JPH03173460A - Integrated circuit device and information medium using the same - Google Patents

Abstract

PURPOSE:To increase the precision of plane dimension and thickness dimension, and improve also the reliability for dust and moisture, by stretching the external periphery of sealing resin covering an IC chip as far as the outside of the external periphery of an insulating substrate, sealing a lead part formed here with the stretched resin, and shaping the external form by using a metal mold. CONSTITUTION:On an insulating substrate 2 for mounting an IC chip the following are installed, an introducing part 35 and an injection port 36 for sealing resin, and an exhaust vent 37 for discharging the air in a metal mold, which are positioned on a retaining part 31 of a second surface 6. Sealing resin stretching as far as the outside of the outer periphery end surface of the substrate 2 is made to stretch as far as the end portion rear side of the substrate 2 as shown by a contour line 38. A lower metal mold used in the process is flat, and an upper metal mold is equipped with a cavity part for forming the IC in a specified shape. While the substrate 2 and a masking tape, which is not shown in figure, are pressed with the metal mold, the resin is injected in the metal mold, thereby fixing a plurality of package units on an insulating substrate not shown in figure. In this manner, a terminal pattern constituting an IC is coated while external dimension precision is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an integrated circuit device and an information medium containing a built-in IC chip for processing or storing data and having connection terminals capable of exchanging data with an external device. be.

Conventional Technology An information medium in which an integrated circuit device with a built-in IC chip such as a microcomputer or memory is incorporated into a plastic card or a flat metal plate is disclosed in Japanese Patent Application Laid-Open No. 58-92597.
It is shown in Japanese Utility Model Application No. 61-189379. Compared to conventional magnetic stripe cards, such information media have a larger storage capacity and are superior in terms of confidentiality, so they are being considered for practical use in many fields such as finance, credit, and medical care. It is being As shown in FIG. 7, the integrated circuit device used for these information media has a double-sided board 40 with a terminal pattern 41 used as a connection terminal for connection to an external device on one side and a terminal pattern 41 on the other side. A circuit pattern 42 that is electrically connected through the through hole 43 is formed, an IC chip 44 is mounted on the circuit pattern 42, and the IC chip 44 and the circuit pattern 42 are connected by a thin metal wire.
45 and bonded to the other side of the double-sided substrate 40 with an adhesive 49.
This is a configuration filled with 6.

Problems to be Solved by the Invention However, when manufacturing such an integrated circuit device, terminal patterns 411 and circuit patterns 42 are etched on a double-sided board in which copper foil is laminated on both the front and back sides, and after plating with nickel and gold, The method is to punch out a double-sided board to the desired external dimensions. Therefore, together with the terminal pattern 411 and the circuit pattern 42, it is necessary to form the lead portion 48 by etching for plating these.

Thereafter, when the double-sided board is punched out to the desired external dimensions, the cut end faces of the lead portions 48 are exposed at the end faces of the outer periphery of the double-sided board 40. This is true regardless of whether the lead portion 48 is formed on either the front or back side of the double-sided substrate. Therefore, unless the exposed cut surfaces of the lead portions 48 are covered with some kind of insulating material, the cut end surfaces of the lead portions 48 will also be exposed in the completed integrated circuit device.

