JPH0316364U - - Google Patents
Info
- Publication number
- JPH0316364U JPH0316364U JP1990067322U JP6732290U JPH0316364U JP H0316364 U JPH0316364 U JP H0316364U JP 1990067322 U JP1990067322 U JP 1990067322U JP 6732290 U JP6732290 U JP 6732290U JP H0316364 U JPH0316364 U JP H0316364U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- light source
- pumping light
- semiconductor pumping
- temperature sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 10
- 230000005679 Peltier effect Effects 0.000 claims description 2
- 238000005086 pumping Methods 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000002826 coolant Substances 0.000 claims 2
- 239000012212 insulator Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Description
第1図は本考案の1実施例の冷却装置の平面図
、第2図は第1図の−線に沿つた断面図、第
3図は第1図の−線に沿つた断面図である。 11……レーザダイオード、12……ダイオー
ド冷却板、12d……線材、12k……接触板、
12o……表面、13……電流供給部、13s…
…ねじ、14……冷却体、23i……絶縁体、2
4a……切欠、24k……冷却通路、24t……
温度センサ、25……電流供給部、26……ペル
チエ効果素子、27……基板、27k……冷却通
路、34d……パツキン板。
、第2図は第1図の−線に沿つた断面図、第
3図は第1図の−線に沿つた断面図である。 11……レーザダイオード、12……ダイオー
ド冷却板、12d……線材、12k……接触板、
12o……表面、13……電流供給部、13s…
…ねじ、14……冷却体、23i……絶縁体、2
4a……切欠、24k……冷却通路、24t……
温度センサ、25……電流供給部、26……ペル
チエ効果素子、27……基板、27k……冷却通
路、34d……パツキン板。
Claims (1)
- 半導体ポンピング光源のための冷却装置であつ
て、半導体ポンピング光源11が冷却体14上に
配置されており、この冷却体14が温度センサ2
4tを備えていてペルチエ効果素子26に結合さ
れている形式のものにおいて、冷却体14が付加
的に冷却媒体のための冷却通路24kを備えてい
ることを特徴とする半導体ポンピング光源のため
の冷却装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8908049U DE8908049U1 (de) | 1989-07-01 | 1989-07-01 | Kühleinrichtung für Halbleiterpumplichtquellen |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0316364U true JPH0316364U (ja) | 1991-02-19 |
Family
ID=6840691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990067322U Pending JPH0316364U (ja) | 1989-07-01 | 1990-06-27 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5031184A (ja) |
JP (1) | JPH0316364U (ja) |
DE (1) | DE8908049U1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002026434A (ja) * | 2000-07-12 | 2002-01-25 | Mitsubishi Electric Corp | 半導体レーザ励起固体レーザ装置 |
WO2002035666A1 (en) * | 2000-10-20 | 2002-05-02 | Mitsubishi Denki Kabushiki Kaisha | Cooler, semiconductor laser light source, semiconductor laser light source unit, method for producing semiconductor laser light source unit, and solid laser |
JP2014154851A (ja) * | 2013-02-13 | 2014-08-25 | Fujikura Ltd | 半導体レーザ装置 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3925201A1 (de) * | 1989-07-29 | 1991-02-07 | Messerschmitt Boelkow Blohm | Optische bank zur halterung optischer, elektrischer u.a. komponenten |
US5195102A (en) * | 1991-09-13 | 1993-03-16 | Litton Systems Inc. | Temperature controlled laser diode package |
US5253260A (en) * | 1991-12-20 | 1993-10-12 | Hughes Aircraft Company | Apparatus and method for passive heat pipe cooling of solid state laser heads |
US5469454A (en) * | 1994-05-02 | 1995-11-21 | University Of Central Florida | Mode locked laser diode in a high power solid state regenerative amplifier and mount mechanism |
JP3596029B2 (ja) * | 1994-06-06 | 2004-12-02 | 住友電気工業株式会社 | 半導体レーザモジュール |
FR2741208B1 (fr) * | 1995-11-13 | 1997-12-05 | Commissariat Energie Atomique | Assemblage de barrettes de diodes laser refroidies |
US6240116B1 (en) | 1997-08-14 | 2001-05-29 | Sdl, Inc. | Laser diode array assemblies with optimized brightness conservation |
GB9720376D0 (en) * | 1997-09-26 | 1997-11-26 | Marconi Gec Ltd | A semi-conductor laser diode bar assembly |
US6014391A (en) * | 1997-12-19 | 2000-01-11 | Raytheon Company | Thermally improved slab laser pump cavity apparatus with integral concentrator and method of making same |
US20020110166A1 (en) * | 2001-02-14 | 2002-08-15 | Filgas David M. | Method and system for cooling a laser gain medium |
US6496118B1 (en) * | 2001-09-11 | 2002-12-17 | Warren L. Smith | Computer chip heat protection apparatus |
JP4285447B2 (ja) * | 2005-06-20 | 2009-06-24 | セイコーエプソン株式会社 | レーザ光源装置、表示装置およびプロジェクタ |
US20100018316A1 (en) * | 2008-07-24 | 2010-01-28 | United Technologies Corporation | NSMS flight laser detector cooling system |
CN109690884A (zh) | 2016-09-12 | 2019-04-26 | 厦门超旋光电科技有限公司 | 具有激光阵列照明的系统和装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5414180A (en) * | 1977-07-05 | 1979-02-02 | Canon Inc | Semiconductor laser unit |
JPS6029239B2 (ja) * | 1977-10-07 | 1985-07-09 | キヤノン株式会社 | 半導体レーザ素子の温度制御装置 |
DE3706635A1 (de) * | 1987-03-02 | 1988-09-15 | Spindler & Hoyer Kg | Verfahren zur stabilisierung der frequenz einer laserdiode unabhaengig vom diodenstrom |
-
1989
- 1989-07-01 DE DE8908049U patent/DE8908049U1/de not_active Expired
-
1990
- 1990-06-27 JP JP1990067322U patent/JPH0316364U/ja active Pending
- 1990-06-29 US US07/545,707 patent/US5031184A/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002026434A (ja) * | 2000-07-12 | 2002-01-25 | Mitsubishi Electric Corp | 半導体レーザ励起固体レーザ装置 |
WO2002035666A1 (en) * | 2000-10-20 | 2002-05-02 | Mitsubishi Denki Kabushiki Kaisha | Cooler, semiconductor laser light source, semiconductor laser light source unit, method for producing semiconductor laser light source unit, and solid laser |
JP2014154851A (ja) * | 2013-02-13 | 2014-08-25 | Fujikura Ltd | 半導体レーザ装置 |
Also Published As
Publication number | Publication date |
---|---|
DE8908049U1 (de) | 1989-08-24 |
US5031184A (en) | 1991-07-09 |