of the support plate 3.

Therefore, the space between the lower end contact portion 21 and the tip receiving portion 41 is in an open state.

Next, when using the clamp device of the seventh example, as shown in FIG. 1, the wedge 5 is first moved downward P by an air cylinder. Due to this.

The space between the clamp plate 2 and the back plate 4 is closed, and a substrate 6 such as a printed wiring board is sandwiched between the two.

That is, the wedge 5 is inserted between the back surface of the upper end 23 of the clamp plate 2 and the lower end 32 of the support plate 3. As a result, a force acting in the forward R direction is applied to the upper end portion 23 of the clamp plate 2, as shown in FIG. 2, against the biasing force of the resilient member 1.

Thus, a force S is applied to the clamp plate 2, which presses the lower end contact portion 21 on the opposite side toward the substrate 6 with the first rotation shaft portion 20 as the center. Thereby, the substrate 6 is sandwiched between the lower end contact portion 2I and the tip receiving portion 41. Next, the substrate 6 is immersed in molten solder 8 (see FIG. 11) in a solder bath. As a result, the board 6 is soldered.

As mentioned above, in the two examples of board clamping devices, 9
A resilient member 1 is provided between the upper end portion 23 of the clamp plate 2 and the support plate 3 and urges the clamp plate 2 in a direction to open the lower part thereof.
has been established. Therefore, the molten solder 8 does not scatter or adhere to the resilient material 1.

Therefore, according to the present example, it is possible to obtain a substrate clamping device that can maintain the rotational force of the clamp plate 2 for a long period of time. In addition, the 5th bullet I is in the shape of a plate,
Since it is only attached to the support plate 3, its attachment and cleaning are extremely easy.

Second Embodiment A clamping device according to this embodiment will be explained with reference to FIGS. 4 and 5.

That is, the clamp devices of the two examples are those in which a notch 22 is provided in the upper end portion 23 of the clamp plate 2 in the first example. The other configurations were the same as those in the first embodiment described in -h.

As shown in FIGS. 4 and 5, the cutout portion 22 is formed so that the tip abutting portion 11 of one bullet l is connected to the tip portion 2 of the clamp plate 2.
3, and has a depth approximately the same as that of the elastic material 1.

Therefore, the tip abutting portion 11 stably abuts against the clamp plate 2 and does not protrude beyond the notch 22.

Therefore, according to this embodiment, in addition to the effects of the first embodiment, it is possible to obtain a clamping device in which the first bullet (2) is stably engaged with the upper end portion of the clamp plate 2.

Third Embodiment A clamping device according to this embodiment will be explained with reference to FIGS. 6 and 7.

That is, in the clamp device of this example, two bullets 12 are used in place of the bullet l in the first embodiment. The other configurations were the same as those of the first embodiment.

In other words, the resilient material 12 includes a spring 121 and a spring pressing plate 122. The spring 121
One end is attached to the upper end portion 23 of the clamp plate 2, and the other end is disposed in contact with the end back surface portion 123 of the spring pressing plate 122. Further, the spring pressing plate 122 has a substantially oval shape as shown in FIG. 6, and its base 124 is fixed to the back plate 4. As shown in FIG.

Thus, in one example of the clamp device, the spring 121 pushes the tip end 23 of the clamp plate 2 toward the support plate 3, and biases the lower end abutting portion 21 of the clamp plate 2 in the direction of opening.

According to this example, effects similar to those of the first example can be obtained.

[Brief explanation of drawings]

1 to 3 show a clamp device according to a first embodiment, FIG. 1 is a perspective view thereof, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. 3 is a back plate. 5. FIGS. 4 and 5 show a clamp device according to the second embodiment, FIG. 4 is a perspective view thereof, FIG. 5 is a sectional view taken along line B-B in FIG. 7 and 7 show a clamping device according to the second to third embodiments, FIG. 6 is a perspective view thereof, FIG. 7 is a sectional view taken along line C-C in FIG. 6, and FIGS.
Fig. 11 shows a conventional clamping device, Fig. 8 is a perspective view thereof, Fig. 9 is a perspective view showing how the spring is installed, and Fig. 10 is a sectional view taken along the line D-D in Fig. 8. , FIG. 11 is an explanatory diagram of the use of the clamp device. 1.12. ,, Resilient material 2... Clamp plate 21... Lower end contact portion. 22,,,notch part. 3.6. base plate

Claims (1)

[Scope of Claims] The above-mentioned device comprises a back plate provided below the support plate, a clamp plate rotatably supported by the back plate, and a wedge inserted between the clamp plate and the support plate. In a circuit board clamping device that clamps and solders a board such as a printed wiring board between the lower part of the clamp plate and the back plate, the clamp plate is connected between the upper part of the clamp plate and the support plate. A clamping device for a circuit board, characterized in that it is provided with an elastic member that biases the lower part in the direction of opening.