If conductive dust adheres to the exposed lead portions 48, the terminal patterns 411 and the circuit patterns 42, which should be separated individually, will be short-circuited and the normal operation of the IC chip 44 will be hindered. Furthermore, in a humid environment, rust may occur from the lead portion 48, and in extreme cases, the plating may be damaged and the terminal pattern 41 may be connected to an external device. Good connection between the IC chip 44 and the circuit pattern 42 will be hindered. In addition to the thickness of the double-sided substrate 40, the thickness of the integrated circuit device is
Sealing frame 47. Since the thickness of the adhesive 49 depends on the thickness of the adhesive 49, increasing the number of components of the integrated circuit device such as the sealing frame 47 not only increases the cost of the integrated circuit device, but also increases the overall cost of the integrated circuit device. The dimensional accuracy of thickness deteriorates. Furthermore, when the sealing frame 47 is glued onto the lead portions 48, if the amount of adhesive 49 is small, the adhesive 49 will not sufficiently wrap around the gaps that separate the lead portions 48, causing the sealing resin 46 to be sealed. When filling the inside of the sealing frame 47, the sealing resin 46 may flow out of the sealing frame 47, or conversely, if the amount of adhesive 49 is too large, the adhesive 49 itself may protrude outside. The flowed out sealing resin 46 and the overflowing adhesive 49 deteriorate the dimensional accuracy of the external shape of the integrated circuit device, and in extreme cases, the adhesive 49 and the sealing resin 46 wrap around the terminal pattern 41 and cause damage to the outside. This will prevent a good connection with the device. In addition, in order to ensure reliability against dust and moisture, if the cut surface of the lead portion 48 is coated with some kind of insulating material, there is a step of coating this insulating material, and then a physical treatment of the coated insulating material. It is necessary to add a step of removing the material by manual polishing. This not only increases the manufacturing cost of the integrated circuit device, but also deteriorates the dimensional accuracy of the external shape of the integrated circuit device. Similarly, information media in which such conventional integrated circuit devices are incorporated into plastic cards or flat metal plates suffer from deterioration in reliability against dust and moisture, as well as dimensional accuracy of their external shapes, as well as reduction in manufacturing costs. There are limits to

In view of the above-mentioned problems, an object of the present invention is to improve the reliability against moisture and dust of an integrated circuit device and an information medium incorporating this integrated circuit device, and improve the dimensional accuracy of its external shape, as well as improve its manufacturing efficiency. The goal is to reduce costs.

Means for Solving the Problems In order to solve the above problems, the integrated circuit device of the present invention has a first terminal pattern used as a connection terminal with an external device.
a flat insulating substrate formed on a second surface thereof and having a circuit pattern electrically connected to the terminal pattern formed on a second surface;
An IC chip mounted on the second surface of the insulating substrate and electrically connected to the circuit pattern by a connecting body, and a sealing resin covering the IC chip on the second surface of the insulating substrate. , the outer circumferential portion of the sealing resin extends outward from the outer circumference of the insulating substrate, and this extended portion covers the outer circumferential end surface of the insulating substrate, and the outer circumferential end surface of the insulating substrate is covered with the sealing resin. It is a structure that has entered into. Also,
The information medium of the present invention has a structure in which the integrated circuit device is embedded in a first recess formed in a flat metal base with the second surface of the insulating substrate facing downward.

In order to cover the end face of the outer periphery of the insulating substrate with the sealing resin, the lead part for plating the terminal pattern and circuit pattern is protected inside the sealing resin, and the integrated It is not exposed to the outside of the circuit device. Therefore, dust does not directly adhere to the lead parts, and the IC chips built into the integrated circuit device operate stably.Also, even in humid environments, the lead parts, plated terminal patterns, and circuit The pattern does not rust, and the IC chip and external device are well connected. When covering an IC chip with a sealing resin, the upper and lower molds having a predetermined shaped cavity are brought into close contact with each other on the outside of the end face of the outer periphery of the insulating substrate, and the sealing is carried out inside the upper and lower molds. Filled with stopper resin. For this reason, there is no need to use a sealing frame as in the conventional case, and the thickness and planar dimensions of the integrated circuit device can be determined only by the dimensions of the mold in which the sealing resin is filled. The dimensional accuracy of the external shape of the circuit device can be improved, and at the same time, the manufacturing cost of the integrated circuit device can be reduced.

Further, the structure in which the outer peripheral end surface of the insulating substrate protrudes into the sealing resin more firmly connects the insulating substrate and the sealing resin.

