JPH0317377B2 - - Google Patents

Info

Publication number
JPH0317377B2
JPH0317377B2 JP61281897A JP28189786A JPH0317377B2 JP H0317377 B2 JPH0317377 B2 JP H0317377B2 JP 61281897 A JP61281897 A JP 61281897A JP 28189786 A JP28189786 A JP 28189786A JP H0317377 B2 JPH0317377 B2 JP H0317377B2
Authority
JP
Japan
Prior art keywords
discharge
wire
ball
ball diameter
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61281897A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63136640A (ja
Inventor
Hiroshi Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Seiki Co Ltd filed Critical Toshiba Seiki Co Ltd
Priority to JP61281897A priority Critical patent/JPS63136640A/ja
Publication of JPS63136640A publication Critical patent/JPS63136640A/ja
Publication of JPH0317377B2 publication Critical patent/JPH0317377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP61281897A 1986-11-28 1986-11-28 ワイヤボンデイング用のボ−ル形成装置 Granted JPS63136640A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61281897A JPS63136640A (ja) 1986-11-28 1986-11-28 ワイヤボンデイング用のボ−ル形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61281897A JPS63136640A (ja) 1986-11-28 1986-11-28 ワイヤボンデイング用のボ−ル形成装置

Publications (2)

Publication Number Publication Date
JPS63136640A JPS63136640A (ja) 1988-06-08
JPH0317377B2 true JPH0317377B2 (ko) 1991-03-07

Family

ID=17645480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61281897A Granted JPS63136640A (ja) 1986-11-28 1986-11-28 ワイヤボンデイング用のボ−ル形成装置

Country Status (1)

Country Link
JP (1) JPS63136640A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015122411A1 (ja) * 2014-02-17 2015-08-20 株式会社新川 放電検査装置、ワイヤボンディング装置、および放電検査方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383355A (ja) * 1989-08-28 1991-04-09 Marine Instr Co Ltd 半導体ワイヤボンダーにおけるワイヤ切れ検知装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015122411A1 (ja) * 2014-02-17 2015-08-20 株式会社新川 放電検査装置、ワイヤボンディング装置、および放電検査方法
JPWO2015122411A1 (ja) * 2014-02-17 2017-03-30 株式会社新川 放電検査装置、ワイヤボンディング装置、および放電検査方法
US10607959B2 (en) 2014-02-17 2020-03-31 Shinkawa Ltd. Discharge examination device, wire-bonding apparatus, and discharge examination method

Also Published As

Publication number Publication date
JPS63136640A (ja) 1988-06-08

Similar Documents

Publication Publication Date Title
US9421626B2 (en) Apparatus and method for electrical discharge machining modulation control
US5463197A (en) Apparatus and method for forming wire bonding ball
JPH04346448A (ja) ワイヤボンダ用ボール形成装置
JPH07106365A (ja) ワイヤボンダのワイヤ尾部長さを監視する装置および方法
US5212361A (en) Method and apparatus for forming balls at the ends of wires
JPH0317377B2 (ko)
US3979672A (en) Transistor testing circuit
US5763849A (en) Wire bonding apparatus
JPH0317376B2 (ko)
US4687897A (en) Flame-off limited circuit for wire bonding ball forming apparatus
JPS5917977B2 (ja) ワイヤボンダ−におけるボ−ル形成方法
JPH0386427A (ja) ワイヤ放電加工機のワイヤ断線防止装置
JP3379904B2 (ja) ワイヤボンディング用のトーチ電源
JP3908380B2 (ja) ワイヤボンディング装置及び該装置を用いた半導体装置の製造方法
JP2005268304A (ja) ボンダ用ボール形成装置およびボンダ用ボール形成方法
JP2534136B2 (ja) ワイヤボンダ―におけるボ―ル形成方法
JP2003326361A (ja) アークスタート性判定方法
JP3253049B2 (ja) ワイヤボンディング装置におけるボール径検出方法及びボール径検出装置
JPS622914B2 (ko)
JP3488156B2 (ja) ワイヤボンディング装置用放電良否判定方法及びその装置
JPH0383355A (ja) 半導体ワイヤボンダーにおけるワイヤ切れ検知装置
JP2611891B2 (ja) ワイヤボンディング装置及びその方法
JPH0210573B2 (ko)
WO2001097256A2 (en) A method of and apparatus for monitoring a ball forming process
JPS594982A (ja) 抵抗溶接用電流制御方法、装置

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees