JPH03160796A - Mounting method for electronic component - Google Patents

Abstract

PURPOSE:To shorten the entire length of a pattern, and to reduce the mounting area of an electronic component by using an auxiliary board formed with a conductive pattern corresponding to terminals of the components in a frame having a space for containing the body of the component at its center, alternately stacking a plurality of the boards and the components, and bringing them into pressure contact by a holder to integrate them. CONSTITUTION:A space 7 for containing a body of an electronic component 1 and a frame 8 for placing the terminal of the component 1 at the periphery of the space 7 are provided. A conductive pattern 9 corresponding to the specific terminal of the component 1 is formed at least at one side of the frame 8, allowed to protrude from the outer periphery as an external connection terminal 10, and an auxiliary board 2 of a structure in which the patterns 9 corresponding to the other terminals are formed on both front and rear surfaces of the frame 8 and connected therebetween via through holes is employed. In the case of mounting, a plurality of the boards 2 and the components 1 are alternately stacked, brought into pressure contact with each other and integrated. Thus, the entire length of the pattern for connecting is shortened, and an arbitrary number of the components can be mounted in the mounting area of one component.

Description

[Detailed Description of the Invention] Industrial Application Fields The present invention is directed to a device in which electronic components having a 7-latt Paceno type or a similar shape having a plurality of terminals protruding laterally around the main body are laminated. Regarding how to implement.

Advanced technology> Figure 3 shows an example of a memory circuit using multiple memory ICs. 21u to 21d are memory I
C, 22 is a data path, 23 is an address bus, 24 is C
PU, 25 is a memory select circuit, 26a - 26c
1 is a select terminal, which is a circuit that selects an arbitrary memory IC by a select signal and inputs and outputs data individually.

Figure m4 shows the typical connection method when constructing such a circuit, and the data terminals, address terminals, and control terminals of each memory IC 21a to 21d should be connected to each other by connecting terminals with the same number that correspond to each other. The data bus 22 and the address bus 23 or the control circuit 27 are connected to the CPU 24 at once, and the select terminals 7-26a to 26d are each independently connected to the memory select circuit 25, and the memory select circuit 25 is connected to the address bus 23. It is connected to and controlled by the CPU 24.

<Problem to be solved by the invention> In the connection method as shown in Fig. 4, each memory IC21a to 21tJ can be separated horizontally and each terminal connected in a predetermined pattern when mounted on a printed circuit board. As a result, all the parts of the pattern become red, which often picks up noise and causes malfunctions, and the area required for the two-dog arrangement becomes too large.

This invention abbreviates these Ifjl titles, -4, shortens all the patterns of the pattern, and moreover, allows the required number of elec-
This was done for the purpose of making it possible to implement one part.

Means for Solving the Problems The present invention is directed to stacking and mounting electronic components having a plurality of terminals protruding laterally around the periphery of a main body, and achieves the above-mentioned objects. In order to do this, the main body of the electronic component is housed in a space, and the terminal of the electronic component is placed around this space. A conductive pattern corresponding to each other terminal is formed on at least one side of the frame-shaped part and protruded from the outer periphery to serve as an external connection terminal, and conductive patterns corresponding to the other terminals are formed on both the front and back sides of the frame-shaped part and through holes are formed between them. We are trying to use an auxiliary board with a structure connected by . When mounting, a plurality of these auxiliary boards and electronic components are stacked alternately and integrated in a state in which they are pressed together with a holder, and the specific terminals of each 'Ki1 component are independent, and depending on the IT. The other terminals are connected to each other and a plurality of electronic components are stacked in 8lt layers.

Since the specific terminals of each electronic component are in an independent state, the human output of the member W is performed independently, and for each terminal of the pond, each corresponding terminal is They are all connected in parallel, making it possible to output the same signal at the same time. Furthermore, since the electronic components are stacked, the mounting area does not increase even if the number of electronic components increases.

Therefore, when configuring a memory circuit as shown in Figure 3 above, if the select terminal of the memory IC is designated as a specific terminal and this part is used as an external connection terminal, the memory IC can be connected to a memory circuit with a fixed mounting area. This makes it easy to arbitrarily increase or decrease the number of implementations and change the memory capacity as appropriate.

<Example> Next, an illustrated example will be described. Figure f:lS1 is a cross-sectional view of a state in which electronic components are mounted according to the present invention,
FIG. 2 is a perspective view of an auxiliary substrate used for lamination.

In the figure, 1 is a memory IC, 2 is an auxiliary board, 3 is a printed circuit board on which the memory ICI is mounted, and 4 is a holder. The memory ICI has a shape that includes a terminal 6a and a plurality of terminals 6b that protrude laterally from VdU'r of the main body 5. The auxiliary board 2 also has a space 7 of a size and shape corresponding to the main body 5 of the memory ICI, and this space 7.
The conductive pattern 9 is formed in the frame part 8 to correspond to all the terminals of the memory IC 1, and the conductive patterns 9 correspond to the select terminals 6a of the memory IC 1. The conductive pattern 9 is provided only on the surface, and the pattern and the substrate are slightly protruded from the outer periphery of the frame portion 8 to form an external connection terminal 10.