An information medium in which this integrated circuit device is incorporated into a flat metal substrate has improved positional accuracy of connection terminals with external devices, making it possible to easily connect the information medium and external devices, similar to integrated circuit devices. Additionally, reliability against external dust and moisture is improved. As the cost of the most expensive integrated circuit device as an information medium is reduced, the cost of the information medium is also reduced proportionately. The metal substrate protects the integrated circuit device from external stress, and the metal substrate is stamped, etched, or pressed to create a semi-permanent symbol, such as the name of the owner of the information medium, the place of publication, the date of publication, and the like. A number, expiration date, etc. can be engraved, and the owner of the information medium, expiration date, etc. can be visually identified without operating the internal IC chip. Further, a second recess is formed in the metal base at a position opposite to the first recess, and a label with a desired design or decoration is embedded in the second recess. Therefore, the adhesive surface between the label and the metal base is protected from external impact outside the second recess, and the label is not easily peeled off.

Embodiment An embodiment of the integrated circuit device and information medium of the present invention will be described below with reference to FIGS. 1 and 2. 1A and 1B are a plan view from the front side of an information medium showing an embodiment of the present invention, and a plan view from the back side of the same, and FIG. 2 is a plan view of an integrated circuit device and an information medium showing an embodiment of the present invention. FIG. In FIG. 1, 20 is an information medium, 1 is an integrated circuit device, and 3
21 is a terminal pattern exposed on the surface of the integrated circuit device 1;
is a metal base, 22 is a symbol engraved on the metal base 21, 23
24 is a label adhered to the surface of the metal base 21, and 24 is a decoration formed on the label 23. In FIG. 2, 2 is an insulating substrate, 5 is a circuit pattern, 7 is an IC chip that processes or stores data, and 8 is the circuit pattern 5 and the IC chip 7.
9 is a sealing resin, 12 is a lead portion, and 25 is a first recess formed in the metal base 21.

First, the integrated circuit device 1 of this embodiment will be explained. The insulating substrate 2 is a single layer glass epoxy substrate. A hard gold-plated terminal pattern 3 is formed on the first surface 4 of the insulating substrate 2, and a soft gold-plated circuit pattern 5 is formed on the second surface 6 of the insulating substrate 2. , the terminal pattern 3 and the circuit pattern 5 are electrically connected to each other through a through hole 10. Second surface 6 of insulating substrate 2
, a lead portion 12 for plating the terminal pattern 3 and the circuit pattern 5 is extended to the end surface of the outer peripheral portion of the insulating substrate 2. The terminal pattern 3 consists of five connecting terminals 3a, 3b3c, 3d, and 3e arranged concentrically, and the IC chip 7 operates by these five connecting terminals. Therefore, the circuit pattern 5. which is electrically connected to the terminal pattern 3.
Five independent patterns are formed on both the lead portions 12. Connecting terminals 3e for ground potential are arranged on the outermost connecting terminals to protect the IC chip 7 from abnormal voltages such as external static electricity. The IC chip 7 has a planar dimension of I.
It is fixed onto a circuit pattern 5 larger than the C chip 7 with an insulating adhesive 11, and the IC chip 7 and the circuit pattern 5 are electrically connected by a thin metal wire 8.

The sealing resin 9 covers the IC chip 7 on the second surface 6, and the outer periphery of the sealing resin 9 extends beyond the outer periphery of the insulating substrate 2, and the lead portion 12 and The end face of the outer periphery of the insulating substrate 2 is covered, and the end face of the outer periphery of the insulating substrate 2 protrudes into the sealing resin 9. In this way, the integrated circuit device 1 of this embodiment has a terminal pattern 3 used as a connection terminal with an external device formed on the first surface 4, and a circuit pattern that is electrically connected to the terminal pattern 3 through the through hole 10. 5 formed on a second surface 6; an IC chip 7 mounted on the second surface 6 of the insulating substrate 2 and electrically connected to the circuit pattern 5 by a thin metal wire 8; I on the second surface 6 of the substrate 2
The sealing resin 9 covers the C chip 7.
The outer periphery of the insulating substrate 2 extends outward from the outer periphery of the insulating substrate 2, and this extended portion covers the end face of the outer periphery of the insulating substrate 2 and the lead portion 12. Therefore, since the lead parts 12 of this integrated circuit device 1 are covered, the lead parts 12 will not rust and corrode or damage the terminal patterns 3 and the circuit patterns 5, and the outer peripheral part of the sealing resin 9 will not rust. The IC chip 7 operates normally even if conductive dust or foreign matter adheres to it. Since the external shape of the integrated circuit device 1 is determined by the shape of the sealing resin 9, the thickness and planar dimensions of the integrated circuit device 1 are close to the dimensional accuracy of the mold for molding the sealing resin 9. A protrusion 13 is formed on the bottom surface of the sealing resin 9, and a recess 14 is formed on the outer periphery of the sealing resin 9 to ensure dimensional accuracy in the thickness direction of the information medium in which the integrated circuit device 1 is incorporated. Additionally, when the integrated circuit device 1 is assembled into a plastic card or a metal substrate using an adhesive, excess adhesive is absorbed into the recess 14 to prevent the adhesive from flowing out.

Next, an embodiment of the information medium of the present invention will be described with reference to FIG. In the information medium 20 of the embodiment, the integrated circuit device 1 is buried in a first recess 25 formed in a metal base 21 with the second surface 6 of an insulating substrate 2 facing downward, and the terminal pattern 3 is exposed on the surface. It is something. The first recess 25 is circular and has the same size as the integrated circuit device 1 . In the integrated circuit device 1, the adhesive 27 is placed at a position where the terminal pattern 3 is set back approximately 0.1 m11 from the lower end surface 26a of the metal base 21.
to prevent the terminal pattern 3 from being damaged. Protrusion 13 of sealing resin 9
collides with the metal base 21 at the bottom of the first recess 25, and almost no adhesive 27 exists between the protrusion 13 and the metal base 21. Therefore, the thickness of the adhesive 27 is determined by the amount of protrusion of the protrusion 13 from the bottom surface of the sealing resin 9, and the thickness of the adhesive 27 becomes a constant value, and the amount of retraction of the terminal pattern 3 from the lower end surface 26a is determined by the amount of protrusion from the bottom surface of the protrusion 13. It can be controlled with high precision. Adhesive 27 is applied in an amount larger than necessary to form a predetermined thickness of the adhesive layer to ensure stability of adhesion between integrated circuit device 1 and metal substrate 21, and unnecessary adhesive 27 is removed. It is absorbed into a recess 14 formed on the outer periphery of the sealing resin 9.

A second recess 28 is formed on the side opposite to the first recess 25 of the metal base 21, and a label 23 with a decoration 24 symbolizing the system using the information medium 20 is placed in the second recess 2.
It is buried in 8. The adhesive surface between the label 23 and the metal base 21 is protected from external impact by the metal base 21 inside the second recess 28, so that the label 23 is not easily peeled off. As shown in FIG. 1, a semi-permanent symbol 22 such as the name of the owner of the information medium, the date of issue, the issue number, and the expiration date is engraved on the lower end surface 26a of the metal base 21 by stamping, etching, or press processing, as shown in FIG. However, it is possible to visually identify the owner, expiration date, etc. of an information medium without inserting the information medium into a reading device. In the information medium 20 having such a configuration, the dimensional accuracy of the integrated circuit device 1 is improved, the positional accuracy of the connection terminal with an external device is improved, and the information medium 20 and the external device can be easily connected. Further, the metal base 21 and the integrated circuit device 1 are easily electrically insulated, and like the integrated circuit device 1, reliability against dust and moisture is improved. If the cost of the integrated circuit device 1, which is the most expensive among the constituent members of the information medium 20, is reduced, the cost of the information medium 2 will be reduced in proportion to this.
The cost of 0 is also reduced. The metal base 21 protects the integrated circuit device 1 from external stress, the engraved symbol 22 allows identification of the owner, and the label 23 serves as a decoration, allowing the information medium 20 to be carried alone.