Further, conductive patterns 9 corresponding to the other terminals 6b are formed on both the front and back surfaces of the frame portion 8 and are connected to each other by through holes 11. Note that conductive patterns 12a and 12b are formed on the surface of the printed circuit board 3 at positions where the memory ICI is mounted in accordance with the terminal arrangement.

When mounting the memory ICI, first place the first memo +7-IC1 at a predetermined position on the printed circuit board 3,
Place the Sodesuke board 2 on top of it in the specified direction (note +7 at 1).
- Each terminal 6a of IC1. Place the frame portion 8 of the auxiliary board 2 on top of the 6b. At this time, memo +7 - IC
1's main body 5 is located within the space 7 of the auxiliary board 2 and does not interfere with the opening of the auxiliary board 2. Furthermore, on top of this, PtS
A predetermined number of memory ICIs and the auxiliary board 2 are stacked alternately, such as placing 2 memory ICIs and another auxiliary board 2 on top of it.Finally, the holder 4 is printed while pressurizing the entire holder 4. It is fixed to the substrate 3. As a result, the select terminals 6a of each memory IC 1 are connected to the external connection terminals 10 protruding laterally, and the other terminals 6b are connected to each other via the electrostatic pattern 9 and the through hole 11. The two parts are pressed against each other and are connected to each other.

Therefore, the terminals 6b of each memory ICI are connected to the printed circuit board 7 and the predetermined conductive pattern 12L+ of the board 3, and for example, connection to the data bus 22 or address bus 23 in FIG. 3 can be made all at once. Become. In addition, the select terminal 6a of the memory IC1 of the lowest tPJ1 is in contact with the conductive pattern 12u of the printed circuit board 3.
&, and the select end of other memory ICI -
f-Ga has a lead wire 13 to each external connection terminal 10.
By wiring, the connection to the memory select circuit 25 in FIG. 3 is made individually via the conductive pattern 12a or lead #i13, and the select signal for selecting the memory ICI is sent to each memory ICI independently. It is possible.

In addition, the Holgu 4 is not only capable of fixing the memory ICI.
The fixing of the holder 4 to the printed circuit board 3, which also has the effect of covering and protecting or reinforcing the outside, is as follows:
For example, connect the claw 14 of the holder 4 to the locking hole 1 of the printed circuit board 3.
This is done by inserting it into the substrate 5 and attaching it to the substrate 3. In addition, in FIG. 1, the main body 5 of the memory C1 in the most I unit part is held down by the holder 4, but the terminal part may be held together with the main body 5, or only the terminal part may be held down, depending on the shape of the holder 4. The size may be appropriately selected depending on the shape of the terminal portion of the electronic component where t=t east, the number of stacked parts, etc.

<Effects of the Invention> As is clear from the above-mentioned embodiments, the present invention includes a frame portion around a space in which the main body of the power-on part is housed, on which the terminal of the power-on part IW+ is placed. Using an auxiliary board with a structure in which a conductive pattern corresponding to each terminal of the electronic component is formed on this frame-shaped part, the auxiliary board and electronic components are stacked alternately and integrated by being pressed together with a holder. It was designed to do so.

Therefore, by stacking a plurality of electronic components of the same shape, specific terminals that should be wired individually can be made independent, and terminals that should be wired all at once. It is now possible to mount multiple electronic components in a state where they are connected to each other, making it relatively easy to mount multiple electronic components, and reducing the overall length of the connection pattern to reduce noise pickup. This eliminates the possibility of malfunctions or malfunctions, and almost eliminates the need for electronic components.
It becomes possible to mount an arbitrary number of electronic components in a mounting area of 1,000 yen, which facilitates miniaturization of electronic circuits.

[Brief explanation of the drawing]

Figure PttJ1 is a cross-sectional view of a state in which electronic components are mounted according to an embodiment of the present invention, Figure 2 is a perspective view of an auxiliary board used for lamination, and Figure 3 is a
FIG. 4, a block diagram of an example of a memory circuit using a plurality of memory ICs, is a wiring diagram showing a method of close contact when the circuit of FIG. 3 is used. DESCRIPTION OF SYMBOLS 1... Memory IC, 3... Printed circuit board, 5... Main body 7... Space 9... Conductive pattern, 11... Through hole 2... Auxiliary board 4... Holder 6a , 6b...Terminal 8...Frame-shaped part 10...External connection terminal

Claims (1)

[Claims] 1. A method of stacking and mounting electronic components each having a shape that includes a plurality of terminals protruding laterally around the main body. A conductive pattern corresponding to a specific terminal of the electronic component is formed on at least one side of the frame-like part and protrudes from the outer periphery to serve as an external connection terminal, and a conductive pattern corresponding to a specific terminal of the electronic component is formed on at least one side of the frame-like part and protrudes from the outer periphery to serve as an external connection terminal. Using an auxiliary board with a structure in which corresponding conductive patterns are formed on both the front and back sides of the frame-shaped part and connected to each other through through holes, a plurality of these auxiliary boards and electronic components are stacked alternately and placed in a holder. It is characterized by stacking a plurality of electronic components by integrating them in a pressure-welded state, so that specific terminals of each electronic component become independent, and other corresponding terminals are connected to each other. How to mount electronic components.