Next, a method of manufacturing the integrated circuit device 1 and the information medium 20 of the embodiment will be described with reference to the drawings. Figure 3a
, b is a plan view from the front and back of the insulating substrate 2 on which the terminal pattern 31 and circuit pattern 5 are formed, and FIG. 4 is a plan view of the IC chip 7.
FIGS. 5a, 5b, and 5c show a plan view and a side view of the completed integrated circuit device 1 from the front and back sides, respectively, of the insulating substrate 2 on which the insulating substrate 2 is mounted. FIGS. 6a and 6b are plan views of the metal base 21 and its A-B
FIG. First, 18 μm copper foil is laminated on both the front and back sides of a large-area sheet-like insulating substrate with a thickness of about 0.4 mm, through holes 10 are formed at predetermined positions, and the copper foil on the front and back sides of this insulating substrate 18 is laminated. The conductivity of the foil is established, and the copper foil is etched to form a terminal pattern 3 on the first surface 4 and a circuit pattern 5 on the second surface 6. A lead portion 12 is formed, and nickel of about 10 μm is electrolytically plated on the terminal pattern 31 and circuit pattern 5 through the lead portion 12. Thereafter, on the second surface 6, the circuit pattern 5. Lead part 12
is protected with an insulating material, and hard gold is applied to the terminal pattern 3.
After plating about 5 μm, this insulating material is peeled off. Similarly, the terminal pattern 3 on the first surface 4 is protected with an insulating material, the circuit pattern 5 is plated with soft gold to a thickness of about 0.3 μm, and this insulating material is peeled off. As the insulating material, either adhesive tape or photoresist may be used as long as the properties are not affected even when immersed in a plating bath. Next, this sheet-shaped insulating substrate is punched out to form a circular insulating substrate 2 with a diameter of about 24 mm, and a frame portion 3.
0. A support portion 31 for fixing the insulating substrate 2 to the frame portion 30 and a reference hole 32 to be used in a later manufacturing process are formed. In this way, a long insulating substrate 33 is completed in which a plurality of insulating substrates 2, each having a terminal pattern 3 formed on the first surface 4 and a circuit pattern 5 formed on the second surface 6, are connected. Figure 3 a, b).

Next, a heat-resistant masking tape (not shown) is pasted on the first surface 4 to close the gap 34 between the insulating substrate 2 and the frame 30. Then, with the second surface 6 facing up, the IC chip 7 is bonded and fixed onto the circuit pattern 5 with an insulating adhesive 11.
The electrode and the circuit pattern 5 are connected by a thin metal wire 8 (FIG. 4). The heat-resistant masking tape used is, for example, a polyimide film of 50 .mu.m coated with an adhesive of about 20 .mu.m thick. Next, this insulating substrate 33 is mounted on a mold of a transfer molding machine, and the sealing resin 9 is filled into a predetermined shape. The shape of the sealing resin 9 at this time is shown by the dotted line in FIG. Each part indicated by a dotted line in FIG. 4 is as follows: 35 is an introduction part for the sealing resin 9 provided on the support part 31 of the second surface 6, 36 is an injection port, and 37 is for removing air from inside the mold. The discharge port 38 is a contour line of the sealing resin 9 extending outward from the end surface of the outer periphery of the insulating substrate 2. The lower mold is substantially flat, and the upper mold has a cavity for molding the integrated circuit device 1 into a predetermined shape. When transfer molding the sealing resin 9, the lower mold is brought into contact with the above-mentioned masking tape, and the upper mold is placed at a 90 degree angle with a part of the support part 31, and the insulating substrate 2 is While holding down the four places with the holding part 39 which is a part, on the outside of the contour line 38, the gap 34
The exposed masking tape is sandwiched between the upper and lower molds.

In this way, the insulating substrate 2 and the masking tape are pressed between the upper and lower molds, and the inside of the mold is filled with the sealing resin 9.
A plurality of package units are formed on a long insulating substrate 33. If the introduction part 36 is removed, the masking tape is peeled off, and the support part 31 is cut and separated into individual package units, the thickness will be 1 and 2 as shown in FIG. 5 a, b, and c.
mn+, a disk-shaped integrated circuit device 1 having a diameter of about 25 mm is completed. Since the sealing resin 9 is also filled in the gap between the first surface formed by the thickness of the terminal pattern 3 and the masking tape, a structure is created in which the outer peripheral end surface of the insulating substrate 2 protrudes into the sealing resin 9, and the insulation The substrate 2 and the sealing resin 9 are bonded more firmly. At this time, since the terminal pattern 3 is protected and covered with the masking tape, the sealing resin 9 does not wrap around onto the terminal pattern 3. Furthermore, since the sealing resin 9 is formed outside the outer circumference of the insulating substrate 2, the lead portion 12 and its cut surface are completely insulated and protected by the sealing resin 9, and the integrated circuit device 1 is completely insulated and protected. The dimensional accuracy of the external shape is improved. Moreover, by using such a manufacturing method, a single-layer, flat insulating substrate 2 can be used, and the manufacturing cost of the integrated circuit device 1 can be reduced.

In the method for manufacturing the information medium 20 of the embodiment, the integrated circuit device 1 shown in FIG. 5 is assembled into a metal substrate 21 shown in FIG. 6 to manufacture the information medium 20. First, the metal base 21 will be explained. Thickness is 0.
A first recess 2 is formed on one surface by cutting a disc-shaped metal base 21 made of brass with a diameter of about 5 mm and a diameter of about 30 mm.
5 is formed in the second recess 28 on the other surface, and the metal base 2
Plate the surface of 1 with decorative hard gold. The first recess 25 has a circular planar shape similar to that of the integrated circuit device 1, and its depth is approximately 0.1+nm larger than the thickness of the integrated circuit device 1, and the second recess 28 has a circular planar shape. Or it is rectangular and its depth is 0.1 less than the thickness of the label 23.
It is about mm large. Next, with the first recess 25 facing upward, a small amount of Epoquin adhesive 27 is applied to the bottom surface of the first recess 25 using a dispenser, and then the integrated circuit device 1
is inserted into the first recess 25, and the integrated circuit device 1 is pressurized from above the terminal pattern 3 for a certain period of time, so that the protrusion 13 butts against the metal base 21 on the bottom of the first recess. After applying pressure, the adhesive 27 is cured. The adhesive 27 is applied in an amount larger than that required to form an adhesive layer of a predetermined thickness, and the terminal pattern 3 is pressed to absorb the excess adhesive 27 into the annular recess 14 of the integrated circuit device 1. For this reason, the adhesive 27
Even if the amount of adhesive 27 to be applied is not controlled with strict precision, the excess adhesive 27 will not get around to the surface of the terminal pattern 3. Next, the label 23 is adhered to the bottom surface of the second recess 28 with the second recess 28 facing upward. The adhesive surface between the metal base 21 and the label 23 is protected from external impact inside the second recess 28 and will not be easily peeled off. label 2
Step 3 is to screen print a desired pattern, character, design, or other decoration 24 on the surface of the aluminum plate, apply transparent acrylic resin on top of this to form a protective layer, and then apply an adhesive sheet to the back of the aluminum plate. After pasting it on, it is punched out into a predetermined shape. Because the label 36 is made of a large sheet-like aluminum plate with roughened front and back surfaces,
Decorations 24 can be printed in large quantities and inexpensively, similar to conventional plastic cards.

Next, laser processing is performed on the lower end surface 26a of the metal base 21 to engrave symbols 22 such as the issuer, expiration date, owner, serial number, etc. of the information medium 20, and the IC chimp 7 is initialized to a usable state. Then, the information medium 20 of the embodiment is completed.

When a die-cast alloy is used as the metal base 21, the metal base 21 is formed by a mold, and when a cupronickel or the like is used as the metal base 21 like a coin, conning press processing is performed.

The label 23 can be made by directly etching or pressing the surface of a sheet-like aluminum plate to provide a high-quality decoration 24 to improve the added value of the information medium 20. Further, if heat resistance is required, the label 23 is adhered to the metal base 21 using a thermosetting adhesive instead of an adhesive. The symbol 22 for individually identifying the information medium 20 is the lower end surface 26a of the metal base 21 as in the embodiment.
Instead, the upper end surface 26b and the outer end surface 26c can also be engraved.

Such an information medium 20 is inserted into and ejected from a reading device in the same way as a coin, and when exchanging data with the information medium 20, it is read as the terminal pattern 3 using the end surfaces 26a26b, 26c of the metal base 21 as reference surfaces. The connection bin of the device is connected. The terminal patterns 3 arranged concentrically connect the reading device and the information medium 20 regardless of the direction in which the information medium 20 is inserted. When the information medium 20 is used in a closed system, for example, a cashless system at a leisure land, a limit on the amount of money that can be used and a secret number are set in the information medium 20, and the information medium 20 can be used when purchasing souvenirs at a shop. After confirming whether the information medium is a suitable information medium using the secret number, the price is subtracted from the information medium 20. If the usage amount exceeds the limit, either pay the shortfall in cash or pay cash according to the initial setting.
Initialize to 0. Even if the user does not buy souvenirs, by inserting the information medium 20 into the reading device, the user can check the prices of the five souvenir items purchased so far and the amount of money that can be used from now on using the information medium 20.

Effects of the Invention As described above, in the integrated circuit device of the present invention, the outer circumferential portion of the sealing resin covering the IC chip is extended beyond the outer circumference of the insulating substrate, and the end face of the outer circumferential portion of the insulating substrate is covered with this extended portion. The structure is such that the lead part for plating is covered and the outer shape of the sealing resin is formed using a mold, which improves the accuracy of the planar dimensions and thickness dimensions of the integrated circuit device, and improves reliability against external dust and moisture. improves. Furthermore, the information medium of the present invention in which this integrated circuit device is incorporated into a metal base similarly has improved reliability against external dust and moisture, improved dimensional accuracy of its external shape, and improved positional accuracy of connection terminals of the information medium. can ensure good connection with external devices. In addition, the information medium, which has a compact shape like a coin and has a decorated label, not only allows you to use the memory and security functions of the built-in IC chip, but also has excellent portability and can be used as a pendant. Decorative items such as or keychains,
It can also be used as a souvenir or a practical item.

[Brief explanation of the drawing]

Figures 1a and b are a plan view and a back view of an information medium showing an embodiment of the present invention, and Figure 2 is an integrated circuit device showing an embodiment of the present invention and an information medium incorporating this integrated circuit device. Cross-sectional view, Figures 3a and b are a plan view and back view of the insulating substrate, Figure 4 is a plan view of the insulating substrate on which an IC chip is mounted, and Figures 5a and b
, c are a plan view, a back view, and a side view of an information medium completed by the manufacturing method of the example, and FIGS. A-H
FIG. 7 is a cross-sectional view of a conventional integrated circuit device. 1... Integrated circuit device, 2... Insulating substrate, 3... Terminal pattern, 5... Circuit pattern, 7... IC chip , 9... Sealing resin, 12... Lead part, 20... Information medium, 21... Metal base, 22...
Symbol, 23... Label, 24... Decoration, 25... First recess.

Claims (3)

[Claims] (1) A flat insulating substrate having a first surface formed with a terminal pattern used as a connection terminal with an external device, and a second surface having a circuit pattern electrically connected to the terminal pattern; An IC chip mounted on the second surface of the insulating substrate and electrically connected to the circuit pattern by a connecting body, and a sealing resin covering the IC chip on the second surface of the insulating substrate, In the integrated circuit device, the outer circumferential portion of the sealing resin extends beyond the outer circumference of the insulating substrate, and the extended portion covers an end surface of the outer circumferential portion of the insulating substrate. (2) The integrated circuit device according to claim 1, wherein the end face of the outer periphery of the insulating substrate protrudes into the sealing resin. (3) An information medium in which the integrated circuit device according to claim 1 is embedded in a first recess formed in a flat metal base with the second surface of the insulating substrate facing downward.